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IXKT70N60C5

型号:

IXKT70N60C5

品牌:

LITTELFUSE[ LITTELFUSE ]

页数:

5 页

PDF大小:

148 K

Advanced Technical Information  
IXKT 70N60C5  
CoolMOS1) Power MOSFET  
ID25  
VDSS  
=
66A  
= 600V  
RDS(on) max = 0.045Ω  
N-Channel Enhancement Mode  
Low RDSon, High VDSS MOSFET  
Ultra low gate charge  
D
TO-268 AA  
G
G
q
D(TAB)  
S
S
Features  
MOSFET  
• fast CoolMOS™ 1) power MOSFET  
Symbol  
VDSS  
Conditions  
Maximum Ratings  
4th generation  
TVJ = 25°C  
600  
20  
V
- High blocking capability  
- Lowest resistance  
VGS  
V
- Avalanche rated for unclamped  
inductive switching (UIS)  
- Low thermal resistance  
due to reduced chip thickness  
• Enhanced total power density  
ID25  
ID90  
TC = 25°C  
TC = 90°C  
66  
46  
A
A
EAS  
EAR  
single pulse  
repetitive  
1950  
3
mJ  
mJ  
ID = 11 A; TC = 25°C  
dV/dt  
MOSFET dV/dt ruggedness VDS = 0...480 V  
50 V/ns  
Applications  
• Switched mode power supplies  
(SMPS)  
Symbol  
Conditions  
Characteristic Values  
(TVJ = 25°C, unless otherwise specified)  
• Uninterruptible power supplies (UPS)  
• Power factor correction (PFC)  
• Welding  
min. typ. max.  
RDSon  
VGS = 10 V; ID = 44 A  
40  
3
45  
mΩ  
• Inductive heating  
• PDP and LCD adapter  
VGS(th)  
IDSS  
VDS = VGS; ID = 3 mA  
2.5  
3.5  
10  
V
VDS = 600 V; VGS = 0 V  
TVJ = 25°C  
TVJ = 125°C  
µA  
µA  
50  
1) CoolMOS™ is a trademark of  
Infineon Technologies AG.  
IGSS  
VGS  
=
20 V; VDS = 0 V  
100  
190  
nA  
Ciss  
Coss  
VGS = 0 V; VDS = 100 V  
f = 1 MHz  
6800  
320  
pF  
pF  
Qg  
Qgs  
Qgd  
150  
35  
50  
nC  
nC  
nC  
VGS = 0 to 10 V; VDS = 400 V; ID = 44 A  
td(on)  
tr  
td(off)  
tf  
30  
20  
100  
10  
ns  
ns  
ns  
ns  
VGS = 10 V; VDS = 400 V  
ID = 44 A; RG = 3.3 Ω  
RthJC  
0.23 K/W  
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2009 IXYS All rights reserved  
20090209e  
1 - 4  
Advanced Technical Information  
IXKT 70N60C5  
Source-Drain Diode  
Symbol  
Conditions  
Characteristic Values  
(TVJ = 25°C, unless otherwise specified)  
min. typ. max.  
IS  
VGS = 0 V  
44  
A
VSD  
IF = 44 A; VGS = 0 V  
0.9  
1.2  
V
trr  
QRM  
IRM  
600  
17  
60  
ns  
µC  
A
IF = 44 A; -diF/dt = 100 A/µs; VR = 400 V  
Component  
Symbol  
Conditions  
Maximum Ratings  
TVJ  
Tstg  
operating  
-55...+150  
-55...+150  
°C  
°C  
Symbol  
Weight  
Conditions  
Characteristic Values  
min. typ. max.  
6
g
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2009 IXYS All rights reserved  
20090209e  
2 - 4  
Advanced Technical Information  
IXKT 70N60C5  
TO-247 AD Outline  
600  
500  
400  
300  
200  
100  
0
250  
140  
120  
100  
80  
10 V  
8 V  
8 V  
TJ = 25°C  
20 V  
=
VGS  
TJ = 150°C  
7 V  
10 V  
7 V  
200  
150  
100  
50  
6 V  
VGS  
=
20 V  
5.5 V  
6 V  
60  
5 V  
5.5 V  
40  
4.5 V  
5 V  
20  
4.5 V  
0
0
0
40  
80  
120  
160  
0
5
10  
15  
20  
0
5
10  
15  
20  
TC [°C]  
V
[V]  
V
[V]  
DS  
DS  
Fig. 1 Power dissipation  
Fig. 2 Typ. output characteristics  
Fig. 3 Typ. output characteristics  
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2009 IXYS All rights reserved  
20090209e  
3 - 4  
Advanced Technical Information  
IXKT 70N60C5  
0.16  
0.12  
0.08  
0.04  
0.12  
320  
280  
240  
200  
160  
120  
80  
ID = 44 A  
VGS = 10 V  
TJV = 150°C  
VDS > 2·RDS(on) max · ID  
25 °C  
5.5 V  
5 V  
=
VDS  
6 V  
6.5 V  
7 V  
0.1  
0.08  
20 V  
0.06  
98 %  
150 °C  
typ  
TJ =  
0.04  
0.02  
0
40  
0
0
0
20  
40  
60  
80  
100  
-60  
-20  
20  
60  
100  
140  
180  
0
2
4
6
8
10  
I D [A]  
T
j [°C]  
V
[V]  
GS  
Fig. 4 Typ. drain-source on-state  
resistance characteristics of IGBT  
Fig. 5 Drain-source on-state resistance  
Fig. 6 Typ. transfer characteristics  
10 3  
10 2  
10 1  
10 0  
10 5  
10 4  
10 3  
10 2  
10 1  
10 0  
12  
10  
8
ID = 11 A pulsed  
VGS = 0 V  
f = 1 MHz  
Ciss  
VDS = 50 V  
1 20 V  
40 0V  
150 °C, 98%  
25 °C  
TJ =150 °C  
Coss  
6
25 °C, 98%  
4
Crss  
2
0
0
0.5  
1
1.5  
2
0
50  
100  
[V]  
150  
200  
0
50  
100  
150  
V
[V]  
Q gate [nC]  
V
SD  
DS  
Fig. 7 Forward characteristic  
of reverse diode  
Fig. 8 Typ. gate charge  
Fig. 9 Typ. capacitances  
2000  
700  
660  
620  
580  
540  
1
ID = 11 A  
ID = 0.25 mA  
1500  
1000  
500  
R
R
2
1
2
0.1  
C
1 =τ1 /R  
C
2 =τ2 /R  
1
Ri  
τi  
0.029  
0.049  
0.093  
0.06  
0.0003  
0.0029  
0.06  
0.2  
1
0
0.01  
1000  
100  
10000  
20  
60  
100  
140  
180  
-60  
-20  
20  
60  
100  
140  
180  
10  
t
[ms]  
T
j [°C]  
T
j [°C]  
Fig. 10 Avalanche energy  
Fig. 11 Drain-source breakdown voltage  
Fig. 12 Max. transient thermal  
impedance  
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2009 IXYS All rights reserved  
20090209e  
4 - 4  
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently  
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,  
and may not be used in, all applications.Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.  
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