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5SLX12M3301

型号:

5SLX12M3301

描述:

快速二极管管芯[ Fast-Diode Die ]

品牌:

ABB[ THE ABB GROUP ]

页数:

3 页

PDF大小:

54 K

VRRM  
IF  
=
=
3300 V  
100 A  
Fast-Diode Die  
5SLX 12M3301  
x
Die size: 13.6 13.6 mm  
Doc. No. 5SYA1661-02 Feb. 05  
· Fast and soft reverse-recovery  
· Low losses  
· High SOA  
· Passivation: SIPOS Nitride plus Polyimide  
1)  
Maximum rated values  
Parameter  
Symbol Conditions  
min max Unit  
Repetitive peak reverse voltage  
Continuous forward current  
Repetitive peak forward current  
Junction temperature  
VRRM  
IF  
3300  
100  
200  
125  
V
A
IFRM  
Tvj  
Limited by Tvjmax  
A
-40  
°C  
1)  
Maximum rated values indicate limits beyond which damage to the device may occur per IEC 60747 - 2  
2)  
Diode characteristic values  
Parameter  
Symbol Conditions  
min  
Tvj = 25 °C 2.0  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
typ max Unit  
2.3  
2.35  
5
2.7  
V
V
Continuous forward voltage  
VF  
IR  
IF = 100 A  
µA  
mA  
A
Continuous reverse current  
Peak reverse recovery current  
Recovered charge  
VR = 3300 V  
2.5  
115  
140  
65  
7
Irr  
A
IF = 100 A,  
µC  
µC  
ns  
ns  
mJ  
mJ  
VR = 1800 V,  
di/dt = 550 A/µs,  
Ls = 1200 nH,  
Inductive load,  
Switch:  
Qrr  
trr  
110  
470  
800  
85  
Reverse recovery time  
2x 5SMX12M3300  
Reverse recovery energy  
Erec  
145  
2)  
Characteristic values according to IEC 60747 - 2  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
5SLX 12M3301  
200  
175  
150  
125  
100  
75  
250  
200  
150  
100  
50  
VCC = 1800 V  
di/dt = 550 A/µs  
Tvj = 125 °C  
25°C  
Ls = 1200 nH  
125°C  
Erec  
Irr  
Qrr  
50  
25  
0
0
0
0.5  
1
1.5  
2
2.5  
3
3.5  
4
0
50  
100  
150  
200  
250  
VF [V]  
IF [A]  
Fig. 1  
Typical diode forward characteristics  
Fig. 2  
Typical reverse recovery characteristics  
vs. forward current  
150  
100  
50  
2100  
1400  
700  
200  
175  
150  
125  
100  
75  
400  
VCC = 1800 V  
IF = 100 A  
di/dt = 550 A/µs  
Tvj = 125 °C  
VCC = 1800 V  
IF = 100 A  
350  
Tvj = 125 °C  
Ls = 1200 nH  
Ls = 1200 nH  
300  
250  
Irr  
0
0
200  
Erec  
150  
100  
50  
-50  
-100  
-150  
-700  
-1400  
-2100  
Qrr  
50  
25  
0
0
0
2
4
6
8
0
200  
400  
600  
800 1000 1200  
time [us]  
di/dt [A/µs]  
Typical diode reverse recovery behaviour  
Typical reverse recovery vs. di/dt  
Fig. 3  
Fig. 4  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
Doc. No. 5SYA1661-02 Feb. 05  
page 2 of 3  
5SLX 12M3301  
Mechanical properties  
Parameter  
Unit  
x
L W  
x
Overall die  
mm  
mm  
13.6 13.6  
exposed  
front metal  
x
Dimensions  
L W  
x
10.38 10.38  
thickness  
front (A)  
back (K)  
µm  
µm  
µm  
385 ± 15  
AlSi1  
4
3)  
Metallization  
Al / Ti / Ni / Ag  
1.2  
3)  
For assembly instructions refer to: IGBT and Diode chips from ABB Switzerland Ltd, Semiconductors, Doc. No. 5SYA 2033.  
Outline Drawing  
A (Anode)  
Note : All dimensions are shown in mm  
This product has been designed and qualified for Industrial Level.  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
ABB Switzerland Ltd  
Semiconductors  
Doc. No. 5SYA1661-02 Feb. 05  
Fabrikstrasse 3  
CH-5600 Lenzburg, Switzerland  
Telephone +41 (0)58 586 1419  
Fax  
+41 (0)58 586 1306  
Email  
Internet  
abbsem@ch.abb.com  
www.abb.com/semiconductors  
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