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WTD40N03

型号:

WTD40N03

描述:

表面贴装P沟道增强型功率MOSFET[ Surface Mount P-Channel Enhancement Mode POWER MOSFET ]

品牌:

WEITRON[ WEITRON TECHNOLOGY ]

页数:

6 页

PDF大小:

1357 K

WTD40N03  
Surface Mount P-Channel Enhancement  
Mode POWER MOSFET  
DRAIN CURRENT  
-15 AMPERES  
DRAIN  
3
P b  
Lead(Pb)-Free  
DRAIN SOURCE VOLTAGE  
-60 VOLTAGE  
1 GATE  
Features:  
*Super High Dense Cell Design For Low RDS(ON)  
2
SOURCE  
RDS(ON)<90m @VGS=-10V  
4
*Simple Drive Requirement  
*Lower On-resistance  
1
2
3
1. GATE  
2.4 DRAIN  
3. SOURCE  
*Fast Switching Characteristic  
*TO-252 Package  
D-PAK / (TO-252)  
Maximum Ratings(T =25 C Unless Otherwise Specified)  
a
Rating  
Symbol  
Value  
Unit  
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
30  
V
±±0  
Continuous Drain Current, (V @10V, TC=±5˚C)  
GS  
-±0  
-13  
ID  
, (V @10V, TC=100˚C)  
GS  
A
Pulsed Drain Current1  
IDM  
PD  
150  
50  
Total Power Dissipation(TC=±5˚C)  
W
RθJC  
RθJA  
±.5  
˚C/W  
Thermal Resistance Junction-case  
Thermal Resistance Junction-ambient  
Operating Junction and Storage Temperature Range  
110  
˚C/W  
˚C  
-55~+150  
TJ,Tstg  
WEITRON  
http:www.weitron.com.tw  
1/6  
12-Jul-07  
WTD40N03  
Electrical Characteristics(TA = 25℃ Unless otherwise noted)  
Characteristic  
Symbol Min  
Typ  
Max  
Unit  
Static  
Drain-Source Breakdown Voltage  
I =250µA,V =0  
30  
-
-
BVDSS  
D
GS  
V
Gate-Source Threshold Voltage  
1.0  
-
-
-
3.0  
VGS(Th)  
I =250µA,V =V  
D
DS GS  
Gate-Source Leakage current  
V = 20V  
GS  
100  
nA  
IGSS  
Drain-SourceLeakage Current(Tj=25˚C)  
-
-
-
-
25  
V =30V,V =0  
DS  
GS  
IDSS  
μA  
Drain-SourceLeakage Current(Tj=150˚C)  
V =24V,V =0  
250  
DS  
GS  
Static Drain-Source On-Resistance  
I =18A,V =10V  
-
-
18  
24  
21  
30  
D
GS  
RDS(on)  
mΩ  
I =14A,V =4.5V  
D
GS  
Forward Transconductance  
I =18A,V =10V  
gfs  
-
26  
-
S
D
DS  
Dynamic  
Input Capacitance  
-
800  
-
Ciss  
V =0V,V =25V,f=1.0MHz  
GS  
DS  
Output Capacitance  
V =0V,V =25V,f=1.0MHz  
-
-
380  
133  
-
-
pF  
Coss  
GS  
DS  
Reverse Transfer Capacitance  
Crss  
V =0V,V =25V,f=1.0MHz  
GS  
DS  
2/6  
12-Jul-07  
WEITRON  
http:www.weitron.com.tw  
WTD40N03  
Switching  
2
Turn-on Delay Time  
-
-
-
-
7.2  
60  
-
-
-
-
Td(on)  
Tr  
Td(off)  
Tf  
ID=18A,VDS=15A,VGS=10V,RG=3.3Ω,RD=0.83Ω  
Rise Time  
ID=18A,VDS=15A,VGS=10V,RG=3.3Ω,RD=0.83Ω  
ns  
Turn-off Delay Time  
ID=18A,VDS=15A,VGS=10V,RG=3.3Ω,RD=0.83Ω  
22.5  
10  
Fall Time  
ID=18A,VDS=15A,VGS=10V,RG=3.3Ω,RD=0.83Ω  
2
Total Gate CHarge  
-
-
-
17  
3
-
-
-
Qg  
Qgs  
Qgd  
ID=18A,VDS=24V,VGS=5V  
Gate-Source Charge  
ID=18A,VDS=24V,VGS=5V  
nC  
Gate-Drain (”Miller”) Change  
ID=18A,VDS=24V,VGS=5V  
10  
Source-Drain Diode Characteristics  
Forward On Voltage2  
-
-
-
-
1.3  
3-6  
V
A
A
VSD  
I =36A, VGS=0V,Tj=25˚C  
S
Continuous Source Current (Body Diode)  
VD=VG=0V,VS=1.3V  
-
-
IS  
1
150  
Pulsed Source Durrent (Body Diode)  
ISM  
Note: 1. Pulse width limited by safe operating area.  
2. Pulse width ≤ 300μs, duty cycle ≤ 2%.  
3/6  
12-Jul-07  
WEITRON  
http:www.weitron.com.tw  
WTD40N03  
Characteristics Curve  
100  
80  
60  
40  
20  
0
T =25˚C  
VG=10V  
VG=7.0V  
VG=6.0V  
T =150˚C  
VG=10V  
VG=7.0V  
VG=6.0V  
c
c
80  
60  
40  
20  
0
VG=5.0V  
VG=4.0V  
VG=5.0V  
VG=4.0V  
VG=3.0V  
6
VG=3.0V  
6
0
1
2
3
4
5
7
0
1
2
3
4
5
7
VDS . Drain-to-Source Voltage(V)  
VDS . Drain-to-Source Voltage(V)  
Fig.2 Typical Output Characteristics  
FIG.1 Typical Output Characteristics  
1.80  
ID=18A  
ID=18A  
31  
29  
27  
25  
23  
21  
19  
17  
VG=10V  
TC=25˚C  
1.60  
1.40  
1.20  
1.00  
0.80  
0.60  
0
4
5
6
7
8
9
10 11 12  
-50  
0
50  
100  
150  
VGS (V)  
Tj  
Fig.3 On-Resistance v.s. Gate Voltage  
Fig.4 Normalized OnResistance  
40  
35  
30  
25  
20  
15  
10  
5
60  
50  
40  
30  
20  
10  
0
0
25  
50  
75  
100  
150  
150  
25  
50  
75  
100  
150  
150  
Tj  
Tj  
Fig.5 Maximum Drain Current  
v.s. Case Temperature  
Fig.6 Type Power Dieeipation  
WEITRON  
4/6  
12-Jul-07  
http://www.weitron.com.tw  
WTD40N03  
100  
10  
100  
1
10us  
DUTY=0.5  
0.2  
100us  
1ms  
0.1  
10  
0.1  
PDM  
t
0.05  
0.02  
0.01  
SINGLE PULSE  
T
10ms  
Duty factor = t / T  
Peak Tj=PDM x Rthjc + TC  
D=0.01 Ta  
100ms  
1
1
0.01  
10  
100  
0.00001 0.0001 0.001  
0.01  
0.1  
1
10  
VDS(V)  
t , Pulse Width (s)  
Fig 8. Effective Transient Thermal Impedance  
Fig 7. Maximum Safe Operating Area  
f=1.0MHz  
10000  
16  
Id=20A  
14  
VD=16V  
VD=20V  
VD=24V  
12  
10  
8
1000  
Ciss  
6
Coss  
4
2
Crss  
100  
1
0
5
10  
15  
20  
25  
30  
35  
40  
1
5
9
13  
17  
21  
25  
29  
QG , Total Gate Charge (nC)  
VDS (V)  
Fig 10. Typical Capacitance Characteristics  
Fig 9. Gate Charge Characteristics  
3
100  
10  
Tj  
2
1
0
Tj  
1
0.1  
0.01  
-50  
0
50  
100  
150  
0.1  
0.3  
0.5  
0.7  
0.9  
1.1  
1.3  
1.5  
Tj  
VSD (V)  
Fig 11. Forward Charateristics of  
Reverse Diode  
Fig.12 Gate Threshold Voltage v.s.  
Junction Temperature  
WEITRON  
http://www.weitron.com.tw  
5/6  
12-Jul-07  
WTD40N03  
D-PAK / (TO-252) Outline Dimension  
Unit:mm  
E
D-PAK  
G
A
Dim  
A
B
C
D
Min  
6.40  
9.00  
0.50  
-
Max  
6.80  
10.00  
H
J
4
0.80  
2.30  
2.50  
0.55  
1.60  
5.80  
0.64  
1.70  
1.50  
B
1
2
3
E
2.20  
0.45  
1.00  
5.40  
0.30  
0.70  
0.90  
G
H
J
K
L
M
K
D
C
L
M
6/6  
12-Jul-07  
WEITRON  
http://www.weitron.com.tw  
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