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VUM25-05E

型号:

VUM25-05E

描述:

整流模块三相功率因数校正[ Rectifier Module for Three Phase Power Factor Correction ]

品牌:

IXYS[ IXYS CORPORATION ]

页数:

4 页

PDF大小:

85 K

Advanced Technical Information  
VUM 25-05  
VDSS = 500 V  
ID25 = 35 A  
RDS(on) = 0.12 W  
Rectifier Module  
for Three Phase Power Factor Correction  
Using fast recovery epitaxial diodes and MOSFET  
1
5
3
2
1
VRRM (Diode)  
VDSS  
Type  
6
9
V
V
5
2
600  
500  
VUM 25-05E  
10  
10  
9
6
3
Symbol  
Test Conditions  
Maximum Ratings  
Features  
VDSS  
VDGR  
VGS  
TVJ = 25°C to 150°C  
TVJ = 25°C to 150°C; RGS = 10 kW  
Continuous  
500  
500  
±20  
V
V
V
Package with DCB ceramic base plate  
Soldering connections for PCB  
mounting  
ID  
ID  
IDM  
TS = 85°C  
TS = 25°C  
TS = 25°C, tp =  
24  
35  
95  
A
A
A
Isolation voltage 3600 V~  
Low RDS(on) HDMOSTM process  
Low package inductance for high  
speed switching  
PD  
TS = 85°C  
170  
W
Ultrafast diodes  
IS  
ISM  
VGS = 0 V, TS = 25°C  
VGS = 0 V, TS = 25°C, tp = ①  
24  
95  
A
A
Kelvin source for easy drive  
VRRM  
IdAV  
600  
40  
V
A
Applications  
TS = 85°C, rectangular d = 0.5  
Three phase input rectifier with power  
IFSM  
TVJ = 45°C, t = 10 ms (50 Hz)  
300  
320  
A
A
factor correction consisting of three  
modules VUM 25-05  
t = 8.3 ms (60 Hz)  
TVJ = 150°C, t = 10 ms (50 Hz)  
260  
280  
A
A
For power supplies, UPS, SMPS,  
t = 8.3 ms (60 Hz)  
drives, welding etc.  
P
TS = 85°C  
36  
W
Advantages  
TVJ  
TJM  
Tstg  
-40...+150  
150  
-40...+150  
°C  
°C  
°C  
Reduced harmonic content of input  
currents corresponding to standards  
VISOL  
50/60 Hz  
IISOL £ 1 mA  
t = 1 min  
t = 1 s  
3000  
3600  
V~  
V~  
Rectifier generates maximum DC  
power with a given AC fuse  
Md  
Weight  
Mounting torque (M5)  
2-2.5/18-22 Nm/lb.in.  
35  
Wide input voltage range  
g
No external isolation  
Easy to mount with two screws  
Suitable for wave soldering  
High temperature and power cycling  
capability  
Pulse width limited by TVJ  
IXYS reserves the right to change limits, test conditions and dimensions.  
© 2000 IXYS All rights reserved  
1 - 4  
VUM 25-05  
Symbol  
Test Conditions  
Characteristic Values  
Dimensions in mm (1 mm = 0.0394")  
(TVJ = 25°C, unless otherwise specified)  
min.  
typ. max.  
VDSS  
VGS(th)  
VGS = 0 V, ID = 2 mA  
VDS = 20 V, ID = 20 mA  
500  
2
V
V
5
IGSS  
IDSS  
VGS = ±20 V, VDS = 0 V  
±500 nA  
VDS = 500 V, VGS = 0 V  
2
mA  
RDS(on)  
RGint  
TVJ = 25°C  
TVJ = 25°C  
0.12  
1.5  
W
W
gfs  
VDS  
VDS = 15 V, IDS = 12 A  
IDS = 24 A, VGS = 0 V  
30  
S
V
1.5  
td(on)  
td(off)  
100 ns  
220 ns  
VDS = 250 V, IDS = 12 A, VGS = 10 V  
Zgen. = 1 W, L-load  
Ciss  
Coss  
Crss  
8.5  
0.9  
0.3  
nF  
nF  
nF  
VDS = 25 V, f = 1 MHz, VGS = 0 V  
Qg  
VDS = 250 V, ID = 12 A, VGS = 10 V  
350  
nC  
RthJS  
0.38 K/W  
VF  
IR  
IF  
= 22 A; TVJ = 25°C  
TVJ =150°C  
1.65  
1.4  
V
V
VR = 600 V, TVJ = 25°C  
VR = 480 V, TVJ = 25°C  
TVJ =125°C  
1.5 mA  
0.25 mA  
7
mA  
VT0  
rT  
For power-loss calculations only  
TVJ = 125°C  
1.14  
10 mW  
V
IRM  
IF  
= 30 A; -diF/dt = 240 A/ms  
VR = 350 V, TVJ = 100°C  
10  
11  
A
RthJS  
1.8 K/W  
© 2000 IXYS All rights reserved  
2 - 4  
VUM 25-05  
80  
80  
A
2.5  
10 V  
RDS(on) ID=18A  
A
70  
70  
2.0  
7 V  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
30  
20  
10  
0
6 V  
norm.  
ID  
ID  
1.5  
1.0  
0.5  
0.0  
TVJ = 25 C  
TVJ = 125 C  
VGS= 5 V  
0
2
4
VDS  
6
8
10  
V
2
3
4
VGS  
5
6
7
-50  
0
TVJ  
50  
100  
150  
°C  
V
Fig. 1 Typ. output characteristic  
ID = f (VDS) (MOSFET)  
Fig. 2 Typ. transfer characteristics  
ID = f (VGS) (MOSFET)  
Fig. 3 Typ. normalized  
RDS(on) = f (TVJ) (MOSFET)  
1.4  
BVDSS  
VGS(th)  
12  
V
100  
nF  
10  
1.2  
VDS= 250 V  
VGS(th)  
VDSS  
Ciss  
ID = 18 A  
8
10  
VGS  
1.0  
norm.  
IG = 10 mA  
C
6
4
2
0
0.8  
0.6  
0.4  
Coss  
1
Crss  
0.1  
-50  
0
50  
100  
150  
0
100  
200  
Qg  
300 nC 400  
0
5
10  
15  
20  
°C  
V
TVJ  
VDS  
Fig. 4 Typ. normalized BVDSS = f (TVJ)  
VGS(th) = f (TVJ) (MOSFET)  
Fig. 5 Typ. turn-on gate charge  
characteristics, VGS = f (Qg) (MOSFET)  
Fig. 6 Typ. capacitances C = f (VDS),  
f = 1 MHz (MOSFET)  
120  
A
3.0  
80  
s
TVJ=100 C  
µC  
VR= 350 V  
100  
2.5  
max.  
60  
gfs  
IF = 37 A  
IF = 74 A  
IF = 37 A  
IF = 18.5 A  
80  
2.0  
1.5  
1.0  
0.5  
0.0  
Qrr  
IF  
TVJ=150 C  
TVJ=100 C  
TVJ= 25 C  
40  
20  
0
60  
40  
20  
0
typ.  
V
A/ s  
1000  
0.5  
1.0  
1.5  
VF  
2.0  
2.5  
10  
100  
-diF/dt  
0
20  
40  
60  
ID  
80 A 100  
Fig. 7 Typ. transconductance,  
gfs = f (ID) (MOSFET)  
Fig. 8 Forward current versus  
voltage drop (Diodes)  
Fig. 9 Recovery charge versus -diF/dt  
(Diodes)  
© 2000 IXYS All rights reserved  
3 - 4  
VUM 25-05  
50  
A
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.6  
TVJ=100 C  
VR= 350 V  
TVJ=100 C  
VR= 350 V  
µs  
0.5  
0.4  
0.3  
0.2  
0.1  
0.0  
40  
30  
20  
10  
0
max.  
IF = 37 A  
trr  
IRM  
Kt  
IF = 74 A  
IF = 37 A  
IF = 18.5 A  
IF = 37 A  
IF = 74 A  
IF = 37 A  
IF = 18.5 A  
max.  
IRM  
Qr  
typ.  
typ.  
0
100 200 300 400 500 600  
A/ s  
20 40 60 80 100 120 160  
0
100 200 300 400 500 600  
A/ s  
°C  
-diF/dt  
-diF/dt  
T
TVJ  
Fig. 11 Dynamic parameters versus  
junction temperature (Diodes)  
Fig. 10 Peak reverse current versus  
-diF/dt (Diodes)  
Fig. 12 Recovery time versus  
-diF/dt (Diodes)  
18  
V
16  
0.9  
s
2.5  
VUM 25  
K/W  
2.0  
14  
VFR  
0.7  
0.5  
0.3  
ZthJC  
VFR  
Diode  
12  
10  
8
1.5  
1.0  
0.5  
0.0  
6
tFR  
tFR  
4
MOSFET  
2
0.1  
A/ s  
0
100 200 300 400 600  
0.01  
0.1  
1
10  
s
t
diF/dt  
Fig. 13 Peak forward voltage versus  
-diF/dt (Diodes)  
Fig. 14 Transient thermal impedance junction to case for all devices  
© 2000 IXYS All rights reserved  
4 - 4  
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