5N25
Preliminary
Power MOSFET
ELECTRICAL CHARACTERISTICS (TC=25°C, unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNIT
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
BVDSS
ID=250µA, VGS=0V
250
V
△BVDSS/△TJ Reference to 25°C, ID=250µA
IDSS VDS=250V, VGS=0V
GS=+20V, VDS=0V
0.18
V/°C
µA
Drain-Source Leakage Current
1
Forward
Reverse
V
+100 nA
-100 nA
Gate-Source Leakage Current
IGSS
VGS=-20V, VDS=0V
ON CHARACTERISTICS
Gate Threshold Voltage
VGS(TH)
RDS(ON)
gFS
VDS=VGS, ID=250µA
2
4
V
Ω
Ω
S
VGS=10V, ID=1.9A
0.74 1.2
0.92 1.25
3.35
Static Drain-Source On-State Resistance
(Note 1)
VGS=5V, ID=1.9A
VDS=30V, ID=1.9A
Forward Transconductance
DYNAMIC PARAMETERS
Input Capacitance
CISS
COSS
CRSS
250 325 pF
Output Capacitance
Reverse Transfer Capacitance
SWITCHING PARAMETERS
Total Gate Charge
VGS=0V, VDS=25V, f=1.0MHz
40
6
50
8
pF
pF
QG
QGS
QGD
tD(ON)
tR
14
1.2
2.4
28
20 nC
nC
VGS=5V, VDS=160V, ID=4.5A
(Note 1, 2)
Gate to Source Charge
Gate to Drain Charge
Turn-ON Delay Time
Rise Time
nC
40
80
ns
ns
24
VDD=100V, ID=4.5A, RG=25Ω
(Note 1, 2)
Turn-OFF Delay Time
Fall-Time
tD(OFF)
tF
80 110 ns
20
90
ns
SOURCE- DRAIN DIODE RATINGS AND CHARACTERISTICS
Maximum Body-Diode Continuous Current
Maximum Body-Diode Pulsed Current
Drain-Source Diode Forward Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
IS
3.8
9
A
A
ISM
VSD
tRR
IS=3.8A, VGS=0V
1.5
V
95
ns
µC
IS=4.5A, VGS=0V, dIF/dt=100A/µs
(Note 1)
QRR
0.3
Notes: 1. Pulse Test: Pulse width≤300µs, Duty cycle≤2%
2. Essentially independent of operating temperature
UNISONIC TECHNOLOGIES CO., LTD
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