F
E
D
C
B
A
b
NOTES:
1. FOR WAVESOLDERING ( SOLDER BATH TEMPERATURE 240°C FOR 5 SEC./
0,5
3,3 +- 0,3
AND SOLDER PREHEAT 120°C FOR 120 SEC. )
`0,3
6,35
2. METALSHELLS: COPPER ALLOY; min. 315µin TIN over 40-80µin NICKEL
3. INSULATORS: PBT GF UL 94 V-0, BLACK
( 5 : 1 )
4. SIGNAL CONTACTS: COPPER ALLOY
o
o
o
PLEASE ADD A for GOLD FLASH over NICKEL (PREFERRED TYPE)
PLEASE ADD B for 20µin HARD GOLD over min. 50µin NICKEL
PLEASE ADD C for 30µin HARD GOLD over min. 50µin NICKEL
D
D
SEALING
COMPOUND
5. THREADED INSERTS: COPPER ALLOY;
min. 200µin TIN over 80µin NICKEL
6. METAL BRACKETS: ZINC DIE CAST;
300µin COPPER/ 40-120µin NICKEL/ 120-200µin TIN
7. PCB-SNAPS: COPPER ALLOY;
`0,2
3,2
min. 200µin TIN over 80µin NICKEL
PCB-HOLE: n3,1`0,1mm; PCB-THICKNESS: 1,6mm
8. HEXLOCKING SCREWS: STAINLESS STEEL
9. FRAME: ZINC DIE CAST; NICKEL PLATED
10. O-RING: SILICON; BLUE
11. COLLARS: min. 200µin TIN over 80µin NICKEL
12. P.C.B. HOLE DRILLINGS and RECOMMENDED PANEL CUT-OUT ON SHEET 2
13. SEALING COMPOUND: PUR; BLUE
14. RECOMMENDED TORQUE FOR MOUNTING SCREW
35Ncm (3,1in.LB)/max. 40Ncm (3,5 in.LB)
0,02
8 +- 0,23
15. CONNECTOR IS PART MARKED: 6STD15S
o
T99S40X CONEC ABC (see note 4)
C
C
0,3
47,7+-
33,32 +-
24,74 +-
0
0,13
0,12
0,05
0,2
METAL BRACKET
PRESS FOR FIXING ON PCB
B
B
O-RING
b
PCB SNAP
6STD15S
oT99S40X
CONEC ABC
4-40 UNC
4-40 UNC
SEE NOTE 15
SEE NOTE 9
SW 4,8
AT ALL TIMES WATER RESISTANT CONNECTORS NOT
IN USE SHOULD BE COVERED WITH A CONEC WATER
RESISTANT CAP OR WATER TIGHT HOOD.
2:1 (5:1)
scale:
tolerance
material:
SEE NOTES
dim. in mm
A
A
date
name
Gitinow
Fischer
title:
drawn
appd.
norm
14.10.2011
24.10.2011
D-SUB FEMALE 90°
15pos. SOLDER PIN ANGLED
with threaded insert, metal bracket, hex bolt and snap
dwg no:
DIN-
d-old
27.11.14
date
Heinrich
name
2 x b
a
Ä5438
A3
R
15K1A952
Original
1
sh:
RoHS compliant
rev. description
part no:
6STD15SoT99S40X (see note 4)
F
E
D
C
B
A
