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PX10089EJ01V0TN

型号:

PX10089EJ01V0TN

描述:

6针Minimold / 6针超级Minimold IC封装的高频率使用编带规格及包装外形图\n[ 6-pin Minimold/6-pin Super Minimold Package IC for High Frequency Use Taping Specifications and Packing Outline Drawing ]

品牌:

ETC[ ETC ]

页数:

12 页

PDF大小:

76 K

Technical Note  
TAPING SPECIFICATIONS AND PACKING OUTLINE  
DRAWING OF 6-PIN MINIMOLD/ 6-PIN SUPER  
MINIMOLD PACKAGE IC FOR HIGH FREQUENCY USE  
Document No. PX10089EJ01V0TN (1st edition)  
Date Published February 2002 CP(K)  
NEC Compound Semiconductor Devices 2002  
Printed in Japan  
The information in this document is current as of February, 2002. The information is subject to  
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or  
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all  
products and/or types are available in every country. Please check with an NEC sales representative  
for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without prior  
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.  
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of  
third parties by or arising from the use of NEC semiconductor products listed in this document or any other  
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any  
patents, copyrights or other intellectual property rights of NEC or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of customer's equipment shall be done under the full  
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third  
parties arising from the use of these circuits, software and information.  
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers  
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize  
risks of damage to property or injury (including death) to persons arising from defects in NEC  
semiconductor products, customers must incorporate sufficient safety measures in their design, such as  
redundancy, fire-containment, and anti-failure features.  
NEC semiconductor products are classified into the following three quality grades:  
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products  
developed based on a customer-designated "quality assurance program" for a specific application. The  
recommended applications of a semiconductor product depend on its quality grade, as indicated below.  
Customers must check the quality grade of each semiconductor product before using it in a particular  
application.  
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio  
and visual equipment, home electronic appliances, machine tools, personal electronic equipment  
and industrial robots  
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's  
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not  
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness  
to support a given application.  
(Note)  
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.  
and also includes its majority-owned subsidiaries.  
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for  
NEC (as defined above).  
M8E 00. 4-0110  
2
Technical Note PX10089EJ01V0TN  
CONTENTS  
1. DESCRIPTION ........................................................................................................................................ 4  
2. INDICATION OF PART NUMBER ....................................................................................................... 4  
2.1 Indication of Part Number............................................................................................................. 4  
2.2 Device Orientation in the Carrier Tape........................................................................................ 4  
2.3 An Example of Indication.............................................................................................................. 4  
3. SPECIFICATIONS................................................................................................................................... 5  
3.1 Tape Dimensions........................................................................................................................... 5  
3.1.1 6-pin Minimold Package .......................................................................................................................5  
3.1.2 6-pin Super Minimold Package.............................................................................................................6  
3.2 Reel Dimensions (Used Commonly for 2 Package Types)........................................................ 7  
3.3 Leader and Trailer of Carrier Tape (Used Commonly for 2 Package Types)........................... 8  
3.4 Sealing Strength between Tapes................................................................................................. 9  
3.5 Missing Device............................................................................................................................... 9  
3.6 Taking Packaged Device Out of the Tape................................................................................... 9  
3.7 Splicing........................................................................................................................................... 9  
3.8 Electrical Characteristics.............................................................................................................. 9  
3.9 Storage Environment .................................................................................................................... 9  
4. PACKING .............................................................................................................................................. 10  
4.1 Quantity of Packing..................................................................................................................... 10  
4.2 Indication of Part Number and Quantity to the Reel................................................................ 10  
4.3 Indication of Part Number and Quantity to the Packing Case................................................ 10  
5. PACKING OUTLINE DRAWING (Used Commonly for 2 Package Types).................................... 11  
5.1 Tape and Reel .............................................................................................................................. 11  
5.2 Packing Box Specifications........................................................................................................ 11  
3
Technical Note PX10089EJ01V0TN  
1. DESCRIPTION  
This specification covers standards on tape and reel of the 6-pin minimold/6-pin super minimold package for high  
frequency semiconductors on NEC Compound Semiconductor Devices, Ltd.  
2. INDICATION OF PART NUMBER  
The part number of tape and reel packing device is following.  
2.1 Indication of Part Number  
-
Part number of device  
Symbol of device orientation (cf. 2.2)  
Indicating the embossed carrier tape  
In IC’s, “T” and “TA” means minimold package, “TB” means super minimold package.  
2.2 Device Orientation in the Carrier Tape  
Pin 1, 2, 3 of the device faces toward perforations of the tape.  
Caution Only “-E3” type taping is supported for this package. In the drawing, marking is an example.  
-E3  
1 pin  
C2H  
C2H  
C2H  
Pin 1, 2, 3 face to perforations  
2.3 An Example of Indication  
µPC8172TB-E3: Emboss-taped µPC8172TB, of which pin 1, 2, 3 face toward tape’s perforations.  
4
Technical Note PX10089EJ01V0TN  
3. SPECIFICATIONS  
3.1 Tape Dimensions  
3.1.1 6-pin Minimold Package  
t
H
A
δ
J
δ
0
D1  
θ
K
K
K
0
1
G
F
(Unless otherwise specified, Unit: mm)  
Remarks  
Item  
Symbol  
Size  
3.18±0.1  
3.40±0.1  
1.4±0.1  
Pocket  
Length  
Width  
A0  
B0  
K0  
F
Bottom size  
Bottom size  
Depth  
Inner size  
Pitch  
4.0±0.1  
Accumulated tolerance ±0.2 MAX./10 pitch  
Air Hole  
Diameter  
Diameter  
Pitch  
D1  
J
φ1.0±0.2  
φ1.55±0.05  
4.0±0.1  
Perforation  
H
E
Accumulated tolerance ±0.2 MAX./10 pitch  
Position  
1.75±0.1  
2.0±0.05  
Distance between edge of tape and center of hole.  
Distance Between Centerline  
Length Direction  
Width Direction  
Width  
G
D
W
C
t
Distance between center of pocket and center  
of perforation.  
3.5±0.05  
+0.3  
Cover Tape  
Carrier Tape  
5.5  
0.1  
Width  
8.0±0.2  
0.3±0.05  
0.3 MAX.  
1.6±0.1  
Thickness  
Bend  
δ
Depth  
K1  
Device  
Outline  
See the product specification  
Tilt  
θ
20° MAX.  
Overall Thickness  
K
1.65 MAX.  
Cover tape + Carrier tape  
This carrier tape is applied treatment of electro static prevention.  
5
Technical Note PX10089EJ01V0TN  
3.1.2 6-pin Super Minimold Package  
t
H
A
δ
J
δ
0
D1  
θ
θ
K
K
K
0
G
1
F
(Unless otherwise specified, Unit: mm)  
Remarks  
Item  
Symbol  
Size  
2.2±0.1  
2.4±0.1  
1.2±0.1  
4.0±0.1  
φ1.0  
Pocket  
Length  
A0  
B0  
K0  
F
Bottom size  
Width  
Bottom size  
Depth  
Inner size  
Pitch  
Accumulated tolerance ±0.2/10 pitch  
Air Hole  
Diameter  
Diameter  
Pitch  
D1  
J
Perforation  
φ1.55±0.05  
4.0±0.1  
1.75±0.1  
2.0±0.05  
H
E
Accumulated tolerance ±0.2/10 pitch  
Position  
Length Direction  
Width Direction  
Width  
Distance between edge of tape and center of hole.  
Distance Between Centerline  
G
D
W
C
t
Distance between center of pocket and center  
of perforation.  
3.5±0.05  
+0.3  
Cover Tape  
Carrier Tape  
5.5  
Thickness: 0.1 MAX.  
0.1  
Width  
8.0±0.2  
0.3±0.05  
0.3 MAX.  
1.7 MAX.  
Thickness  
Bend  
δ
Depth  
K1  
Device  
Outline  
Tilt  
See the product specification  
θ
20° MAX.  
Overall Thickness  
K
1.8 MAX.  
Cover tape + Carrier tape  
This carrier tape is applied treatment of electro static prevention.  
6
Technical Note PX10089EJ01V0TN  
3.2 Reel Dimensions (Used Commonly for 2 Package Types)  
θ
1
TYPE  
CLASS  
Label  
W
(Unless otherwise specified, Unit: mm)  
Remarks  
Item  
Symbol  
Size  
+0  
Flange  
Hub  
Diameter  
A
W
B
φ180  
1.5  
+1  
Space Between Flanges  
Outer Diameter  
Spindle Hole Diameter  
Key Slit Location  
9
0  
+1  
φ60  
0  
C
φ13±0.2  
120°  
θ1  
Marking  
Label shall be attached to one Part number, quantity, lot number and class  
side of flanges are marked or labeled  
This reel applied treatment of electro static prevention.  
7
Technical Note PX10089EJ01V0TN  
3.3 Leader and Trailer of Carrier Tape (Used Commonly for 2 Package Types)  
Adhesive tape  
Empty carrier tape  
Leader  
Cover tape  
Trailer  
Label  
(Unit: mm)  
Item  
Specification  
Remarks  
Leader  
Trailer  
Cover Tape  
Tip taped to roll, and fixed by adhesive tape  
The winding direction is shown above  
Length of cover tape + empty carrier tape  
Empty Carrier Tape  
100 MIN.  
400 MIN.  
160 MIN.  
Empty Carrier Tape  
8
Technical Note PX10089EJ01V0TN  
3.4 Sealing Strength between Tapes  
Item  
Data  
0.1 to 1.0 N  
Remarks  
Cover Tape Adhesion  
Peeling angle: 165° to 180°,  
Peeling speed: 300±10 mm/min  
Cover tape  
165˚ to 180˚  
Carrier tape  
Direction of tape  
3.5 Missing Device  
Item  
Successive Void  
Spec  
Remarks  
Within 40 mm to carrier except leader and trailer  
Except leader and trailer  
None  
Non-successive Void  
Rate of incidence  
0.2% MAX./reel  
Wrong Orientation  
Reverse Orientation  
Wrong Type No  
None  
3.6 Taking Packaged Device Out of the Tape  
(1) Packaged devices should not adhere to the cover tape.  
(2) Excess epoxy mold should not affect on taking the device out.  
3.7 Splicing  
No carrier or cover tape should be spliced.  
3.8 Electrical Characteristics  
Electrical characteristics of taping device shall be provide in the specification.  
3.9 Storage Environment  
Ambient Temperature : TA = +5 to +30°C  
Humidity  
: Rh = 20 to 70%  
9
Technical Note PX10089EJ01V0TN  
4. PACKING  
4.1 Quantity of Packing  
3 000 pieces/reel  
4.2 Indication of Part Number and Quantity to the Reel  
Part number, quantity, rank and lot number are indicated at the side of the reel.  
4.3 Indication of Part Number and Quantity to the Packing Case  
Part number, quantity, rank and lot number are indicated at the side of packing case.  
10  
Technical Note PX10089EJ01V0TN  
5. PACKING OUTLINE DRAWING (Used Commonly for 2 Package Types)  
5.1 Tape and Reel  
-E3 Type  
C1X  
C1X  
C1X  
Label  
Direction of feed  
Quantity (pcs)  
3 000  
Contens of Label  
Indication  
Part Number, Quantity, Lot Number, Class  
5.2 Packing Box Specifications  
Dimension (mm)  
Quantity  
(reel)  
H
(W × H × L)  
185 × 75 × 185  
185 × 135 × 185  
1 to 5  
6 to 10  
L
W
Contens of Label  
Indication  
Part Number, Quantity, Lot Number, Class  
Label  
Remark Dimensions and maximum quantity of a packing box are for shipment.  
In some using case, the packing box might replace another box.  
11  
Technical Note PX10089EJ01V0TN  
Business issue  
NEC Compound Semiconductor Devices, Ltd.  
5th Sales Group, Sales Division TEL: +81-3-3798-6372 FAX: +81-3-3798-6783 E-mail: salesinfo@csd-nec.com  
NEC Compound Semiconductor Devices Hong Kong Limited  
Hong Kong Head Office  
Taipei Branch Office  
Korea Branch Office  
TEL: +852-3107-7303  
FAX: +852-3107-7309  
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859  
TEL: +82-2-528-0301  
FAX: +82-2-528-0302  
NEC Electron Devices European Operations  
http://www.nec.de/  
TEL: +49-211-6503-101 FAX: +49-211-6503-487  
California Eastern Laboratories, Inc.  
http://www.cel.com/  
TEL: +1-408-988-3500 FAX: +1-408-988-0279  
Technical issue  
NEC Compound Semiconductor Devices, Ltd.  
http://www.csd-nec.com/  
Sales Engineering Group, Sales Division  
E-mail: techinfo@csd-nec.com FAX: +81-44-435-1918  
0110  
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