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2SK2904-01

型号:

2SK2904-01

描述:

N沟道硅功率MOS -FET[ N-CHANNEL SILICON POWER MOS-FET ]

品牌:

FUJI[ FUJI ELECTRIC ]

页数:

4 页

PDF大小:

116 K

FUJI POWER MOS-FET  
2SK2904-01  
N-CHANNEL SILICON POWER MOS-FET  
Features  
TO-3P  
High speed switching  
Low on-resistance  
No secondary breadown  
Low driving power  
Avalanche-proof  
Applications  
Switching regulators  
UPS (Uninterruptible Power Supply)  
DC-DC converters  
3. Source  
Equivalent circuit schematic  
Drain(D)  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Item  
Symbol  
VDS  
ID  
Rating  
60  
Unit  
V
Drain-source voltage  
Continuous drain current  
Pulsed drain current  
Gate-source voltage  
Maximum Avalanche Energy  
Max. power dissipation  
Operating and storage  
temperature range  
±80  
A
ID(puls]  
VGS  
EAV*1  
PD  
±320  
±30  
A
V
Gate(G)  
972.3  
mJ  
Source(S)  
125  
W
°C  
°C  
Tch  
+150  
Tstg  
-55 to +150  
*1 L=0.203mH, Vcc=24V  
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Item  
Test Conditions  
Symbol  
BVDSS  
VGS(th)  
V
Drain-source breakdown voltaget  
Gate threshold voltage  
ID=1mA  
VGS=0V  
60  
2.5  
V
ID=10mA  
VDS=60V  
VGS=0V  
VDS=VGS  
3.0  
10  
0.2  
10  
9.5  
3.5  
500  
1.0  
100  
µA  
mA  
nA  
Tch=25°C  
Zero gate voltage drain current  
IDSS  
Tch=125°C  
VGS=±30V  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
VDS=0V  
IGSS  
RDS(on)  
gfs  
ID=40A VGS=10V  
ID=40A VDS=25V  
VDS=25V  
12  
m  
S
20  
40  
3100  
1300  
350  
20  
4650  
1950  
530  
30  
pF  
Ciss  
Output capacitance  
VGS=0V  
Coss  
Crss  
td(on)  
tr  
Reverse transfer capacitance  
Turn-on time ton  
f=1MHz  
ns  
VCC=30V ID=80A  
VGS=10V  
85  
120  
130  
120  
88  
Turn-off time toff  
td(off)  
tf  
RGS=10 Ω  
65  
80  
µ
A
Avalanche capability  
IAV  
L=100 H Tch=25°C  
1.0  
70  
0.13  
1.5  
V
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
VSD  
trr  
Qrr  
IF=50A VGS=0V Tch=25°C  
IF=50A VGS=0V  
-di/dt=100A/µs  
Tch=25°C  
ns  
µC  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
1.0  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
35.0  
°C/W  
1
2SK2904-01  
FUJI POWER MOSFET  
Characteristics  
Power Dissipation  
Safe operating area  
PD=f(Tc)  
ID=f(VDS):D=0.01,Tc=25°C  
103  
102  
101  
100  
10-1  
150  
125  
100  
75  
t=  
1µs  
10µs  
D.C.  
100µs  
1ms  
10ms  
50  
100ms  
t
t
D=  
T
25  
T
0
10-1  
100  
101  
102  
103  
0
50  
100  
150  
VDS [V]  
Tc [°C]  
Typical transfer characteristics  
ID=f(VGS):80µs pulse test,VDS=25V,Tch=25°C  
Typical output characteristics  
ID=f(VDS):80µs pulse test,Tc=25°C  
200  
150  
100  
50  
10V  
VGS=20V  
100  
10  
1
8V  
6.0V  
5.5V  
5.0V  
4.5V  
4.0V  
3.5V  
0
0.1  
0
2
4
6
8
10  
0
1
2
3
4
5
VDS [V]  
VGS [V]  
Typical forward transconductance  
gfs=f(ID):80µs pulse test,VDS=25V,Tch=25°C  
Typical Drain-Source on-State Resistance  
RDS(on)=f(ID):80µs pulse test,Tch=25°C  
VGS=  
3.5V  
103  
50  
40  
30  
20  
10  
0
4.0V  
4.5V  
5.0V  
5.5V  
102  
6V  
101  
8V  
10V  
20V  
100  
100  
101  
102  
103  
0
50  
100  
150  
200  
ID [A]  
ID [A]  
2
2SK2904-01  
FUJI POWER MOSFET  
Drain-source on-state resistance  
Gate Threshold Voltage vs. Tch  
VGS(th)=f(Tch):VDS=VGS,ID=10mA  
RDS(on)=f(Tch):ID=40A,VGS=10V  
30  
25  
20  
15  
10  
5
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
max.  
typ.  
max.  
min.  
typ.  
0
-50  
0
50  
100  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Tch [°C]  
Tch [°C]  
Typical capacitances  
C=f(VDS):VGS=0V,f=1MHz  
Typical Gate Charge Characteristics  
VGS=f(Qg):ID=80A,Tch=25°C  
25  
50  
40  
30  
20  
10  
0
100n  
10n  
1n  
VDS  
VGS  
20  
15  
10  
5
Vcc=48V  
30V  
12V  
Ciss  
Coss  
Crss  
0
100p  
10-2  
10-1  
100  
101  
102  
0
20  
40  
60  
80  
100  
120  
140  
VDS [V]  
Qg [nC]  
Typical Forward Characteristics of Reverse Diode  
IF=f(VSD):80µs pulse test,Tch=25°C  
Typical Switching Characteristics vs. ID  
t=f(ID):Vcc=30V,VGS=10V,RG=10  
104  
103  
102  
101  
200  
180  
160  
140  
120  
100  
80  
td(off)  
tf  
60  
10V  
5V  
VGS=0V  
tr  
40  
20  
td(on)  
10-1  
100  
101  
102  
0.0  
0.2  
0.4  
0.6  
0.8  
VSD [V]  
1.0  
1.2  
1.4  
1.6  
ID [A]  
3
2SK2904-01  
FUJI POWER MOSFET  
Transient thermal impedande  
Zthch=f(t) parameter:D=t/T  
Maximum Avalanche Current vs. starting Tch  
I(AV)=f(starting Tch)  
1
100  
80  
60  
40  
20  
0
10  
0
10  
0.5  
0.2  
0.1  
-1  
10  
0.05  
t
0.02  
t
D=  
T
0.01  
0
T
-2  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
10  
t [s]  
0
50  
100  
Starting Tch [°C]  
150  
Maximum Avalanche energy vs. starting Tch  
Eas=f(starting Tch):Vcc=24V, I(AV)<=80A  
1200  
1000  
800  
600  
400  
200  
0
0
50  
100  
150  
Starting Tch [°C]  
4
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PANASONIC

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