2SK3684-01L,S,SJ
FUJI POWER MOSFET
200309
N-CHANNEL SILICON POWER MOSFET
Super FAP-G Series
Outline Drawings [mm]
Features
High speed switching
No secondary breadown
Avalanche-proof
Low on-resistance
Low driving power
Applications
P4
Switching regulators
DC-DC converters
UPS (Uninterruptible Power Supply)
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25°C unless otherwise specified)
Item
Symbol Ratings
Unit
V
Remarks
Drain-source voltage
VDS
VDSX
ID
500
500
±19
±76
±30
19
V
VGS=-30V
Continuous drain current
Pulsed drain current
Gate-source voltage
Non-Repetitive
A
ID(puls]
VGS
IAS
A
V
<
A
Tch 150°C
=
Equivalent circuit schematic
Maximum avalanche current
Non-Repetitive
EAS
245.3
mJ
L=1.25mH
Drain(D)
Maximum avalanche energy
Maximum Drain-Source dV/dt
Peak diode recovery dV/dt
Max. power dissipation
VCC=50V *2
<
dVDS/dt
dV/dt
PD
20
5
kV/s
kV/µs
W
VDS 500V
=
*3
1.67
Ta=25°C
Tc=25°C
270
Gate(G)
Operating and storage
temperature range
Tch
+150
°C
°C
Source(S)
Tstg
-55 to +150
*2 See to Avalanche Energy Graph
<
<
<
*3 IF -ID, -di/dt=50A/µs, VCC BVDSS, Tch 150°C
=
=
=
Electrical characteristics (Tc =25°C unless otherwise specified)
Min.
Typ.
Max. Units
Item
Symbol
V(BR)DSS
VGS(th)
Test Conditions
µ
Drain-source breakdown voltaget
Gate threshold voltage
ID= 250 A
VGS=0V
V
500
µ
ID= 250 A
VDS=VGS
V
3.0
5.0
25
µA
Tch=25°C
VDS=500V VGS=0V
VDS=400V VGS=0V
VGS=±30V
VDS=0V
Zero gate voltage drain current
IDSS
Tch=125°C
250
100
nA
Gate-source leakage current
Drain-source on-state resistance
Forward transcondutance
Input capacitance
IGSS
RDS(on)
gfs
10
ID=9.5A VGS=10V
0.29
0.38
Ω
S
ID=9.5A VDS=25V
VDS=25V
7.5
15
1560
230
8
Ciss
Coss
Crss
td(on)
tr
pF
2340
345
12
Output capacitance
VGS=0V
Reverse transfer capacitance
Turn-on time ton
f=1MHz
VCC=300V ID=9.5A
ns
29
43.5
13
19.5
84
VGS=10V
56
Turn-off time toff
td(off)
tf
RGS=10 Ω
8
12
34
51
nC
Total Gate Charge
QG
VCC=250V
ID=19A
13
19.5
15
Gate-Source Charge
Gate-Drain Charge
QGS
QGD
IAV
10
VGS=10V
19
A
Avalanche capability
Diode forward on-voltage
Reverse recovery time
Reverse recovery charge
L=1.25mH Tch=25°C
1.20
1.50
V
VSD
IF=19A VGS=0V Tch=25°C
IF=19A VGS=0V
-di/dt=100A/µs
Tch=25°C
0.57
7.0
µs
µC
trr
Qrr
Thermalcharacteristics
Item
Min.
Typ.
Max. Units
Symbol
Test Conditions
Rth(ch-c)
channel to case
0.463
°C/W
Thermal resistance
Rth(ch-a)
channel to ambient
75.0
°C/W
1