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HZC33

型号:

HZC33

描述:

硅外延平面齐纳二极管的浪涌吸收[ Silicon Epitaxial Planar Zener Diode for Surge Absorb ]

品牌:

RENESAS[ RENESAS TECHNOLOGY CORP ]

页数:

6 页

PDF大小:

71 K

HZC Series  
Silicon Epitaxial Planar Zener Diode for Surge Absorb  
REJ03G1204-0200  
(Previous: ADE-208-1436A)  
Rev.2.00  
Jul 04, 2005  
Features  
These diodes are delivered taped.  
Ultra small Flat Lead Package (UFP) is suitable for surface mount design.  
Ordering Information Ordering Information  
Package Code  
Type No.  
Laser Mark  
Package Name  
(Previous Code)  
HZC Series  
Let to Mark Code  
UFP  
PWSF0002ZA-A  
(UFP)  
Pin Arrangement  
Cathode mark  
Mark  
1
2
51  
1. Cathode  
2. Anode  
Rev.2.00 Jul 04, 2005 page 1 of 5  
HZC Series  
Absolute Maximum Ratings  
(Ta = 25°C)  
Unit  
tem  
Symbol  
Value  
150  
Power dissipation  
Junction temperature  
Storage temperature  
Note: See Fig2.  
Pd *  
Tj  
mW  
°C  
150  
Tstg  
55 to +150  
°C  
Electrical Characteristics  
(Ta = 25°C)  
Zener Voltage  
Reverse Current  
Dynamic Resistance  
ESD-Capability *2  
Test  
Condition  
Test  
Condition  
Test  
Condition  
VZ (V) *1  
Min  
IR (µA)  
Max  
120.0  
120.0  
120.0  
120.0  
50.0  
20.0  
10.0  
10.0  
10.0  
10.0  
5.0  
rd ()  
Max  
100  
100  
100  
110  
120  
130  
130  
130  
130  
130  
130  
80  
— (kV) *2  
Min  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
30  
25  
20  
Type No.  
HZC2.0  
HZC2.2  
HZC2.4  
HZC2.7  
HZC3.0  
HZC3.3  
HZC3.6  
HZC3.9  
HZC4.3  
HZC4.7  
HZC5.1  
HZC5.6  
HZC6.2  
HZC6.8  
HZC7.5  
HZC8.2  
HZC9.1  
HZC10  
HZC11  
HZC12  
HZC13  
HZC15  
HZC16  
HZC18  
HZC20  
HZC22  
HZC24  
HZC27  
HZC30  
HZC33  
HZC36  
Max  
2.20  
IZ (mA)  
VR (V)  
0.5  
IZ (mA)  
1.90  
2.10  
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2
2
2
2
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
2
2
2
2
2.40  
0.7  
2.30  
2.60  
1.0  
2.50  
2.90  
1.0  
2.80  
3.20  
1.0  
3.10  
3.50  
1.0  
3.40  
3.80  
1.0  
3.70  
4.10  
1.0  
4.01  
4.48  
1.0  
4.42  
4.90  
1.0  
4.84  
5.37  
1.5  
5.31  
5.92  
5.0  
2.5  
5.86  
6.53  
2.0  
3.0  
50  
6.47  
7.14  
1.0  
3.5  
30  
7.06  
7.84  
1.0  
4.0  
30  
7.76  
8.64  
0.5  
5.0  
30  
8.56  
9.55  
0.5  
6.0  
30  
9.45  
10.55  
11.56  
12.60  
13.96  
15.52  
17.09  
19.03  
21.08  
23.17  
25.57  
28.90  
32.00  
35.00  
38.00  
0.5  
7.0  
30  
10.44  
11.42  
12.47  
13.84  
15.37  
16.94  
18.86  
20.88  
22.93  
25.10  
28.00  
31.00  
34.00  
0.5  
8.0  
30  
0.5  
9.0  
35  
0.5  
10.0  
11.0  
12.0  
13.0  
15.0  
17.0  
19.0  
21.0  
23.0  
25.0  
27.0  
35  
0.5  
40  
0.5  
40  
0.5  
45  
0.5  
50  
0.5  
55  
0.5  
60  
0.5  
70  
0.5  
80  
0.5  
80  
0.5  
90  
Notes: 1. Tested with pulse (Pw = 40 ms).  
2. C =150 pF, R = 330 , Both forward and reverse direction 10 pulse  
Failure criterion ; According to IR spec  
Rev.2.00 Jul 04, 2005 page 2 of 5  
HZC Series  
Mark Code  
Type No.  
HZC2.0  
HZC2.2  
HZC2.4  
HZC2.7  
HZC3.0  
HZC3.3  
HZC3.6  
HZC3.9  
HZC4.3  
HZC4.7  
HZC5.1  
HZC5.6  
HZC6.2  
HZC6.8  
HZC7.5  
HZC8.2  
HZC9.1  
HZC10  
HZC11  
HZC12  
HZC13  
HZC15  
HZC16  
HZC18  
HZC20  
HZC22  
HZC24  
HZC27  
HZC30  
HZC33  
HZC36  
Mark No.  
20  
22  
24  
27  
30  
33  
36  
39  
43  
47  
51  
56  
62  
68  
75  
82  
91  
10 *  
11 *  
12 *  
13 *  
15 *  
16 *  
18 *  
20 *  
22 *  
24 *  
27 *  
30 *  
33 *  
36 *  
Note: HZC10 To HZC36 has , on the right of Laser Mark.  
Rev.2.00 Jul 04, 2005 page 3 of 5  
HZC Series  
Main Characteristic  
10  
8
6
4
2
0
0
4
8
12  
16  
20  
24  
28  
32  
36  
40  
Zener Voltage VZ (V)  
Fig.1 Zener current vs. Zener voltage  
250  
0.10  
0.09  
Polyimide board  
20h×15w×0.8t  
%/°C  
0.08  
0.07  
0.06  
0.05  
0.04  
0.03  
0.02  
0.01  
0
40  
35  
1.5  
200  
30  
25  
20  
mV/°C  
150  
15  
1.5  
unit: mm  
10  
5
0
100  
0.01  
0.02  
5
10  
15  
20  
25  
0.03  
0.04  
0.05  
50  
0.06  
0
0
5
10 15 20 25 30 35 40 45  
Zener Voltage VZ (V)  
0
50  
Ambient Temperature Ta (°C)  
Fig.2 Power Dissipation vs. Ambient Temperature  
100  
150  
200  
Fig.2 Temperature Coefficient vs. Zener voltage  
Rev.2.00 Jul 04, 2005 page 4 of 5  
HZC Series  
Package Dimensions  
JEITA Package Code  
RENESAS Code  
Previous Code  
UFP / UFPV  
MASS[Typ.]  
0.0016g  
SC-79  
PWSF0002ZA-A  
D
b
E
H
E
c
l
l
1
1
e
1
Dimension in Millimeters  
Reference  
Symbol  
A
Min  
0.50  
0.25  
Nom  
0.60  
0.30  
Max  
0.70  
0.35  
A
b
c
0.08  
0.70  
1.10  
1.50  
0.18  
0.90  
1.30  
1.70  
D
E
0.80  
1.20  
b
2
1.60  
0.80  
H
E
2
1
b
e
Pattern of terminal position areas  
1.70  
0.60  
l
1
Rev.2.00 Jul 04, 2005 page 5 of 5  
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan  
Keep safety first in your circuit designs!  
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble  
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.  
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary  
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.  
Notes regarding these materials  
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's  
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.  
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,  
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.  
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of  
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is  
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product  
information before purchasing a product listed herein.  
The information described here may contain technical inaccuracies or typographical errors.  
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.  
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor  
home page (http://www.renesas.com).  
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to  
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes  
no responsibility for any damage, liability or other loss resulting from the information contained herein.  
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is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a  
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater  
use.  
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.  
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and  
cannot be imported into a country other than the approved destination.  
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.  
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.  
RENESAS SALES OFFICES  
http://www.renesas.com  
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.  
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