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2SK3218-01

型号:

2SK3218-01

描述:

N沟道硅功率MOS -FET[ N-CHANNEL SILICON POWER MOS-FET ]

品牌:

FUJI[ FUJI ELECTRIC ]

页数:

4 页

PDF大小:

149 K

FUJI POWER MOS-FET  
2SK3218-01  
N-CHANNEL SILICON POWER MOS-FET  
TO-220AB  
Features  
High speed switching  
Low on-resistance  
No secondary breadown  
Low driving power  
Avalanche-proof  
Applications  
Switching regulators  
UPS (Uninterruptible Power Supply)  
DC-DC converters  
3. Source  
Maximum ratings and characteristicAbsolute maximum ratings  
(Tc=25°C unless otherwise specified)  
Equivalent circuit schematic  
Item  
Drain-source voltage  
Symbol  
VDS  
ID  
Rating  
150  
Unit  
V
Drain(D)  
Continuous drain current  
Pulsed drain current  
±40  
A
ID(puls]  
VGS  
EAV*1  
PD  
±160  
±30  
A
Gate-source voltage  
V
Maximum Avalanche Energy  
Max. power dissipation Ta=25  
387  
mJ  
W
W
°C  
°C  
Gate(G)  
°C  
°C  
1.67  
Source(S)  
Tc=25  
PD  
135  
Operating and storage  
temperature range  
Tch  
+150  
-55 to +150  
Tstg  
*1 L=420µH, Vcc=24V  
Electrical characteristics (Tc =25°C unless otherwise specified)  
Min.  
Typ.  
Max. Units  
Item  
Test Conditions  
Symbol  
V(BR)DSS  
VGS(th)  
Drain-source breakdown voltaget  
Gate threshold voltage  
V
ID=1mA  
VGS=0V  
150  
V
ID=1mA  
VDS=VGS  
2.5  
3.0  
3.5  
100  
0.5  
100  
µA  
mA  
nA  
VDS=150V  
Tch=25°C  
1
Zero gate voltage drain current  
IDSS  
VGS=0V  
Tch=125°C  
0.1  
VGS=±30V  
Gate-source leakage current  
Drain-source on-state resistance  
Forward transcondutance  
Input capacitance  
10  
VDS=0V  
IGSS  
RDS(on)  
gfs  
ID=20A VGS=10V  
ID=20A VDS=25V  
37  
43  
m  
S
12.5  
25.0  
2650  
3980  
830  
360  
32  
Ciss  
Coss  
Crss  
td(on)  
tr  
VDS=25V  
VGS=0V  
pF  
ns  
Output capacitance  
550  
240  
21  
Reverse transfer capacitance  
Turn-on time ton  
f=1MHz  
VCC=48V ID=40A  
VGS=10V  
95  
142  
173  
90  
Turn-off time toff  
115  
60  
td(off)  
tf  
RGS=10 Ω  
40  
A
Avalanche capability  
L=100µH Tch=25°C  
IAV  
0.97  
180  
1.30  
1.46  
V
Diode forward on-voltage  
Reverse recovery time  
Reverse recovery charge  
IF=40A VGS=0V Tch=25°C  
IF=40A VGS=0V  
VSD  
ns  
µC  
trr  
Qrr  
-di/dt=100A/µs  
Tch=25°C  
Thermalcharacteristics  
Item  
Min.  
Typ.  
Max. Units  
Symbol  
Test Conditions  
Rth(ch-c)  
channel to case  
0.93  
°C/W  
Thermal resistance  
Rth(ch-a)  
channel to ambient  
75.0  
°C/W  
1
2SK3218-01  
FUJI POWER MOSFET  
Characteristics  
Safe operating area  
Power Dissipation  
PD=f(Tc)  
ID=f(VDS):Single Pulse(D=0),Tc=25°C  
103  
102  
101  
100  
10-1  
150  
125  
100  
75  
t=  
1µs  
10µs  
100µs  
1ms  
D.C.  
10ms  
50  
100ms  
t
t
D=  
T
25  
T
0
0
25  
50  
75  
100  
125  
150  
10-1  
100  
101  
102  
103  
Tc [°C]  
VDS [V]  
Typical transfer characteristics  
ID=f(VGS):80µs pulse test,VDS=25V,Tch=25°C  
Typical output characteristics  
ID=f(VDS):80µs pulse test,Tc=25°C  
100  
80  
60  
40  
20  
0
15V  
10V  
VGS=20V  
100  
10  
1
7.0V  
6.5V  
6.0V  
5.5V  
5.0V  
4.5V  
0.1  
0
2
4
6
8
10  
0
1
2
3
4
5
VGS [V]  
VDS [V]  
Typical Drain-Source on-State Resistance  
RDS(on)=f(ID):80µs pulse test,Tch=25°C  
Typical forward transconductance  
gfs=f(ID):80µs pulse test,VDS=25V,Tch=25°C  
0.12  
0.10  
0.08  
0.06  
0.04  
0.02  
0.00  
102  
101  
100  
10-1  
VGS=  
4.5V  
5.0V  
5.5V  
6.0V  
6.5V  
7.0V  
10V  
15V  
20V  
10-1  
100  
101  
102  
0
20  
40  
60  
80  
100  
120  
ID [A]  
ID [A]  
2
2SK3218-01  
FUJI POWER MOSFET  
Gate Threshold Voltage vs. Tch  
VGS(th)=f(Tch):VDS=VGS,ID=1mA  
Drain-source on-state resistance  
RDS(on)=f(Tch):ID=20A,VGS=10V  
120  
100  
80  
60  
40  
20  
0
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
max.  
typ.  
max.  
min.  
typ.  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
Tch [°C]  
Tch [°C]  
Typical Gate Charge Characteristics  
VGS=f(Qg):ID=40A,Tch=25°C  
Typical capacitances  
C=f(VDS):VGS=0V,f=1MHz  
100n  
10n  
1n  
150  
30  
VDS  
125  
100  
75  
50  
25  
0
25  
20  
15  
10  
5
VGS  
Vcc=120V  
75V  
30V  
Ciss  
Coss  
Crss  
0
100p  
10-2  
10-1  
100  
101  
102  
0
20  
40  
60  
80  
100  
120  
140  
160  
180  
200  
VDS [V]  
Qg [nC]  
Typical Forward Characteristics of Reverse Diode  
-ID=f(VSD):80µs pulse test,Tch=25°C  
Typical Switching Characteristics vs. ID  
t=f(ID):Vcc=48V,VGS=10V,RG=10  
104  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
103  
102  
101  
td(off)  
tf  
tr  
10V  
VGS=0V  
1.0  
5V  
td(on)  
10-1  
100  
101  
102  
0.0  
0.2  
0.4  
0.6  
VSD [V]  
0.8  
1.2  
1.4  
ID [A]  
3
2SK3218-01  
FUJI POWER MOSFET  
Transient Thermal Impedance  
Maximum Avalanche Current vs. starting Tch  
I(AV)=f(starting Tch),Non Repetitive  
Zth(ch-c)=f(t):D=t/T  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
101  
100  
D=0.5  
0.2  
0.1  
-1  
10  
0.05  
0.02  
-2  
10  
0.01  
0
t
t
D=  
T
T
-3  
10  
-6  
10  
-5  
10  
-4  
10  
10-3  
10-2  
10-1  
100  
t [sec]  
0
0
25  
50  
75  
100  
125  
150  
Starting Tch [°C]  
Maximum Avalanche energy vs. starting Tch  
Eas=f(starting Tch):Vcc=24V,AIV<=40A,Non-Repetitive  
500  
400  
300  
200  
100  
0
0
25  
50  
75  
100  
125  
150  
Starting Tch [°C]  
4
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PANASONIC

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