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IXTH50P085

型号:

IXTH50P085

描述:

标准功率MOSFET[ Standard Power MOSFET ]

品牌:

IXYS[ IXYS CORPORATION ]

页数:

4 页

PDF大小:

543 K

IXTH 50P085  
Standard Power MOSFET  
VDSS = -85 V  
ID25 = -50 A  
RDS(on) = 55 mΩ  
P-Channel Enhancement Mode  
Avalanche Rated  
Symbol  
TestConditions  
Maximum Ratings  
TO-247 AD  
VDSS  
VDGR  
TJ = 25°C to 150°C  
TJ = 25°C to 150°C; RGS = 1 MΩ  
-85  
-85  
V
V
VGS  
Continuous  
Transient  
20  
30  
V
V
D (TAB)  
VGSM  
ID25  
IDM  
IAR  
TC = 25°C  
TC = 25°C, pulse width limited by TJ  
TC = 25°C  
-50  
-200  
-50  
A
A
A
G = Gate,  
S = Source,  
D=Drain,  
TAB = Drain  
EAR  
PD  
TC = 25°C  
TC = 25°C  
30  
mJ  
W
300  
TJ  
-55 ... +150  
150  
-55 ... +150  
°C  
°C  
°C  
Features  
TJM  
Tstg  
International standard package  
JEDEC TO-247 AD  
TL  
Maximumleadtemperatureforsoldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Low RDS (on) HDMOSTM process  
Rugged polysilicon gate cell structure  
Md  
Mountingtorque  
1.13/10 Nm/lb.in.  
Unclamped Inductive Switching (UIS)  
Weight  
6
g
rated  
Low package inductance (<5 nH)  
- easy to drive and to protect  
Applications  
Symbol  
VDSS  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
High side switching  
Push-pull amplifiers  
DC choppers  
min. typ. max.  
VGS = 0 V, ID = -250 µA  
-85  
V
Automatic test equipment  
VGS(th)  
IGSS  
VDS = VGS, ID = -250 µA  
-3.0  
-5.0  
100  
-25  
V
nA  
µA  
VGS = 20 VDC, VDS = 0  
Advantages  
Easy to mount with 1 screw  
(isolatedmountingscrewhole)  
Space savings  
IDSS  
VDS = 0.8 • VDSS  
VGS = 0 V  
T = 25°C  
TJJ = 125°C  
-1 mA  
RDS(on)  
VGS = -10 V, ID = 0.5 • ID25  
55 mΩ  
High power density  
© 2004 IXYS All rights reserved  
DS99140A(10/04)  
IXTH 50P085  
Symbol  
gfs  
TestConditions  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
TO-247 AD Outline  
VDS = -10 V; ID = ID25, pulse test  
8
16  
S
Ciss  
Coss  
Crss  
4200  
1720  
750  
pF  
pF  
pF  
1
2
3
VGS = 0 V, VDS = -25 V, f = 1 MHz  
td(on)  
tr  
td(off)  
tf  
46  
39  
86  
38  
ns  
ns  
ns  
ns  
VGS = -10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
Terminals: 1 - Gate  
3 - Source  
2 - Drain  
RG = 4.7 (External)  
Tab - Drain  
Dim.  
Millimeter  
Min. Max.  
Inches  
Min. Max.  
Qg(on)  
Qgs  
150  
36  
nC  
nC  
nC  
A
A12  
4.7  
2.2  
2.2  
5.3  
2.54  
2.6  
.185 .209  
.087 .102  
.059 .098  
A
VGS = -10 V, VDS = 0.5 VDSS, ID = 0.5 ID25  
Qgd  
70  
b
b12  
1.0  
1.65  
2.87  
1.4  
2.13  
3.12  
.040 .055  
.065 .084  
.113 .123  
b
RthJC  
RthCS  
0.42  
K/W  
K/W  
C
D
E
.4  
.8  
.016 .031  
.819 .845  
.610 .640  
0.25  
20.80 21.46  
15.75 16.26  
e
5.20  
5.72 0.205 0.225  
L
19.81 20.32  
4.50  
.780 .800  
.177  
L1  
P 3.55  
3.65  
.140 .144  
Q
5.89  
4.32  
6.40 0.232 0.252  
R
S
5.49  
.170 .216  
242 BSC  
Source-DrainDiode  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
6.15 BSC  
Symbol  
TestConditions  
IS  
VGS = 0  
-25  
-200  
-3  
A
ISM  
VSD  
Repetitive; pulse width limited by TJM  
A
V
IF = IS, V = 0 V,  
Pulse teGsSt, t 300 µs, duty cycle d 2 %  
trr  
IF = IS, di/dt = 100 A/µs, VR = -50 V  
180  
ns  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered by  
oneormoreofthefollowingU.S.patents:  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,381,025  
5,486,715  
6,162,665  
6,259,123B1  
6,306,728 B1  
6,404,065B1  
6,534,343  
6,583,505  
6,683,344  
6,710,405B2  
6,710,463  
6,727,585  
6,759,692  
IXTH 50P085  
Fig. 1. Output Characteristics  
@ 25 Deg. C  
Fig. 2. Extended Output Characteristics  
@ 25 deg. C  
-140  
-120  
-100  
-80  
-60  
-40  
-20  
0
-50  
-45  
-40  
-35  
-30  
-25  
-20  
-15  
-10  
-5  
VGS = -10V  
VGS = -10V  
-9V  
-8V  
-7V  
-9V  
-8V  
-7V  
-6V  
-5V  
-6V  
-5V  
0
0
-2  
-4 -6  
-8 -10 -12 -14 -16 -18 -20  
0
-0.5  
-1  
-1.5  
-2  
-2.5  
VD S - Volts  
VD S - Volts  
Fig. 3. Output Characteristics  
@ 125 Deg. C  
Fig. 4. RDS(on) Normalized to ID25 Value vs.  
Junction Temperature  
-50  
-45  
-40  
-35  
-30  
-25  
-20  
-15  
-10  
-5  
2
1.8  
1.6  
1.4  
1.2  
1
VGS = -10V  
-9V  
VGS = -10V  
-8V  
ID = -50A  
-7V  
-6V  
-5V  
ID = -25A  
0.8  
0.6  
0
0
-1  
-2  
-3  
-4  
-5  
-50  
-25  
0
25  
50  
75  
100 125 150  
VD S - Volts  
TJ - Degrees Centigrade  
Fig. 5. RDS(on) Normalized to ID25  
Value vs. ID  
Fig. 6. Drain Current vs. Case  
Temperature  
2.4  
2.2  
2
-55  
-50  
-45  
-40  
-35  
-30  
-25  
-20  
-15  
-10  
-5  
VGS = -10V  
1.8  
1.6  
1.4  
1.2  
1
TJ = 125ºC  
TJ = 25ºC  
0.8  
0
0
-25  
-50  
-75  
-100  
-125  
-50  
-25  
0
25  
50  
75  
100 125 150  
I D - Amperes  
TC - Degrees Centigrade  
© 2004 IXYS All rights reserved  
IXTH 50P085  
Fig. 7. Input Admittance  
Fig. 8. Transconductance  
40  
35  
30  
25  
20  
15  
10  
5
-150  
-125  
-100  
-75  
-50  
-25  
0
TJ = -40ºC  
25ºC  
125ºC  
TJ = -40ºC  
25ºC  
125ºC  
0
-4  
-5  
-6  
-7  
-8  
-9  
-10  
-11  
0
-25  
-50  
-75  
-100  
-125  
-150  
VG S - Volts  
I D - Amperes  
Fig. 10. Gate Charge  
Fig. 9. Source Current vs. Source-To-  
Drain Voltage  
-10  
-9  
-8  
-7  
-6  
-5  
-4  
-3  
-2  
-1  
0
-150  
-125  
-100  
-75  
-50  
-25  
0
VDS = -50V  
ID = -25A  
IG = -1mA  
TJ = 125ºC  
TJ = 25ºC  
-0.5  
-1  
-1.5  
-2  
-2.5  
-3  
-3.5  
-4  
0
20  
40  
60  
80  
100  
120  
140  
Q G - nanoCoulombs  
VS D - Volts  
Fig. 12. Maximum Transient Thermal  
Resistance  
Fig. 11. Capacitance  
6000  
5000  
4000  
3000  
2000  
1000  
0
1.00  
0.10  
0.01  
f = 1MHz  
C
iss  
C
oss  
C
rss  
-20  
1
10  
100  
1000  
0
-5  
-10  
-15  
-25  
-30  
-35  
-40  
VD S - Volts  
Pulse Width - milliseconds  
IXYS reserves the right to change limits, test conditions, and dimensions.  
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