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QT100_07

型号：

QT100_07

描述：

电荷转移QTOUCH⑩ IC[ CHARGE-TRANSFER QTOUCH⑩ IC ]

品牌：

QUANTUM[ QUANTUM RESEARCH GROUP ]

页数：

12 页

PDF大小：

66 K

下载PDF手册
LQ  
QT100  
HARGE-TRANSFER QTOUCH™ IC  
C
This datasheet is applicable to all revision 3 chips  
The QT100 charge-transfer (‘QT’) touch sensor is a self-contained digital IC capable  
of detecting near-proximity or touch. It will project a touch or proximity field through  
any dielectric like glass, plastic, stone, ceramic, and even most kinds of wood. It can  
also turn small metal-bearing objects into intrinsic sensors, making them responsive  
to proximity or touch. This capability, coupled with its ability to self-calibrate, can lead  
to entirely new product concepts.  
OUT  
VSS  
1
2
3
6
5
4
SYNC/MODE  
VDD  
It is designed specifically for human interfaces, like control panels, appliances, toys,  
lighting controls, or anywhere a mechanical switch or button may be found.  
SNSK  
SNS  
AT A GLANCE  
Number of keys:  
One  
Technology:  
Patented spread-spectrum charge-transfer (direct mode)  
Key outline sizes:  
Key spacing:  
6mm x 6mm or larger (panel thickness dependent); widely different sizes and shapes possible  
7mm center to center or more (panel thickness dependent)  
Solid or ring electrode shapes  
Electrode design:  
Layers required:  
Electrode materials:  
Electrode Substrates:  
Panel materials:  
Panel thickness:  
Key sensitivity:  
Interface:  
One  
Etched copper, silver, carbon, Indium Tin Oxide (ITO), Orgacon† ink  
PCB, FPCB, plastic films, glass  
Plastic, glass, composites, painted surfaces (low particle density metallic paints possible)  
Up to 50mm glass, 20mm plastic (electrode size dependent)  
Settable via capacitor  
Digital output, active high  
Moisture tolerance:  
Power:  
Good  
2V ~ 5V  
Package:  
6-pin SOT23-6 RoHS compliant  
Signal processing:  
Applications:  
Self-calibration, auto drift compensation, noise filtering  
Control panels, consumer appliances, toys, lighting controls, mechanical switch or button  
QTouch™ (patented Charge-transfer method)  
HeartBeat™ (monitors health of device)  
Patents:  
†
Orgacon is a registered trademark of Agfa-Gevaert N.V  
AVAILABLE OPTIONS  
TA  
SOT23-6  
-40ºC to +85ºC  
QT100-ISG  
LQ  
C
Copyright © 2006-2007 QRG Ltd  
QT100_3R0.08_0307  
Contents  
2.9 Output Features  
1 Overview  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
3
3
3
3
3
3
3
3
3
3
3
3
3
4
4
4
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5
5
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5
5
5
6
6
6
6
6
7
7
7
7
7
8
8
9
9
2.9.1 Output  
1.1 Introduction  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
2.9.2 HeartBeat™ Output  
1.2 Basic Operation  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
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2.9.3 Output Drive  
1.3 Electrode Drive  
1.4 Sensitivity  
3 Circuit Guidelines  
3.1 Application Note  
3.2 Sample Capacitor  
1.4.1 Introduction  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
1.4.2 Increasing Sensitivity  
1.4.3 Decreasing Sensitivity  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
3.3 Power Supply, PCB Layout  
. . . . . . . . . . . . . . . . . . . . . . . . . . . .  
2 Operation Specifics  
4 Specifications  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
2.1 Run Modes  
4.1 Absolute Maximum Specifications  
4.2 Recommended Operating Conditions  
4.3 AC Specifications  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
2.1.1 Introduction  
2.1.2 Fast Mode  
2.1.3 Low Power Mode  
2.1.4 SYNC Mode  
4.4 Signal Processing  
4.5 DC Specifications  
2.2 Threshold  
4.6 Mechanical Dimensions  
4.7 Marking  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
2.3 Max On-duration  
2.4 Detect Integrator  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
4.8 Moisture Sensitivity Level (MSL)  
. . . . . . . . . . . . . . . . . . . . . . . . .  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.5 Forced Sensor Recalibration  
2.6 Drift Compensation  
5 Datasheet Control  
. . . . . . . . . . . . . . . . . . . . . . . . . . .  
5.1 Changes  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
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. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
2.7 Response Time  
2.8 Spread Spectrum  
5.2 Numbering Convention  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
lQ  
2
QT100_3R0.08_0307  
Figure 1.1 Basic Circuit Configuration  
1 Overview  
1.1 Introduction  
The QT100 is a digital burst mode charge-transfer (QT)  
sensor designed specifically for touch controls; it includes all  
hardware and signal processing functions necessary to  
provide stable sensing under a wide variety of changing  
conditions. Only a single low cost, noncritical capacitor is  
required for operation.  
VDD  
SENSE  
ELECTRODE  
5
VDD  
Rs  
1
3
4
OUT  
SNSK  
SNS  
Cs  
6
Figure 1.1 shows a basic circuit using the device.  
SYNC/MODE  
Cx  
VSS  
2
1.2 Basic Operation  
The QT100 employs bursts of charge-transfer cycles to  
acquire its signal. Burst mode permits power consumption in  
the microamp range, dramatically reduces RF emissions,  
lowers susceptibility to EMI, and yet permits excellent  
response time. Internally the signals are digitally processed to  
reject impulse noise, using a 'consensus' filter which requires  
Note: A bypass capacitor should be tightly wired  
between Vdd and Vss and kept close to QT100 pin 5.  
The value of Cs also has a dramatic effect on sensitivity, and  
four consecutive confirmations of a detection before the output this can be increased in value with the trade-off of slower  
is activated.  
response time and more power. Increasing the electrode's  
surface area will not substantially increase touch sensitivity if  
its diameter is already much larger in surface area than the  
object being detected. Panel material can also be changed to  
one having a higher dielectric constant, which will better help  
to propagate the field.  
The QT switches and charge measurement hardware  
functions are all internal to the QT100.  
1.3 Electrode Drive  
For optimum noise immunity, the electrode should only be  
connected to SNSK.  
Ground planes around and under the electrode and its SNSK  
trace will cause high Cx loading and destroy gain. The  
possible signal-to-noise ratio benefits of ground area are more  
than negated by the decreased gain from the circuit, and so  
ground areas around electrodes are discouraged. Metal areas  
near the electrode will reduce the field strength and increase  
Cx loading and should be avoided, if possible. Keep ground  
away from the electrodes and traces.  
In all cases the rule Cs >> Cx must be observed for proper  
operation; a typical load capacitance (Cx) ranges from 5-20pF  
while Cs is usually about 2-50nF.  
Increasing amounts of Cx destroy gain, therefore it is  
important to limit the amount of stray capacitance on both  
SNS terminals. This can be done, for example, by minimizing  
trace lengths and widths and keeping these traces away from  
power or ground traces or copper pours.  
1.4.3 Decreasing Sensitivity  
In some cases the QT100 may be too sensitive. In this case  
gain can be easily lowered further by decreasing Cs.  
The traces and any components associated with SNS and  
SNSK will become touch sensitive and should be treated with  
caution to limit the touch area to the desired location.  
2 Operation Specifics  
A series resistor, Rs, should be placed in line with SNSK to  
the electrode to suppress ESD and EMC effects.  
2.1 Run Modes  
1.4 Sensitivity  
2.1.1 Introduction  
The QT100 has three running modes which depend on the  
state of SYNC, pin 6 (high or low).  
1.4.1 Introduction  
The sensitivity on the QT100 is a function of things like the  
value of Cs, electrode size and capacitance, electrode shape  
and orientation, the composition and aspect of the object to be  
sensed, the thickness and composition of any overlaying  
panel material, and the degree of ground coupling of both  
sensor and object.  
2.1.2 Fast Mode  
The QT100 runs in Fast mode if the SYNC pin is permanently  
high. In this mode the QT100 runs at maximum speed at the  
expense of increased current consumption. Fast mode is  
useful when speed of response is the prime design  
requirement. The delay between bursts in Fast mode is  
approximately 1ms, as shown in Figure 2.2.  
1.4.2 Increasing Sensitivity  
In some cases it may be desirable to increase sensitivity; for  
example, when using the sensor with very thick panels having  
a low dielectric constant. Sensitivity can often be increased by  
using a larger electrode or reducing panel thickness.  
Increasing electrode size can have diminishing returns, as  
high values of Cx will reduce sensor gain.  
2.1.3 Low Power Mode  
The QT100 runs in Low Power (LP) mode if the SYNC line is  
held low. In this mode it sleeps for approximately 85ms at the  
end of each burst, saving power but slowing response. On  
detecting a possible key touch, it temporarily switches to Fast  
mode until either the key touch is confirmed or found to be  
spurious (via the detect integration process). It then returns to  
LP mode after the key touch is resolved as shown in  
Figure 2.1.  
lQ  
3
QT100_3R0.08_0307  
The SYNC pin is sampled at the end of each burst. If the  
device is in Fast mode and the SYNC pin is sampled high,  
then the device continues to operate in Fast mode  
(Figure 2.2). If SYNC is sampled low, then the device  
goes to sleep. From then on, it will operate in SYNC mode  
(Figure 2.1). Therefore, to guarantee entry into SYNC  
mode the low period of the SYNC signal should be longer  
than the burst length (Figure 2.3).  
Figure 2.1 Low Power Mode (SYNC held low)  
fast detect  
integrator  
~85ms  
SNSK  
sleep  
sleep  
sleep  
QT100  
However, once SYNC mode has been entered, if the  
SYNC signal consists of a series of short pulses (>10µs)  
then a burst will only occur on the leading edge of each  
pulse (Figure 2.4) instead of on each change of SYNC  
signal, as normal (Figure 2.3).  
SYNC  
OUT  
In SYNC mode, the device will sleep after each  
measurement burst (just as in LP mode) but will be  
awakened by a change in the SYNC signal in either  
direction, resulting in a new measurement burst. If SYNC  
remains unchanged for a period longer than the LP mode  
sleep period (about 85ms), the device will resume  
operation in either Fast or LP mode depending on the  
level of the SYNC pin (Figure 2.3).  
Figure 2.2 Fast Mode Bursts (SYNC held high)  
SNSK  
QT100  
There is no DI in SYNC mode (each touch is a detection)  
but the Max On-duration will depend on the time between  
SYNC pulses; see Sections 2.3 and 2.4. Recalibration  
timeout is a fixed number of measurements so will vary  
with the SYNC period.  
~1ms  
SYNC  
Figure 2.3 SYNC Mode (triggered by SYNC edges)  
2.2 Threshold  
The internal signal threshold level is fixed at 10 counts of  
change with respect to the internal reference level, which  
in turn adjusts itself slowly in accordance with the drift  
compensation mechanism.  
SNSK  
QT100  
sleep  
sleep  
sleep  
Revert to Fast Mode  
SYNC  
slow mode sleep period  
The QT100 employs a hysteresis dropout of two counts  
of the delta between the reference and threshold levels.  
SNSK  
QT100  
sleep  
sleep  
sleep  
Revert to Slow Mode  
2.3 Max On-duration  
slow mode sleep period  
If an object or material obstructs the sense pad the signal  
may rise enough to create a detection, preventing further  
operation. To prevent this, the sensor includes a timer  
which monitors detections. If a detection exceeds the  
timer setting the sensor performs a full recalibration. This is  
known as the Max On-duration feature and is set to ~80s (at  
3V). This will vary slightly with Cs and if SYNC mode is used.  
As the internal timebase for Max On-duration is determined by  
the burst rate, the use of SYNC can cause dramatic changes  
in this parameter depending on the SYNC pulse spacing.  
SYNC  
Figure 2.4 SYNC Mode (Short Pulses)  
SNSK  
QT100  
>10us  
>10us  
>10us  
2.4 Detect Integrator  
SYNC  
It is desirable to suppress detections generated by electrical  
noise or from quick brushes with an object. To accomplish  
this, the QT100 incorporates a ‘detect integration’ (DI) counter  
that increments with each detection until a limit is reached,  
after which the output is activated. If no detection is sensed  
prior to the final count, the counter is reset immediately to  
zero. In the QT100, the required count is four. In LP mode the  
device will switch to Fast mode temporarily in order to resolve  
the detection more quickly; after a touch is either confirmed or  
denied the device will revert back to normal LP mode  
operation automatically.  
2.1.4 SYNC Mode  
It is possible to synchronize the device to an external clock  
source by placing an appropriate waveform on the SYNC pin.  
SYNC mode can synchronize multiple QT100 devices to each  
other to prevent cross-interference, or it can be used to  
enhance noise immunity from low frequency sources such as  
50Hz or 60Hz mains signals.  
The DI can also be viewed as a 'consensus' filter, that  
requires four successive detections to create an output.  
lQ  
4
QT100_3R0.08_0307  
2.5 Forced Sensor Recalibration  
The QT100 has no recalibration pin; a forced  
recalibration is accomplished when the device is  
powered up or after the recalibration timeout.  
However, supply drain is low so it is a simple  
matter to treat the entire IC as a controllable load;  
driving the QT100's VDD pin directly from another  
logic gate or a microcontroller port will serve as  
both power and 'forced recal'. The source  
resistance of most CMOS gates and  
Figure 2.5 Drift Compensation  
Signal  
Hysteresis  
Threshold  
Reference  
microcontrollers are low enough to provide direct  
power without problem.  
Output  
2.6 Drift Compensation  
Signal drift can occur because of changes in Cx  
and Cs over time. It is crucial that drift be  
compensated for, otherwise false detections,  
nondetections, and sensitivity shifts will follow.  
2.7 Response Time  
The QT100's response time is highly dependent on run mode  
and burst length, which in turn is dependent on Cs and Cx.  
With increasing Cs, response time slows, while increasing  
levels of Cx reduce response time. The response time will  
also be a lot slower in LP or SYNC mode due to a longer time  
between burst measurements.  
Drift compensation (Figure 2.5). is performed by making the  
reference level track the raw signal at a slow rate, but only  
while there is no detection in effect. The rate of adjustment  
must be performed slowly, otherwise legitimate detections  
could be ignored. The QT100 drift compensates using a  
slew-rate limited change to the reference level; the threshold  
and hysteresis values are slaved to this reference.  
2.8 Spread Spectrum  
Once an object is sensed, the drift compensation mechanism  
ceases since the signal is legitimately high, and therefore  
should not cause the reference level to change.  
The QT100 modulates its internal oscillator by ±7.5 percent  
during the measurement burst. This spreads the generated  
noise over a wider band reducing emission levels. This also  
reduces susceptibility since there is no longer a single  
fundamental burst frequency.  
The QT100's drift compensation is 'asymmetric'; the reference  
level drift-compensates in one direction faster than it does in  
the other. Specifically, it compensates faster for decreasing  
signals than for increasing signals. Increasing signals should  
not be compensated for quickly, since an approaching finger  
could be compensated for partially or entirely before even  
approaching the sense electrode. However, an obstruction  
over the sense pad, for which the sensor has already made  
full allowance, could suddenly be removed leaving the sensor  
with an artificially elevated reference level and thus become  
insensitive to touch. In this latter case, the sensor will  
compensate for the object's removal very quickly, usually in  
only a few seconds.  
2.9 Output Features  
2.9.1 Output  
The output of the QT100 is active-high upon detection. The  
output will remain active-high for the duration of the detection,  
or until the Max On-duration expires, whichever occurs first. If  
a Max On-duration timeout occurs first, the sensor performs a  
full recalibration and the output becomes inactive (low) until  
the next detection.  
With large values of Cs and small values of Cx, drift  
compensation will appear to operate more slowly than with the  
converse. Note that the positive and negative drift  
compensation rates are different.  
Figure 2.6  
Getting HeartBeat pulses with a pull-up resistor  
Figure 2.7  
Using a micro to obtain HeartBeat pulses in either output state  
VDD  
HeartBeat™ Pulses  
5
Ro  
VDD  
PORT_M.x  
1
3
4
6
1
3
4
6
OUT  
SNSK  
OUT  
SNSK  
SNS  
Ro  
Microcontroller  
SNS  
SYNC/MODE  
VSS  
PORT_M.y  
SYNC/MODE  
2
lQ  
5
QT100_3R0.08_0307  
For more consistent sensing from unit to unit, 5 percent  
tolerance capacitors are recommended. X7R ceramic types  
can be obtained in 5 percent tolerance at little or no extra cost.  
2.9.2 HeartBeat™ Output  
The QT100 output has a HeartBeat™ ‘health’ indicator  
superimposed on it in both LP and SYNC modes. This  
operates by taking the output pin into a three-state mode for  
15µs once before every QT burst. This output state can be  
used to determine that the sensor is operating properly, or it  
can be ignored, using one of several simple methods.  
3.3 Power Supply, PCB Layout  
The power supply can range between 2.0V and 5.0V. At 3V  
current drain averages less than 500µA in Fast mode.  
The HeartBeat indicator can be sampled by using a pull-up  
resistor on the OUT pin, and feeding the resulting  
positive-going pulse into a counter, flip flop, one-shot, or other  
circuit. The pulses will only be visible when the chip is not  
detecting a touch.  
If the power supply is shared with another electronic system,  
care should be taken to ensure that the supply is free of digital  
spikes, sags, and surges which can adversely affect the  
QT100. The QT100 will track slow changes in VDD, but it can  
be badly affected by rapid voltage fluctuations. It is highly  
recommended that a separate voltage regulator be used just  
for the QT100 to isolate it from power supply shifts caused by  
other components.  
If the sensor is wired to a microcontroller as shown in  
Figure 2.7, the microcontroller can reconfigure the load  
resistor to either VSS or VDD depending on the output state of  
the QT100, so that the pulses are evident in either state.  
If desired, the supply can be regulated using a Low Dropout  
(LDO) regulator, although such regulators often have poor  
transient line and load stability. See Application Note  
AN-KD02 (see Section 3.1) for further information on power  
supply considerations.  
Electromechanical devices like relays will usually ignore the  
short Heartbeat pulse. The pulse also has too low a duty cycle  
to visibly affect LEDs. It can be filtered completely if desired,  
by adding an RC filter to the output, or if interfacing directly  
and only to a high-impedance CMOS input, by doing nothing  
or at most adding a small noncritical capacitor from OUT to  
Parts placement: The chip should be placed to minimize the  
SNSK trace length to reduce low frequency pickup, and to  
reduce stray Cx which degrades gain. The Cs and Rs  
resistors (see Figure 1.1) should be placed as close to the  
body of the chip as possible so that the trace between Rs and  
the SNSK pin is very short, thereby reducing the antenna-like  
ability of this trace to pick up high frequency signals and feed  
them directly into the chip. A ground plane can be used under  
the chip and the associated discretes, but the trace from the  
Rs resistor and the electrode should not run near ground to  
reduce loading.  
VSS.  
2.9.3 Output Drive  
The OUT pin is active high and can sink or source up to 2mA.  
When a large value of Cs (>20nF) is used the OUT current  
should be limited to <1mA to prevent gain-shifting side effects,  
which happen when the load current creates voltage drops on  
the die and bonding wires; these small shifts can materially  
influence the signal level to cause detection instability.  
For best EMC performance the circuit should be made entirely  
with SMT components.  
3 Circuit Guidelines  
3.1 Application Note  
Refer to Application Note AN-KD02, downloadable from the  
Quantum website for more information on construction and  
design methods. Go to http://www.qprox.com, click the  
Support tab and then Application Notes.  
Electrode trace routing: Keep the electrode trace (and the  
electrode itself) away from other signal, power, and ground  
traces including over or next to ground planes. Adjacent  
switching signals can induce noise onto the sensing signal;  
any adjacent trace or ground plane next to, or under, the  
electrode trace will cause an increase in Cx load and  
desensitize the device.  
Important Note: for proper operation a 100nF (0.1µF)  
ceramic bypass capacitor must be used directly between  
3.2 Sample Capacitor  
Charge sampler capacitor Cs should be a stable type, such as  
X7R ceramic or PPS film. The normal Cs range is from 2nF to  
50nF depending on the sensitivity required; larger values of  
Cs demand higher stability to ensure reliable sensing.  
V
V
DD and VSS, to prevent latch-up if there are substantial  
DD transients; for example, during an ESD event. The  
bypass capacitor should be placed very close to the  
device’s power pins.  
lQ  
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QT100_3R0.08_0307  
4 Specifications  
4.1 Absolute Maximum Specifications  
Operating temp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC  
Storage temp. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55OC to +125OC  
V
DD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to +5.25V  
Max continuous pin current, any control or drive pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20mA  
Short circuit duration to VSS, any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . infinite  
Short circuit duration to VDD, any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . infinite  
Voltage forced onto any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.6V to (VDD + 0.6) Volts  
4.2 Recommended Operating Conditions  
VDD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +2.0 to 5.0V  
Short-term supply ripple+noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5mV  
Long-term supply stability. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100mV  
Cs value. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2nF to 50nF  
Cx value. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 to 20pF  
4.3 AC Specifications  
V
DD = 3.0V, Cs = 10nF, Cx = 5pF, Ta = recommended range, unless otherwise noted  
Parameter  
Description  
Recalibration time  
Min  
Typ  
Max  
Units  
Notes  
Cs, Cx dependent  
T
RC  
PC  
250  
2
ms  
µs  
µs  
T
Charge duration  
Transfer duration  
±7.5% spread spectrum variation  
±7.5% spread spectrum variation  
TPT  
2
T
G
1
Time between end of burst and  
start of the next (Fast mode)  
1
ms  
ms  
TG  
2
Time between end of burst and  
start of the next (LP mode)  
85  
Increases with reducing VDD  
Cs and Cx dependent  
T
BL  
Burst length  
ms  
ms  
µs  
T
R
Response time  
Heartbeat pulse width  
100  
THB  
15  
4.4 Signal Processing  
Description  
Min  
Typ  
Max  
Units  
Notes  
Threshold differential  
Hysteresis  
10  
2
counts  
counts  
samples  
ms/level  
ms/level  
secs  
Consensus filter length  
Positive drift compensation rate  
Negative drift compensation rate  
Max on-duration  
4
2,000  
1,000  
80  
(At 3V) Will vary in SYNC mode and with  
V
DD  
lQ  
7
QT100_3R0.08_0307  
4.5 DC Specifications  
V
DD = 3.0V, Cs = 10nF, Cx = 5pF, Ta = recommended range, unless otherwise noted  
Parameter  
Notes  
Description  
Min  
Typ  
Max  
Units  
V
DD  
Supply voltage  
2
5
5.25  
600  
V
I
DD  
Supply current  
µA  
Depending on supply and run mode  
Iddl  
Supply current, LP Mode  
2V  
3V  
5V  
9
15  
35  
µA  
V
DDS  
Supply turn-on slope  
Low input logic level  
High input logic level  
Low output voltage  
High output voltage  
Input leakage current  
Load capacitance range  
Acquisition resolution  
100  
2.2  
V/s  
V
Required for proper start-up  
V
IL  
0.8  
0.6  
V
HL  
OL  
V
V
V
OUT, 4mA sink  
V
OH  
IL  
V
DD-0.7  
0
V
OUT, 1mA source  
I
±1  
100  
14  
µA  
pF  
bits  
C
X
A
R
9
4.6 Mechanical Dimensions  
D
e
L
E
Aa W  
02NN  
Pin 1  
ø
M
H
h
Package type: SOT23-6  
Millimeters  
Inches  
Symbol  
Min  
2.8  
2.6  
1.5  
0.9  
0.0  
-
Max  
3.10  
3.0  
Notes  
Min  
0.110  
0.102  
0.059  
0.035  
0
Max  
0.122  
0.118  
0.069  
0.051  
0.006  
-
Notes  
M
W
Aa  
H
h
1.75  
1.3  
0.15  
-
D
L
0.95 BSC  
-
0.038 BSC  
0.35  
0.35  
0.09  
0.5  
0.014  
0.014  
0.004  
0.02  
E
0.55  
0.2  
0.022  
0.008  
e
Ø
0º  
10º  
0º  
10º  
lQ  
8
QT100_3R0.08_0307  
4.7 Marking  
SOT23-6 Part Number  
Marking  
QT100-ISG  
02NN (where NN is variable)  
4.8 Moisture Sensitivity Level (MSL)  
MSL Rating  
Peak Body Temperature  
Specifications  
IPC/JEDEC J-STD-020C  
MSL1  
260OC  
lQ  
9
QT100_3R0.08_0307  
5 Datasheet Control  
5.1 Changes  
Changes this issue (datasheet rev 08)  
Section 2.1.3, 2.1.4, 2.3, 2.7  
Section 3.2  
Section 4.3, 4.4, 4.7  
Section 5 new  
5.2 Numbering Convention  
Part Number  
Datasheet Issue Number  
QT100_MXN.nn_mmyy  
Chip Revision  
(Where M= Major chip revision,  
Datasheet Release Date;  
(Where mm = Month, yy = Year)  
N = minor chip revision,  
X = Prereleased Product  
[or R = Released Product])  
A minor chip revision (N) is defined as a revision change which does not affect product functionality or datasheet.  
The value of N is only stated for released parts (R).  
lQ  
10  
QT100_3R0.08_0307  
NOTES:  
lQ  
11  
QT100_3R0.08_0307  
lQ  
Copyright © 2006-2007 QRG Ltd. All rights reserved  
Patented and patents pending  
Corporate Headquarters  
1 Mitchell Point  
Ensign Way, Hamble SO31 4RF  
Great Britain  
Tel: +44 (0)23 8056 5600 Fax: +44 (0)23 8045 3939  
www.qprox.com  
North America  
651 Holiday Drive Bldg. 5 / 300  
Pittsburgh, PA 15220 USA  
Tel: 412-391-7367 Fax: 412-291-1015  
The specifications set out in this document are subject to change without notice. All products sold and services supplied by QRG are subject  
to QRG’s Terms and Conditions of sale and services. QRG patents, trademarks and Terms and Conditions can be found online at  
http://www.qprox.com/about/legal.php. Numerous further patents are pending, one or more which may apply to this device or the applications  
thereof.  
QRG products are not suitable for medical (including lifesaving equipment), safety or mission critical applications or other similar purposes.  
Except as expressly set out in QRG's Terms and Conditions, no licenses to patents or other intellectual property of QRG (express or implied)  
are granted by QRG in connection with the sale of QRG products or provision of services. QRG will not be liable for customer product design  
and customers are entirely responsible for their products and applications which incorporate QRG's products.  
Developer: Martin Simmons  
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