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2STF2360

型号：

2STF2360

描述：

低压快速开关PNP功率晶体管[ Low voltage fast-switching PNP power transistors ]

品牌：

STMICROELECTRONICS[ ST ]

页数：

9 页

PDF大小：

188 K

下载PDF手册
2STF2360  
2STN2360  
Low voltage fast-switching PNP power transistors  
Features  
■ Very low collector-emitter satuaration voltage  
■ High current gain characteristic  
■ Fast-switching speed  
■ In Complance with the 2002/93/EC European  
2
Directive  
■ Surface mounting devices in medium power  
3
SOT-223 and SOT-89 packages  
2
■ Available in tape & reel packing  
1
SOT-223  
SOT-89  
Applications  
■ Emergency lighting  
■ Led  
Internal Schematic Diagram  
■ CCFL drivers (back lighting)  
■ Voltage regulation  
■ Relay driver  
Description  
The 2STF2360  
and 2STN2360 are  
PNP  
transistors manufactured using new “PB-HDC”  
(Power Bipolar High Density Current) technology.  
The resulting transistor shows exceptional high  
gain performances coupled with very low  
saturation voltage.  
Order Codes  
Part Number  
Marking  
Package  
Packaging  
2STF2360  
2STN2360  
2360  
SOT-89  
Tape & Reel  
Tape & Reel  
N2360  
SOT-223  
Rev.2  
March 2007  
1/9  
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to  
change without notice.  
www.st.com  
9
1 Absolute Maximum Ratings  
2STF2360 - 2STN2360  
1
Absolute Maximum Ratings  
Table 1.  
Symbol  
Absolute Maximum Rating  
Parameter  
Value  
2STF2360  
Unit  
2STN2360  
SOT-223  
SOT-89  
V
Collector-Base Voltage (I = 0)  
-60  
-60  
-6  
V
V
CBO  
E
V
Collector-Emitter Voltage (I = 0)  
CEO  
B
V
Emitter-Base Voltage  
Collector Current  
(I = 0)  
C
V
EBO  
I
-3  
A
C
I
Collector Peak Current (t < 5ms)  
-5  
A
CM  
P
I
Base Current  
-0.2  
-0.4  
A
B
I
Base Peak Current (t < 5ms)  
A
BM  
P
P
Total dissipation at T  
= 25°C  
1.4  
1.6  
W
°C  
°C  
TOT  
amb  
T
Storage Temperature  
-65 to 150  
150  
stg  
T
Max. Operating Junction Temperature  
J
Table 2.  
Symbol  
Thermal Data  
Parameter  
SOT-89  
SOT-223  
#
Thermal Resistance Junction-Ambient ______ ______Max  
89  
78  
°C/W  
R
thJ-amb  
2
Note:  
# Device mounted on a PCB area of 1 cm .  
2/9  
2STF2360 - 2STN2360  
2 Electrical Characteristics  
2
Electrical Characteristics  
Table 3.  
Symbol  
Electrical Characteristics (T  
= 25°C; unless otherwise specified)  
CASE  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Unit  
Collector Cut-off Current  
V
I
= -60V  
CB  
-100  
nA  
CBO  
(I = 0)  
E
Emitter Cut-off Current  
V
= -6V  
EB  
CE  
I
-100  
-730  
nA  
EBO  
(I = 0)  
C
V
V
= -2V  
I = -100mA  
Base-Emitter Voltage  
-630  
-670  
mV  
BE(on)  
C
Collector-Emitter Saturation  
Voltage  
I = -2A _ _  
I = -100mA  
V
-250  
-350  
-320  
-500  
mV  
mV  
C
B
CE(sat)  
I = -3A __ I = -150mA  
Note: 1  
C
B
V
I = -2A  
_
I = -100mA  
Base-Emitter Saturation  
Voltage  
BE(sat)  
C
B
-0.89  
280  
-1.2  
400  
V
Note: 1  
I = -100mA_  
V
V
= -2V  
= -2V  
h
DC Current Gain  
80  
C
CE  
FE  
I = -1A _  
160  
Note: 1  
C
CE  
RESISTIVE LOAD  
Delay Time  
t
10  
75  
15  
100  
350  
50  
ns  
ns  
ns  
ns  
d
I = -3A  
V
= -10V  
CC  
C
t
Rise Time  
r
t
Storage Time  
Fall Time  
250  
35  
s
t
f
f
I = -0.1A ___  
V
=-10V  
CE  
Transition Frequency  
130  
MHz  
T
C
Note: 1 Pulsed duration = 300 µs, duty cycle ≤1.5%.  
2.1  
Typical Characteristics (curves)  
Figure 1. DC Current Gain  
Figure 2. DC Current Gain  
3/9  
2 Electrical Characteristics  
2STF2360 - 2STN2360  
Figure 3. Collector Emitter Saturation Voltage Figure 4. Base Emitter Saturation Voltage  
Figure 5. Resistive Load Switching Times  
Figure 6. Resistive LoadSwitching Times  
Figure 7. Capacitance  
4/9  
2STF2360 - 2STN2360  
3 Package Mechanical Data  
3
Package Mechanical Data  
In order to meet environmental requirements, ST offers these devices in ECOPACK®  
packages. These packages have a Lead-free second level interconnect . The category of  
second level interconnect is marked on the package and on the inner box label, in compliance  
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also  
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are  
available at: www.st.com  
5/9  
3 Package Mechanical Data  
2STF2360 - 2STN2360  
SOT-89 MECHANICAL DATA  
mm  
mils  
TYP.  
DIM.  
MIN.  
TYP.  
MAX.  
1.6  
MIN.  
55.1  
17.3  
14.2  
13.8  
13.8  
173.2  
63.8  
90.2  
55.9  
115.0  
155.1  
35.0  
MAX.  
63.0  
A
B
1.4  
0.44  
0.36  
0.35  
0.35  
4.4  
0.56  
0.48  
0.44  
0.44  
4.6  
22.0  
B1  
C
18.9  
17.3  
C1  
D
17.3  
181.1  
72.0  
D1  
E
1.62  
2.29  
1.42  
2.92  
3.94  
0.89  
1.83  
2.6  
102.4  
61.8  
e
1.57  
3.07  
4.25  
1.2  
e1  
H
120.9  
167.3  
47.2  
L
P025H  
6/9  
2STF2360 - 2STN2360  
3 Package Mechanical Data  
SOT-223 MECHANICAL DATA  
mm  
inch  
DIM.  
MIN.  
TYP.  
MAX.  
1.80  
0.80  
3.10  
0.32  
6.70  
MIN.  
TYP.  
MAX.  
0.071  
0.031  
0.122  
0.013  
0.264  
A
B
0.60  
2.90  
0.24  
6.30  
0.70  
3.00  
0.26  
6.50  
2.30  
4.60  
3.50  
7.00  
0.024  
0.114  
0.009  
0.248  
0.027  
0.118  
0.010  
0.256  
0.090  
0.181  
0.138  
0.276  
B1  
c
D
e
e1  
E
3.30  
6.70  
3.70  
7.30  
10o  
0.130  
0.264  
0.146  
0.287  
10o  
H
V
A1  
0.02  
P008B  
4 Revision History  
2STF2360 - 2STN2360  
4
Revision History  
Date  
Revision  
Changes  
13-Sep-2006  
02-Mar-2007  
1
2
Initial Release  
New graphics have been added  
8/9  
2STF2360 - 2STN2360  
4 Revision History  
Please Read Carefully:  
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the  
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any  
time, without notice.  
All ST products are sold pursuant to ST’s terms and conditions of sale.  
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no  
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this  
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products  
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such  
third party products or services or any intellectual property contained therein.  
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED  
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED  
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS  
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.  
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT  
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING  
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,  
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS “AUTOMOTIVE  
GRADE” MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.  
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void  
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any  
liability of ST.  
ST and the ST logo are trademarks or registered trademarks of ST in various countries.  
Information in this document supersedes and replaces all information previously supplied.  
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.  
©2007 STMicroelectronics - All rights reserved  
STMicroelectronics group of companies  
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -  
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America  
www.st.com  
9/9  
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