Advanced Technical Information
PolarHVTM
Power MOSFET
IXTC 26N50P
VDSS = 500
ID25 = 13
RDS(on) = 260 mΩ
V
A
Electrically Isolated Tab,
N-Channel Enhancement Mode,
Avalanche Rated
Symbol
TestConditions
Maximum Ratings
ISOPLUS220TM(IXTC)
VDSS
VDGR
TJ = 25°C to 150°C
500
500
V
V
E153432
TJ = 25°C to 150°C; RGS = 1 MΩ
VGS
Continuous
Transient
20
30
V
V
VGSM
G
ID25
IDM
TC = 25°C
13
78
A
A
D
S
TC = 25°C, pulse width limited by TJM
Isolated Tab
IAR
TC = 25°C
26
A
EAR
EAS
TC = 25°C
TC = 25°C
40
mJ
J
G = Gate
S = Source
D = Drain
1.0
dv/dt
PD
IS ≤ IDM, di/dt ≤ 100 A/µs, VDD ≤ VDSS
TJ ≤ 150°C, RG = 4 Ω
,
10
V/ns
Features
TC = 25°C
100
W
z Silicon chip on Direct-Copper-Bond
substrate
TJ
TJM
Tstg
-55 ... +150
150
-55 ... +150
°C
°C
°C
- High power dissipation
- Isolated mounting surface
- 2500V electrical isolation
z Low drain to tab capacitance(<30pF)
TL
1.6 mm (0.062 in.) from case for 10 s
300
°C
VISOL
FC
50/60 Hz, RMS, t = 1, leads-to-tab
Mounting Force
2500
V~
Applications
z
11..65/2.5..15
N/lb
DC-DC converters
Battery chargers
Switched-mode and resonant-mode
power supplies
z
Weight
2
g
z
z
DC choppers
z AC motor control
Symbol
TestConditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
Min. Typ.
Max.
Advantages
z
Easy assembly
Space savings
VDSS
VGS(th)
IGSS
VGS = 0 V, ID = 250 µA
VDS = VGS, ID = 250µA
VGS = 30 VDC, VDS = 0
500
V
V
z
2.5
5.0
z
High power density
100
nA
IDSS
VDS = VDSS
VGS = 0 V
25
250
µA
µA
TJ = 125°C
RDS(on)
VGS = 10 V, ID = IT
260 mΩ
Pulse test, t ≤ 300 µs, duty cycle d ≤ 2 %
DS99227(10/04)
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