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LYY8SF-U1V2-36

型号：

LYY8SF-U1V2-36

品牌：

OSRAM[ OSRAM GMBH ]

页数：

22 页

PDF大小：

981 K

下载PDF手册
www.osram-os.com  
LY Y8SF  
Micro SIDELED® 3010  
Micro SIDELED is a SMT LED with side emission.  
Due to its low package height it is ideal for applica-  
tions in limited space environments.  
Applications  
— Electronic Equipment  
— White Goods  
Features:  
— Package: white SMT package, colorless clear silicone resin  
— Chip technology: Thinfilm  
— Typ. Radiation: 120° (Lambertian emitter)  
— Color: λdom = 590 nm (● yellow)  
— Optical efficacy: 53 lm/W  
— Corrosion Robustness Class: 1B  
Version 1.3 | 2018-02-12  
1
LY Y8SF  
Ordering Information  
Type  
Luminous Intensity 1)  
Ordering Code  
Q65110A8977  
IF = 20 mA  
Iv  
LY Y8SF-U1V2-36  
450 ... 1120 mcd  
Version 1.3 | 2018-02-12  
2
LY Y8SF  
Maximum Ratings  
Parameter  
Symbol  
Top  
Values  
Operating Temperature  
Storage Temperature  
Junction Temperature  
min.  
max.  
-40 °C  
100 °C  
Tstg  
min.  
max.  
-40 °C  
100 °C  
Tj  
IF  
max.  
125 °C  
Forward current  
TS = 25 °C  
min.  
max.  
5 mA  
30 mA  
Surge Current  
t ≤ 10 µs; D = 0.005 ; TS = 25 °C  
Reverse voltage 2)  
TS = 25 °C  
IFS  
max.  
max.  
100 mA  
12 V  
VR  
ESD withstand voltage  
VESD  
2kV  
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)  
Version 1.3 | 2018-02-12  
3
LY Y8SF  
Characteristics  
IF = 20 mA; TS = 25 °C  
Parameter  
Symbol  
Values  
Dominant Wavelength 3)  
IF = 20 mA  
λdom  
min.  
typ.  
max.  
583 nm  
590 nm  
595 nm  
Viewing angle at 50 % IV  
2
φ
typ.  
120 °  
Forward Voltage 4)  
IF = 20 mA  
VF  
min.  
typ.  
max.  
1.90 V  
2.20 V  
2.50 V  
Reverse current 2)  
VR = 12 V  
IR  
typ.  
max.  
0.01 µA  
10 µA  
Real thermal resistance junction/ambient 5), 6)  
Real thermal resistance junction/solderpoint 5)  
RthJA real  
RthJS real  
max.  
max.  
630 K / W  
350 K / W  
Version 1.3 | 2018-02-12  
4
LY Y8SF  
Brightness Groups  
Group  
Luminous Intensity 1)  
Luminous Intensity. 1)  
Luminous Flux 7)  
IF = 20 mA  
IF = 20 mA  
IF = 20 mA  
min.  
Iv  
max.  
Iv  
typ.  
ΦV  
U1  
U2  
V1  
V2  
450 mcd  
560 mcd  
710 mcd  
900 mcd  
560 mcd  
710 mcd  
900 mcd  
1120 mcd  
1500 mlm  
1900 mlm  
2400 mlm  
3000 mlm  
Wavelength Groups  
Group  
Dominant Wavelength 3)  
Dominant Wavelength 3)  
IF = 20 mA  
min.  
IF = 20 mA  
max.  
λdom  
λdom  
3
4
5
6
583 nm  
586 nm  
589 nm  
592 nm  
586 nm  
589 nm  
592 nm  
595 nm  
Version 1.3 | 2018-02-12  
5
LY Y8SF  
Group Name on Label  
Example: U1-3  
Brightness  
Wavelength  
3
U1  
Version 1.3 | 2018-02-12  
6
LY Y8SF  
7)  
Relative Spectral Emission  
Irel = f (  
λ
); IF = 20 mA; TA = 25 °C  
OHL03622  
100  
%
Irel  
80  
60  
40  
20  
0
Vλ  
yellow  
red  
400  
450  
500  
550  
600  
650  
nm  
700  
λ
7)  
Radiation Characteristics  
Irel = f (  
ϕ
); TA = 25 °C  
OHL01660  
40˚  
30˚  
20˚  
10˚  
0˚  
1.0  
ϕ
50˚  
0.8  
0.6  
0.4  
0.2  
0
60˚  
70˚  
80˚  
90˚  
100˚  
1.0  
0.8  
0.6  
0.4  
0˚  
20˚  
40˚  
60˚  
80˚  
100˚  
120˚  
Version 1.3 | 2018-02-12  
7
LY Y8SF  
7), 8)  
7), 8)  
Forward current  
Relative Luminous Intensity  
IF = f(VF); TA = 25 °C  
Iv/Iv(20 mA) = f(IF); TA = 25 °C  
OHL03618  
OHL03008  
102  
101  
mA  
IV  
IV(20 mA)  
IF  
5
100  
red  
yellow  
5
101  
10-1  
5
5
10-2  
100  
100  
5
101  
mA 102  
1.5  
1.7  
1.9  
2.1  
2.3 V 2.5  
IF  
VF  
Version 1.3 | 2018-02-12  
8
LY Y8SF  
7)  
7)  
Forward Voltage  
Relative Luminous Intensity  
∆VF = VF - VF(25 °C) = f(Tj); IF = 20 mA  
Iv/Iv(25 °C) = f(Tj); IF = 20 mA  
OHL03619  
OHL02667  
2.5  
0.25  
V
IV  
IV(25 ˚C)  
∆
VF  
2.0  
0.15  
0.1  
1.5  
1.0  
0.5  
0
yellow  
0.05  
0
red  
-0.05  
-0.1  
-0.15  
-0.2  
-60 -40 -20  
0
20 40 60 ˚C 100  
-60 -40 -20  
0
20 40 60 ˚C 100  
Tj  
Tj  
Version 1.3 | 2018-02-12  
9
LY Y8SF  
Max. Permissible Forward Current  
IF = f(T)  
OHL00090  
35  
mA  
IF  
30  
TS  
25  
TA  
20  
15  
10  
5
0
T
S temp. solder point  
TA temp. ambient  
0
20  
40  
60  
80 ˚C 100  
T
Permissible Pulse Handling Capability Permissible Pulse Handling Capability  
IF = f(tp); D: Duty cycle; TA = 25 °C  
IF = f(tp); D: Duty cycle; TA = 85 °C  
OHL00690  
OHL00689  
0.12  
A
0.25  
A
tP  
tP  
tP  
tP  
IF  
IF  
IF  
IF  
D
= T  
D
= T  
T
T
0.10  
0.08  
0.06  
0.04  
0.02  
0
0.20  
0.15  
0.10  
0.05  
0
D
=
D
=
0.005  
0.01  
0.02  
0.05  
0.1  
0.005  
0.01  
0.02  
0.05  
0.1  
0.2  
0.2  
0.5  
0.5  
1
1
10-5 10-4 10-3 10-2 10-1 100 101 s 102  
10-5 10-4 10-3 10-2 10-1 100 101 s 102  
tp  
tp  
Version 1.3 | 2018-02-12  
10  
LY Y8SF  
9)  
Dimensional Drawing  
0.25 (0.010)  
0.20 (0.008)  
(0.6 (0.024))  
0 ... 0.1 (0 ... 0.004)  
(0.4 (0.016))  
A
Light emitting area  
typ. 1.7 × 0.7  
C
Cathode  
0.7 (0.028)  
1.3 (0.051)  
1.1 (0.043)  
0.5 (0.020)  
1.2 (0.047)  
1.0 (0.039)  
GPLY6058  
Approximate Weight:  
Corrosion test:  
6.0 mg  
Class: 1B  
Test condition: 25°C / 75 % RH / 200ppb SO2, 200ppb NO2, 10ppb H2S,  
10ppb Cl2 / 21 days (EN 60068-2-60 (Method 4))  
Version 1.3 | 2018-02-12  
11  
LY Y8SF  
9)  
Recommended Solder Pad  
Bauteil positioniert  
Component location on pad  
A
C
C
A
0.8 (0.031)  
Padgeometrie für  
verbesserte Wärmeableitung  
Paddesign for improved  
heat dissipation  
Lötstopplack  
Solder resist  
OHPY1315  
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not  
suitable for ultra sonic cleaning.  
Version 1.3 | 2018-02-12  
12  
LY Y8SF  
Reflow Soldering Profile  
Product complies to MSL Level 4 acc. to JEDEC J-STD-020D.01  
OHA04525  
300  
˚C  
T
250  
T
245 ˚C  
p
240 ˚C  
tP  
tL  
217 ˚C  
200  
150  
tS  
100  
50  
25 ˚C  
0
0
50  
100  
150  
200  
250  
s
300  
t
Profile Feature  
Symbol  
Pb-Free (SnAgCu) Assembly  
Recommendation Maximum  
Unit  
K/s  
s
Minimum  
Ramp-up rate to preheat*)  
25 °C to 150 °C  
2
100  
2
3
120  
3
Time tS  
TSmin to TSmax  
Ramp-up rate to peak*)  
TSmax to TP  
tS  
60  
K/s  
Liquidus temperature  
TL  
tL  
217  
80  
°C  
s
Time above liquidus temperature  
Peak temperature  
100  
260  
30  
TP  
tP  
245  
20  
°C  
s
Time within 5 °C of the specified peak  
10  
temperature TP - 5 K  
Ramp-down rate*  
TP to 100 °C  
3
6
K/s  
Time  
480  
s
25 °C to TP  
All temperatures refer to the center of the package, measured on the top of the component  
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range  
Version 1.3 | 2018-02-12  
13  
LY Y8SF  
9)  
Taping  
4 (0.157)  
1.25 (0.049)  
1.5 (0.059)  
2 (0.079)  
0.9 (0.035)  
1.4 (0.055)  
0.3 (0.012) max.  
OHAY1515  
Version 1.3 | 2018-02-12  
14  
LY Y8SF  
10)  
Tape and Reel  
Reel dimensions [mm]  
A
W
Nmin  
W1  
W2 max  
Pieces per PU  
180 mm  
330 mm  
8 + 0.3 / - 0.1  
8 + 0.3 / - 0.1  
60  
60  
8.4 + 2  
8.4 + 2  
14.4  
14.4  
3000  
10000  
Version 1.3 | 2018-02-12  
15  
LY Y8SF  
Barcode-Product-Label (BPL)  
9)  
Dry Packing Process and Materials  
Moisture-sensitive label or print  
Barcode label  
M
A
R
S
O
Humidity indicator  
Barcode label  
.
D o n o t e a t  
A v o i d m e t a l c o n t a c t .  
D i s c a r d i f c i r c l e s o v e r r u n .  
b a g o p e n i n g  
.
r
P l e a s e c h e c k t h e H I C i m m i d i a t e l y a f t e  
t
c h e c k d o  
C o m p a r a t o r  
T
W E  
s
s
b a k e u n i t  
e x a m i n e  
I f w e t ,  
y
y
u
%
1
i f  
n
e c e s s a r  
b a k e u n i t  
e x a m i n e  
I f w e t ,  
u
n i t s , i f n e c e s s a r  
% 1 0  
c h a n g e d e s i c c a n t  
p a r t s s t l y d r y .  
I f w e t ,  
5 %  
M I L - I - 8 8 3 5  
H u m i d i t y I n d i c a t o r  
OSRAM  
Desiccant  
OHA00539  
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.  
Version 1.3 | 2018-02-12  
16  
LY Y8SF  
9)  
Transportation Packing and Materials  
Barcode label  
Barcode label  
0
0
-2  
-2  
-
1
P
2
:
-1  
Q
1
in  
:
ST  
C
B
in  
:
p
m
R
B
3
Y
M
6
in  
e
T
R
7
B
0
C
T
6
D
L
2
2
R
n
T
X
E
E
D
T
M
4
0
2
C
E
2
0
Y
L
2
6
T
S
P
O
a
a
l
8
1
L
2
T
3
it  
io  
: R  
-1  
Q
i
d
R
lt  
d
7
A
+
1
-
u
A
7
V
0
K
M
R
C
: P  
P
U
A
P
O
R
G
)
(G  
4
4
1
o
to  
8
: 0  
/
C
D
t
9
s
9
p
r
1
O
d
n
2
)
D
(9  
c
0
M
o
u
0
A
i
1
0
0
0
: 2  
R
4
c
O
3
2
1
H
: 2  
Y
S
N
O
m
H
e
C
T
)Q  
S
T
A
G
B
3
(
Q
)
2
P
: 1  
(6  
O
5
2
N
T
4
1
O
L
0
)
T
0
(1  
: 1  
1
O
N
D
O
R
P
)
(X  
0
-2  
0
-
1
-2  
P
:
-1  
1
Q
in  
:
ST  
C
B
2
in  
:
p
m
R
B
3
Y
M
6
in  
e
T
R
7
B
0
C
T
R
6
D
L
2
2
T
X
E
E
D
0
C
T
E
M
4
2
0
Y
2
6
T
l
a
S
a
2
8
1
L
O
2
n
io  
it  
T
3
: R  
-1  
Q
i
d
R
lt  
d
7
A
+
1
-
A
7
u
V
0
K
M
R
C
: P  
P
A
P
U
O
R
G
)
(G  
4
4
1
o
to  
8
: 0  
/C  
D
t
9
p
rs  
9
1
O
d
n
2
)
c
0
D
M
o
u
0
(9  
A
i
1
0
0
2
R
:
4
3
2
0
c
O
: 2  
)QTY  
(Q  
S
N
O
m
H
C
1
H
e
S
T
M
A
G
B
3
)
2
: 1  
P
(6  
A
O
5
2
N
T
4
O
1
R
S
L
0
)
T
0
(1  
: 1  
1
O
N
D
O
R
O
P
)
(X  
Packing  
Sealing label  
OHA02044  
Dimensions of transportation box in mm  
Width  
Length  
Height  
200 ± 5 mm  
352 ± 5 mm  
195 ± 5 mm  
352 ± 5 mm  
30 ± 5 mm  
33 ± 5 mm  
Version 1.3 | 2018-02-12  
17  
LY Y8SF  
Type Designation System  
Wavelength  
(λdom typ.)  
Emission Color  
Color coordinates according  
CIE 1931/Emission color:  
B:  
S:  
T:  
Y:  
R:  
O:  
G:  
470 nm  
633 nm  
528 nm  
587 nm  
625 nm  
606 nm  
570 nm  
blue  
W:  
white  
super red  
true green  
yellow  
red  
orange  
green  
Package Type  
CP: 560 nm  
pure green  
Y:  
Micro SIDELED  
L:  
Light  
emitting  
diode  
L
B
Y
8
7
C
´
Lead / Package Properties  
1:  
8:  
2808 height: 0,8 mm  
Reflector Standard  
Encapsulant Type / Lens Properties  
7:  
Colorless clear or white volume conversion  
(resin encapsulation)  
S:  
Silicone (with or without diffuser)  
Chip Technology:  
6:  
Standard InGalP  
C:  
F:  
G:  
ATON  
Thinfilm InGaAlP  
ThinGaN (Thinfilm InGaN)  
(Subcon: Sapphire)  
standard InGaN low current  
S:  
Version 1.3 | 2018-02-12  
18  
LY Y8SF  
Notes  
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of  
lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this  
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-  
sure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from  
these devices. As a matter of principle, however, it should be mentioned that intense light sources have a  
high secondary exposure potential due to their blinding effect. As is also true when viewing other bright light  
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-  
tion, annoyance, visual impairment, and even accidents, depending on the situation.  
Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver.  
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-  
fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro-  
duction, and use. LEDs that showed visible discoloration when tested using the described tests above did  
show no performance deviations within failure limits during the stated test duration. Respective failure limits  
are described in the IEC60810.  
For further application related informations please visit www.osram-os.com/appnotes  
Version 1.3 | 2018-02-12  
19  
LY Y8SF  
Disclaimer  
Disclaimer  
Language english will prevail in case of any discrepancies or deviations between the two language word-  
ings.  
Attention please!  
The information describes the type of component and shall not be considered as assured characteristics.  
Terms of delivery and rights to change design reserved. Due to technical requirements components may  
contain dangerous substances.  
For information on the types in question please contact our Sales Organization.  
If printed or downloaded, please find the latest version on the OSRAM OS webside.  
Packing  
Please use the recycling operators known to you. We can also help you – get in touch with your nearest  
sales office.  
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For  
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to  
invoice you for any costs incurred.  
Product safety devices/applications or medical devices/applications  
OSRAM OS components are not developed, constructed or tested for the application as safety relevant  
component or for the application in medical devices.  
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety  
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales  
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-  
nate the customer-specific request between OSRAM OS and Buyer and/or Customer.  
Version 1.3 | 2018-02-12  
20  
LY Y8SF  
Glossary  
1)  
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal  
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of  
k = 3).  
2)  
3)  
Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-  
tion is not allowed.  
Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-  
ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k =  
3).  
4)  
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an  
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage  
factor of k = 3).  
5)  
6)  
7)  
Thermal Resistance: Rth max is based on statistic values (6σ).  
Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)  
Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data  
or calculated correlations of technical parameters can only reflect statistical figures. These do not nec-  
essarily correspond to the actual parameters of each single product, which could differ from the typical  
data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical  
improvements, these typ. data will be changed without any further notice.  
8)  
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-  
ences between single LEDs within one packing unit.  
9)  
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and  
dimensions are specified in mm.  
10)  
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.  
Version 1.3 | 2018-02-12  
21  
LY Y8SF  
Published by OSRAM Opto Semiconductors GmbH  
Leibnizstraße 4, D-93055 Regensburg  
www.osram-os.com © All Rights Reserved.  
Version 1.3 | 2018-02-12  
22  
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