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DXW21HN5011BB

型号：

DXW21HN5011BB

品牌：

MURATA[ muRata ]

页数：

9 页

PDF大小：

266 K

下载PDF手册
Reference Only  
SpecNo.JEFK243A-0005A-01  
P1/9  
Micro Chip Transformer DXW21HN5011□□ Reference Specification  
1. Scope  
This reference specification applies to Micro Chip Transformer.  
2. Part Numbering  
(ex.)  
DX  
(1)  
W
21  
H
N
50 11  
(6) (7)  
B
L
(2) (3) (4) (5)  
(8) (9)  
(1) Micro Chip Transformer  
(2) Structure (W: Winding Type)  
(3) Dimension (L×W)  
(4) Type of Transformer (H: Balun)  
(5) Category  
(6) Port Impedance (50: 50ohm)  
(7) Impedance ratio (11: one to one)  
(8) Main Application (B: wireless applications)  
(9) Packing Code L:Taping / B:Bulk  
3. Electrical Specification 1  
Freq.  
Range  
Port  
Impedance  
[ohm]  
Insertion Loss  
[dB min.]  
at Freq. Range  
CMRR  
[dB min.]  
at Freq. Range  
DC  
Resistance  
[ohm max.]  
Customer  
Part Number  
Murata  
Part Number  
DXW21HN5011BL  
DXW21HN5011BB  
100-1000  
MHz  
50/50  
1.0  
10  
0.35  
Electrical Specification 2  
Rated  
Voltage  
[DCV]  
Withstand  
Voltage  
[DCV]  
Insulation  
Resistance  
[Mohm min.]  
20  
50  
10  
Operating Temperature : -40 to +85°C  
Storage Temperature : -40 to +85°C  
4. Standard Testing Condition  
<Unless otherwise specified>  
<In case of doubt>  
Temperature : 20 ± 2°C  
Humidity : 60 to 70%(RH)  
Temperature : Ordinary Temperature 15 to 35°C  
Humidity : Ordinary Humidity 25 to 85%(RH)  
Atmospheric Pressure : 86 to106kPa  
5. Style and Dimensions  
■Eqivalent Circuit  
■Dimension  
(2)  
B1  
(1)  
UB  
B2  
1.2±0.2  
(4)  
(3)  
2.0±0.2  
No Polarity  
(0.45)  
(2)  
(0.45)  
(1)  
■Unit Mass (typ.)  
Electrode  
() : Reference Value  
0.009g  
:
(in mm)  
6. Marking  
(4)  
(3)  
No Marking.  
MURATA MFG.CO.,LTD  
Reference Only  
SpecNo.JEFK243A-0005A-01  
P2/9  
7. Electrical Performance  
No.  
Item  
Specification  
Meet item 3.  
Definition and Measurement Method  
7.1 Insertion  
Insertion Loss is given by Sds21 mag. extracted from the below circuit.  
Loss  
(IL)  
IL[dB] = 20log10(Sds21)  
Where  
Sds21 is S-parameter of single mode stimulus - Differential mode response  
Parasitics and loss factors caused by the test board have to be removed.  
UB  
B1  
B2  
PORT1  
PORT2  
50Ω  
25Ω  
PORT3  
25Ω  
7.2 CMRR  
Meet item 3.  
CMRR is given by the following equation, S-parameters are extracted from  
the below circuit.  
CMRR[dB] = 20log10(Sds21/Scs21)  
Where  
Sds21 is S-parameter of single mode stimulus - Differential mode response  
Scs21 is S-parameter of single mode stimulus - Common mode response  
Parasitics and loss factors caused by the test board have to be removed.  
UB  
B1  
B2  
PORT1  
PORT2  
50Ω  
25Ω  
PORT3  
25Ω  
7.3 Withstand  
Voltage  
No damage.  
Test Voltage : 50V  
Time : 5 seconds  
Charge Current : 1mA max.  
UB  
B1  
B2  
Terminal to be tested  
Terminal to be tested  
DC  
Resistance  
(Rdc)  
7.4  
Meet item 3.  
Measuring current : 10mA max.  
(In case of doubt in the above mentioned standard condition, measure by  
4 terminal method.)  
UB  
B1  
Terminal to be tested  
Terminal to be tested  
B2  
B1  
UB  
B2  
Terminal to be tested  
Terminal to be tested  
Insulation  
Resistance  
(I.R.)  
7.5  
Meet item 3.  
Measuring voltage : Rated Voltage  
Measuring time : 1 minute max.  
UB  
B1  
B2  
Terminal to be tested  
Terminal to be tested  
MURATA MFG.CO.,LTD  
Reference Only  
SpecNo.JEFK243A-0005A-01  
P3/9  
8. Mechanical Performance  
No.  
Item  
Specification  
Test Method  
8.1 Appearance  
and  
Meet all dimension on item 5.  
Visual Inspection and measurement with microscope.  
Dimensions  
8.2 Bonding  
Strength  
No evidence of coming off  
substrate.  
Products shall not be  
mechanical damaged.  
It shall be soldered on the substrate.  
Applying Force(F) : 5N  
Applying Time : 5±1seconds  
Pressure  
Substrate  
Product  
Test board fixture  
8.3  
Meet Table 1.  
Table 1  
It shall be soldered on the Glass-epoxy substrate.  
Bending  
Strength  
Deflection : 2mm  
(t=1.0mm).  
Keeping time : 5 seconds  
Speed of Applying Force : 0.5mm/s  
Appearance  
IL  
No damaged  
Meet Item 3.  
Pressure jig  
CMRR  
R230  
F
DC Resistance  
I.R.  
Deflection  
Product  
Withstand  
Voltage  
45  
45  
8.4  
Drop  
It shall be dropped on concrete or steel board.  
Method : free fall  
Height : 1 m  
The Number of Times : 3 times  
8.5 Vibration  
It shall be soldered on the substrate.  
Oscillation Frequency : 10 to 55 to 10Hz for 1 minute  
Total Amplitude : 1.5mm  
Testing Time : A period of 2 hours in each of 3  
mutually perpendicular directions. (Total 6 hours)  
Flux:Ethanol solution of rosin,25(wt)% includes  
activator equivalent to 0.06 to 0.10(wt)% chlorine  
Pre-Heating : 80 to 120°C 1minute  
The electrodes shall be at least  
90% covered with new solder  
coating.  
8.6 Solderability  
Solder : Sn-3.0Ag-0.5Cu  
Solder Temperature : 245±3°C  
Immersion Time : 4±1 seconds  
Immersion and emersion rates : 25mm/s  
Flux : Ethanol solution of rosin,25(wt)%  
includes activator equipment to 0.06 to  
0.10(wt)% chlorine  
8.7 Resistance  
to Soldering  
Heat  
Meet Table 1.  
Pre-Heating : 80 to 120°C ,1minute  
Solder : Sn-3.0Ag-0.5Cu  
Solder Temperature : 260±5°C  
Immersion Time : 5±0.5 seconds  
Immersion and emersion rates : 25mm/s  
Then measured after exposure in the room  
condition for 4 to 48 hours.  
MURATA MFG.CO.,LTD  
Reference Only  
SpecNo.JEFK243A-0005A-01  
P4/9  
9. Environmental Performance(Products shall be soldered on the substrate.)  
No.  
Item  
Specification  
Meet Table 1.  
Test Method  
9.1 Temperature  
Cycle  
1 Cycle  
Step 1 -40°C(+0°C,-3°C) / 30±3 min  
Step 2 Ordinary Temp. / 10 to 15 minutes  
Step 3 +85°C(+3°C,-0°C) / 30±3 min  
Step 4 Ordinary Temp. / 10 to 15 minutes  
Total of 10 cycles  
Then measured after exposure in the  
room condition for 4 to 48 hours  
9.2 Humidity  
9.3 Heat life  
Temperature : 40±2°C  
Humidity : 90~95%(RH)  
Time : 1000(+48 hours,-0 hours)  
Then measured after exposure in the  
room condition for 4 to 48 hours.  
Temperature : 85±2°C  
Applying Voltage : 2times for Rated Voltage  
Time : 1000(+48 hours,-0 hours)  
Then measured after exposure in the  
room condition for 4 to 48 hours.  
9.4 Cold  
Resistance  
Temperature : -40± 2°C  
Time : 1000(+48 hours,-0 hours)  
Then measured after exposure in the  
room condition for 4 to 48 hours.  
10. Specification of Packaging  
10.1 Appearance and Dimensions ( 8mm-wide,Plastic tape)  
Sprocket Hole  
1.5± 0.1  
φ
4.0±0.1  
2.0±0.05  
0.25±0.05  
0
*Dimension of the Cavity is measured at  
the bottom side.  
1.1±0.1  
4.0±0.1  
1.55±0.1  
Cavity  
(in mm)  
Direction of feed  
10.2 Specification of Taping  
(1)Packing quantity(Standard quantity) 3000 pcs. / reel  
(2)Packing Method  
Products shall be packaged in each embossed cavity of plastic tape and sealed with cover tape.  
(3) Spliced point  
The cover tape have no spliced point.  
(4) Sprocket Hole  
The sprocket holes are to the right as the tape is pulled toward the user.  
(5)Missing components number  
Missing components number within 0.1% of the number per reel or 1 pc, whichever is greater, and are not  
continuous. The specified quantity per reel is kept.  
10.3 Pull Strength of the Tape Package  
Plastic Tape  
Cover Tape  
5N min.  
10N min.  
165 to 180 degree  
10.4 Peeling force of the Cover Tape  
F
Cover tape  
Plastic tape  
0.2 to 0.7N(Minimum value is Typical)  
Peeling verosity is 300 mm / min  
MURATA MFG.CO.,LTD  
Reference Only  
SpecNo.JEFK243A-0005A-01  
P5/9  
10.5 Dimensions of Leader-tape, Trailer and Reel  
Leader  
Trailer  
160 min.  
2.0±0.5  
190 min.  
210 min.  
Label  
Empty tape Top tape  
φ
13.0±0.2  
φ
60± 10  
9± 10  
13±1.4  
φ
21.0±0.8  
Direction of feed  
φ
180±03  
10.6 Marking for reel  
Customer part number, MURATA part number, Inspection number(∗1), RoHS Marking(∗2), Quantity, etc  
∗1) « Expression of Inspection No. »  
□□ OOOO ×××  
(1) (2) (3)  
(1) Factory Code  
(2) Date  
First digit  
: Year / Last digit of year  
Second digit  
: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O,N,D  
Third, Fourth digit : Day  
(3) Serial No.  
∗2) « Expression of RoHS Marking »  
ROHS – Y (△)  
(1) (2)  
(1) RoHS regulation conformity parts.  
(2) MURATA classification number  
10.7 Marking for Outside package  
Customer name Purchasing Order Number, Customer Part Number, MURATA part number,  
RoHS Marking (∗2), Quantity, etc  
10.8 Specification of Outer Case  
Outer Case Dimensions  
Standard Reel Quantity in Outer Case  
(Reel)  
Label  
(mm)  
W
D
H
H
186  
186  
93  
5
D
∗ Above Outer Case size is typical. It depends on a quantity of an order.  
W
!
11. △Caution  
11.1 Mounting Direction  
Mount products in right direction.  
Wrong direction which is 90°rotated from right direction causes not only open or short circuit but also  
flames or other serious trouble.  
Ｚ
Ｚ
right direction  
wrong direction  
11.2 Limitation of Application  
Please contact us before using our products for the applications listed below which require especially  
high reliability for the prevention of defects which might directly cause damage to the third party's life, body  
or property.  
(1) Aircraft equipment  
(6) Transportation equipment (vehicles, trains, ships, etc.)  
(7) Traffic signal equipment  
(8) Disaster prevention / crime prevention equipment  
(9) Data-processing equipment  
(10) Applications of similar complexity and / or reliability  
requirements to the applications listed in the above.  
(2) Aerospace equipment  
(3) Undersea equipment  
(4) Power plant control equipment  
(5) Medical equipment  
MURATA MFG.CO.,LTD  
Reference Only  
SpecNo.JEFK243A-0005A-01  
P6/9  
12. Notice  
Products can only be soldered with reflow.  
This product is designed for solder mounting.  
Please consult us in advance for applying other mounting method such as conductive adhesive.  
12.1 Flux and Solder  
Flux  
Use rosin-based flux, (with converting chlorine content 0.06 to 0.1(wt)%. ),  
but not highly acidic flux  
(with Halogen content exceeding 0.2(wt)% conversion to chlorine).  
Do not use water-soluble flux.  
Solder  
Use Sn-3.0Ag-0.5Cu solder  
12.2 Assembling  
<Exclusive use of Reflow soldering>  
Flow soldering may cause deterioration in insulation resistance.  
So, reflow soldering shall be applied for this product.  
12.3 Cleaning Conditions  
Products shall be cleaned on the following conditions.  
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for Isopropyl alcohol.)  
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon  
at the mounted products and P.C.B..  
・Power : 20W/ l max. ・Frequency : 28kHz to 40kHz ・Time : 5 minutes max.  
(3) Cleaner  
1. Alternative cleaner • Isopropyl alcohol (IPA)  
2. Aqueous agent  
• PINE ALPHA ST-100S  
(4) There shall be no residual flux and residual cleaner after cleaning.  
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized  
water in order to remove the cleaner.  
(5) Other cleaning  
Please contact us.  
12.4 Resin coating  
The electrical performance may change due to high cure-stress of resin to be used for coating/molding  
products. An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of  
resin, or operating condition etc. Some resin contains some impurities or chloride possible to generate  
chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open  
circuit. So, please pay your careful attention when you select resin in case of coating/molding the products  
with the resin. Prior to use the coating resin, please make sure no reliability issue is observed by evaluating  
products mounted on your board.  
12.5 Attention regarding P.C.B. bending  
The following shall be considered when designing and laying out P.C.B.'s.  
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to  
warping the board.  
［Products direction］  
Products shall be location the sideways  
a
Direction (Length : a<b) to the mechanical  
b
Stress.  
Poor example  
〈
〉
Good example  
〈
〉
(2)Products location on P.C.B. separation  
C
B
Seam  
Products(A,B,C,D) shall be located carefully  
so that products are not subject to the  
mechanical stress due to warping the board.  
Because they may be subjected the mechanical stress  
in order of A>C>B ≅ D.  
D
A
a
b
Slit  
<
Length:a b  
MURATA MFG.CO.,LTD  
Reference Only  
SpecNo.JEFK243A-0005A-01  
P7/9  
Portion of  
Perforation  
12.6 Attention Regarding P.C.B. Design  
< The Arrangement of Products >  
×
P.C.B. shall be designed so that products are far from the portion  
of perforation.  
P.C.B.  
○
○
Product  
The portion of perforation shall be designed as narrow as possible  
and shall be designed so as not to be applied the stress in the case  
of P.C.B. separation.  
Portion of  
Perforation  
×
Products shall not be arranged on the line of a series of holes when  
there are big holes in P.C.B. (Because the stress concentrate on the  
line of holes.)  
○
×
P.C.B.  
Product  
Hole  
< Products Placing >  
Support pins shall be set under P.C.B . to prevent causing a warp to P.C.B.  
during placing the products on the other side of P.C.B.  
Pick-up nozzle  
Product  
< P.C.B. Separation >  
P.C.B. shall not be separated with hand.  
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.  
P.C.B.  
12.7 Standard Land Dimensions (Reflow)  
Support pin  
2
∗
1
∗
3
∗
Resist  
Copper foil pattern  
0.8  
2.6  
No pattern  
(in mm)  
∗1 If the pattern is made with wider than 1.2mm. It will result to let component turn around,  
because melting speed is different. In the worst case, short circuit between lines may be occured.  
∗2 If the pattern is made with less than 0.4mm , in the worst case , short circuit between lines may be  
occurred deu to the spread of soldering paste or mount placeing accuracy.  
∗3 If the pattern is made with wider than 0.8mm, the strength of bending will be reduced.  
∗4 Do not use gilded pattern. A copper wire may cause open by dissolution of metallization.  
12.8 Standard Soldering Condition  
1. Reflow Soldering  
(1) Standard printing pattern for soldering.  
• Standard thickness of the solder paste should be 100 to 150µm.  
• Use the solder paste printing pattern of the right pattern.  
• For the resist and copper foil pattern, use standard land dimensions.  
• Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.  
0.8  
• Spread of soldering paste between lines may cause short circuit of lines.  
(in mm)  
2.6  
(2) Soldering Temperature  
Temperature difference between soldering and surface of components must be within 150°C, in preheating.  
When components are immersed in liquid after soldering, temperature difference should be within 100°C. If  
preheating is not enough, components may be cracked and cause deterioration in insulation resistance.  
MURATA MFG.CO.,LTD  
Reference Only  
SpecNo.JEFK243A-0005A-01  
(3) Soldering Condition  
P8/9  
Standard soldering profile and the limit soldering profile is as follows.  
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting  
in the deterioration of product quality.  
Temp.  
260℃/10s  
230℃  
(℃)  
245±3℃  
220℃  
Limit Profile  
180  
150  
Standard Profile  
30～60s  
60s max.  
90s±30s  
Time（ｓ）  
Standard Profile  
Limit Profile  
Pre-heating  
150～180°C 、90s±30s  
above 220°C、30s～60s  
245±3°C  
Heating  
above 230°C、60s max.  
260°C、10s  
Peak temperature  
Cycle of reflow  
2 times  
2 times  
2. Reworking with Soldering iron  
The following conditions must be strictly followed when using a soldering iron after being  
mounted by reflow soldering.  
· Pre-heating: 150°C, 1 min  
· Tip temperature: 350°C max.  
· Soldering time : 3(+1,-0) seconds.  
· Soldering iron output: 30W max.  
· Tip diameter:φ3mm max.  
· Times : 2times max.  
Notes: Do not touch the products directly with the soldering iron.  
3. Solder Volume  
Solder shall be used not to be exceeded the upper limits as shown below.  
Upper limit  
Recommendable  
ｔ
T
1/3T t T (T:Tickness of electrode)  
≦≦  
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.  
Exceeding solder volume may cause the failure of mechanical or electrical performance.  
12.9 Caution for use  
tweezer  
･When you hold products with a tweezer, please hold  
like a figure of the right side, and sharp material,  
such as a pair of tweezers, shall not be touched to  
the winding portion to prevent the breaking of wire.  
･Mechanical shock should not be applied to the products  
mounted on the board to prevent the breaking  
of the core.  
MURATA MFG.CO.,LTD  
Reference Only  
SpecNo.JEFK243A-0005A-01  
P9/9  
12.10 Handling of a substrate  
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to  
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening  
screw to the substrate.  
Excessive mechanical stress may cause cracking in the product.  
Bending  
Twisting  
12.11 Brushing of neighborhood of products  
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush shall not  
be touched to the winding portion to prevent the breaking of wire.  
12.12 Operating Environment  
Do not use this product under the following environmental conditions, on deterioration of the performance, such  
as insulation resistance may result from the use.  
(1) in corrosive gases (acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc.)  
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.  
12.13 Storage Condition  
(1) Storage period  
Use the products within 12 months after delivered.  
Solderability should be checked if this period is exceeded.  
(2) Storage environment conditions  
·Products should be stored in the warehouse on the following conditions.  
Temperature ： -10 ~ +40°C  
Humidity  
： 15 to 85% relative humidity No rapid change on temperature and humidity.  
· Products should not be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,  
to prevent the following deterioration. Poor solderability due to the oxidized electrode.  
· Products should be stored on the palette for the prevention of the influence from humidity,dust and so on.  
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.  
· Products should not be stored under the air tights packaged condition.  
(3) Delivery  
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.  
!
13.△Note  
(1)Please make sure that your product has been evaluated in view of your specifications with our product being  
mounted to your product.  
(2)You are requested not to use our product deviating from the reference specifications.  
(3)The contents of this reference specification are subject to change without advance notice. Please approve our  
product specifications or transact the approval sheet for product specifications before ordering.  
MURATA MFG.CO.,LTD  
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