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7SB3257DTT2G

型号：

7SB3257DTT2G

品牌：

ONSEMI[ ONSEMI ]

页数：

12 页

PDF大小：

112 K

下载PDF手册
7SB3257  
Mux / Demux Bus Switch  
The 7SB3257 Mux / Demux Bus Switch is an advanced high−speed  
line switch in ultra−small footprint.  
Features  
• High Speed: t = 0.25 ns (Max) @ V = 4.5 V  
PD  
CC  
http://onsemi.com  
MARKING  
• 3 W Switch Connection Between 2 Ports  
• Power Down Protection Provided on Inputs  
• Ultra−Small Packages  
DIAGRAMS  
6
• NLV Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q100  
Qualified and PPAP Capable  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
6
1
AK MG  
SOT−363/SC70−6/SC−88  
DF SUFFIX  
G
1
6
CASE 419B  
B1  
A
TSOP−6  
DT SUFFIX  
CASE 318G  
6
AG MG  
G
1
1
K
ULLGA6  
1.0 x 1.0  
CASE 613AD  
B0  
S
M
G
1
D
ULLGA6  
1.2 x 1.0  
CASE 613AE  
M
Figure 1. Logic Diagram  
G
1
B1  
1
6
5
4
S
V
A
D
B1  
GND  
B0  
1
6
5
4
ULLGA6  
1.45 x 1.0  
CASE 613AF  
S
V
M
G
GND  
B0  
2
3
2
3
CC  
CC  
1
A
UDFN6  
1.0 x 1.0  
X M  
CASE 517BX  
Figure 2. TSOP−6/SC−88  
(Top View)  
Figure 3. ULLGA6/UDFN6  
(Top View)  
1
UDFN6  
1.2 x 1.0  
CASE 517AA  
M
G
Function Table  
Input S  
Function  
1
L
A = B0  
A = B1  
UDFN6  
1.45 x 1.0  
CASE 517AQ  
XM  
H
1
AK, AG, K, D, L = Specific Device Code  
M
= Date Code  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
September, 2014 − Rev. 4  
7SB3257/D  
7SB3257  
Table 1. MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
−0.5 to +7.0  
−0.5 to +7.0  
−0.5 to +7.0  
−50  
Unit  
V
V
CC  
DC Supply Voltage  
V
Control Pin Input Voltage  
V
IN  
I/O  
IK  
V
Switch Input / Output Voltage  
Control Pin DC Input Diode Current  
Switch I/O Port DC Diode Current  
On−State Switch Current  
V
I
V
< GND  
< GND  
I/O  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IN  
I
V
−50  
OK  
I
O
128  
Continuous Current Through V or GND  
150  
CC  
I
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature Range  
150  
CC  
I
150  
GND  
T
STG  
−65 to +150  
260  
T
Lead Temperature, 1 mm from Case for 10 Seconds  
Junction Temperature Under Bias  
Thermal Resistance  
°C  
L
T
150  
°C  
J
q
SC−88 / TSOP−6 (Note 1)  
ULLGA6/UDFN6  
333  
496  
°C/W  
JA  
P
D
Power Dissipation in Still Air at 85°C  
SC−88 / TSOP−6 (Note 1)  
ULLGA6/UDFN6  
200  
252  
mW  
MSL  
Moisture Sensitivity  
Flammability Rating  
ESD Withstand Voltage  
Level 1  
F
R
Oxygen Index: 28 to 34  
UL 94 V−0 @ 0.125 in  
V
ESD  
Human Body Mode (Note 2)  
Machine Mode (Note 3)  
>2000  
>200  
N/A  
V
Charged Device Mode (Note 4)  
I
Latchup Performance Above V and Below GND at 85°C (Note 5)  
100  
mA  
LATCHUP  
CC  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.  
2. Tested to EIA/ JESD22−A114−A  
3. Tested to EIA/ JESD22−A115−A  
4. Tested to JESD22−C101−A  
5. Tested to EIA / JESD78.  
Table 2. RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
4.0  
0
Max  
5.5  
Unit  
V
V
CC  
Positive DC Supply Voltage  
Control Pin Input Voltage  
V
I
5.5  
V
V
Switch Input / Output Voltage  
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate  
0
5.5  
V
I/O  
T
−55  
+125  
°C  
nS/V  
A
Dt / DV  
Control Input  
Switch I/O  
0
0
5
DC  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
http://onsemi.com  
2
 
7SB3257  
Table 3. DC ELECTRICAL CHARACTERISTICS  
T
A
= 255C  
Typ  
T
A
= −555C to +1255C  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Conditions  
= −18 mA  
V
(V)  
Unit  
V
CC  
V
Clamp Diode Voltage  
I
4.5  
−1.2  
−1.2  
IK  
IH  
IN  
V
High−Level Input Voltage  
(Control)  
4.0 to 5.5  
2.0  
2.0  
V
V
I
Low−Level Input Voltage  
(Control)  
4.0 to 5.5  
0.8  
0.8  
V
IL  
Input Leakage Current  
0 ≤ V ≤ 5.5 V  
5.5  
0
0.1  
0.1  
0.1  
1.0  
1.0  
1.0  
mA  
mA  
mA  
IN  
IN  
I
Power Off Leakage Current  
Quiescent Supply Current  
V
I/O  
= 0 to 5.5 V  
OFF  
I
I
O
= 0, V =  
IN  
5.5  
CC  
V
CC  
or 0 V  
DI  
Increase in Supply Current  
(Control Pin)  
One input at 3.4  
V; Other inputs  
5.5  
4.5  
2.5  
mA  
CC  
at V or GND  
CC  
R
Switch ON Resistance  
V
I/O  
= 0,  
W
ON  
I
I/O  
I
I/O  
= 64 mA  
= 30 mA  
3
3
7
7
7
7
V
I/O  
= 2.4,  
= 15 mA  
4.5  
4.0  
I/O  
I
6
15  
20  
15  
20  
V
I/O  
= 2.4,  
I
I/O  
= 15 mA  
10  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
Table 4. AC ELECTRICAL CHARACTERISTICS  
T
= −555C  
A
to +1255C  
T
A
= 255C  
Typ  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
V
CC  
(V)  
Test Condition  
Unit  
t
Propagation Delay,  
A to B or B to A  
4.0 to 5.5  
See Figure 4  
0.25  
0.25  
ns  
PD  
t
Output Enable Time  
Output Disable Time  
4.5 to 5.5  
4.0  
0.8  
0.8  
0.8  
0.8  
2.5  
3.0  
3.1  
2.9  
2.0  
10  
4.2  
4.6  
4.8  
4.4  
0.8  
0.8  
0.8  
0.8  
4.2  
4.6  
4.8  
4.4  
ns  
ns  
EN  
t
4.5 to 5.5  
4.0  
DIS  
C
Control Input Capacitance  
Switch On Capacitance  
Switch Off Capacitance  
5.0  
V
= 3 V or 0  
pF  
pF  
pF  
IN  
IN  
C
5.0  
Switch ON  
Switch OFF  
IO(ON)  
C
5.0  
3.5  
IO(OFF)  
http://onsemi.com  
3
7SB3257  
AC Loading and Waveforms  
TEST  
S1  
7 V  
Open  
GND  
S1  
t
Open  
7 V  
GND  
500 W  
PD  
From Output  
Under Test  
t
t
/t  
PLZ PZL  
/t  
PHZ PZH  
C = 50 pF  
(see Note A)  
L
500 W  
3 V  
0 V  
Output  
Control  
LOAD CIRCUIT  
1.5 V  
1.5 V  
t
t
PLZ  
PZL  
Output  
3 V  
0 V  
3.5 V  
Waveform 1  
S1 at 7 V  
(see Note B)  
1.5 V  
Input  
1.5 V  
1.5 V  
V
V
+ 0.3 V  
OL  
V
OL  
t
t
t
t
PHL  
PLH  
PZH  
PHZ  
Output  
Waveform 2  
S1 at Open  
(see Note B)  
V
OH  
V
OH  
− 0.3 V  
OH  
1.5 V  
1.5 V  
1.5 V  
Output  
0 V  
V
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 W, t ≤ 2.5 ns, t ≤ 2.5 ns.  
O
r
f
D. The output is measured with one input transition per measurement.  
E. t  
and t  
are the same as t  
.
PLZ  
PHZ  
dis  
F. t  
and t  
are the same as t  
.
PZL  
PZH  
en  
G. t  
and t are the same as t .  
PHL pd  
PLH  
Figure 4. Load Circuit and Voltage Waveforms  
Package  
DEVICE ORDERING INFORMATION  
Device  
†
Shipping  
7SB3257DTT1G  
TSOP−6  
(Pb−Free)  
NLV7SB3257DTT1G*  
7SB3257DTT2G  
3000 / Tape & Reel  
7SB3257DFT2G  
SC−88  
(Pb−Free)  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
7SB3257AMX1TCG  
7SB3257BMX1TCG  
7SB3257CMX1TCG  
7SB3257MU1TCG  
7SB3257MUTCG  
ULLGA6 − 1.45 x 1.0, 0.5P  
(Pb−Free)  
ULLGA6 − 1.2 x 1.0, 0.4P  
(Pb−Free)  
ULLGA6 − 1.0 x 1.0, 0.35P  
(Pb−Free)  
UDFN6 − 1.45 x 1.0, 0.5P  
(Pb−Free)  
UDFN6 − 1.2 x 1.0, 0.4P  
(Pb−Free)  
7SB3257MU3TCG  
UDFN6 − 1.0 x 1.0, 0.35P  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
*NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP  
Capable.  
http://onsemi.com  
4
7SB3257  
PACKAGE DIMENSIONS  
TSOP−6  
CASE 318G−02  
ISSUE U  
NOTES:  
D
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
H
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM  
LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.  
4. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH,  
PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR  
GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSIONS D  
AND E1 ARE DETERMINED AT DATUM H.  
6
1
5
4
L2  
GAUGE  
PLANE  
E1  
E
5. PIN ONE INDICATOR MUST BE LOCATED IN THE INDICATED ZONE.  
2
3
L
MILLIMETERS  
SEATING  
PLANE  
M
C
NOTE 5  
DIM  
A
A1  
b
c
D
E
E1  
e
L
MIN  
0.90  
0.01  
0.25  
0.10  
2.90  
2.50  
1.30  
0.85  
0.20  
NOM  
1.00  
MAX  
1.10  
0.10  
0.50  
0.26  
3.10  
3.00  
1.70  
1.05  
0.60  
b
DETAIL Z  
e
0.06  
0.38  
0.18  
3.00  
c
2.75  
A
0.05  
1.50  
0.95  
0.40  
A1  
L2  
M
0.25 BSC  
−
DETAIL Z  
0°  
10°  
RECOMMENDED  
SOLDERING FOOTPRINT*  
6X  
0.60  
6X  
0.95  
3.20  
0.95  
PITCH  
DIMENSIONS: MILLIMETERS  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
5
7SB3257  
PACKAGE DIMENSIONS  
SC−88/SC70−6/SOT−363  
CASE 419B−02  
ISSUE W  
D
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.  
e
MILLIMETERS  
DIM MIN NOM MAX  
0.80  
INCHES  
NOM MAX  
1.10 0.031 0.037 0.043  
0.10 0.000 0.002 0.004  
0.008 REF  
6
1
5
2
4
3
MIN  
A
0.95  
0.05  
H
−E−  
E
A1 0.00  
A3  
0.20 REF  
0.21  
0.14  
2.00  
1.25  
0.65 BSC  
0.20  
2.10  
b
C
D
E
e
0.10  
0.10  
1.80  
1.15  
0.30 0.004 0.008 0.012  
0.25 0.004 0.005 0.010  
2.20 0.070 0.078 0.086  
1.35 0.045 0.049 0.053  
0.026 BSC  
b 6 PL  
L
0.10  
2.00  
0.30 0.004 0.008 0.012  
2.20 0.078 0.082 0.086  
M
M
E
0.2 (0.008)  
H
E
A3  
C
A
A1  
L
SOLDERING FOOTPRINT*  
0.50  
0.0197  
0.65  
0.025  
0.65  
0.025  
0.40  
0.0157  
1.9  
0.0748  
mm  
inches  
ǒ
Ǔ
SCALE 20:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
6
7SB3257  
PACKAGE DIMENSIONS  
UDFN6 1.0x1.0, 0.35P  
CASE 517BX  
ISSUE O  
NOTES:  
A B  
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED  
TERMINAL AND IS MEASURED BETWEEN  
0.15 AND 0.20 MM FROM TERMINAL TIP.  
4. PACKAGE DIMENSIONS EXCLUSIVE OF  
BURRS AND MOLD FLASH.  
PIN ONE  
REFERENCE  
E
2X  
0.10  
C
MILLIMETERS  
DIM MIN  
MAX  
0.55  
0.05  
A
A1  
A3  
b
0.45  
0.00  
0.13 REF  
2X  
0.10  
C
TOP VIEW  
0.12  
0.22  
A3  
D
E
e
L
1.00 BSC  
1.00 BSC  
0.35 BSC  
0.05  
C
C
A
0.25  
0.30  
0.35  
0.40  
L1  
0.05  
RECOMMENDED  
A1  
SEATING  
PLANE  
C
SIDE VIEW  
e
SOLDERING FOOTPRINT*  
5X  
6X  
0.48  
0.22  
5X L  
3
1
L1  
1.18  
6
4
1
0.35  
6X b  
0.53  
PITCH  
PKG  
M
0.10  
0.05  
C A B  
OUTLINE  
DIMENSIONS: MILLIMETERS  
M
NOTE 3  
C
BOTTOM VIEW  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
7
7SB3257  
PACKAGE DIMENSIONS  
UDFN6 1.2x1.0, 0.4P  
CASE 517AA  
ISSUE C  
EDGE OF PACKAGE  
NOTES:  
A
B
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.25 AND  
0.30 mm FROM TERMINAL.  
L1  
4. COPLANARITY APPLIES TO THE EXPOSED  
PAD AS WELL AS THE TERMINALS.  
PIN ONE  
REFERENCE  
E
DETAIL A  
Bottom View  
MILLIMETERS  
2X  
DIM MIN  
0.45  
A1 0.00  
MAX  
0.55  
0.05  
(Optional)  
A
0.10  
C
MOLD CMPD  
EXPOSED Cu  
TOP VIEW  
A3  
b
0.127 REF  
0.15  
2X  
0.25  
0.10  
C
C
D
E
e
1.20 BSC  
1.00 BSC  
0.40 BSC  
A3  
L
0.30  
0.40  
0.15  
0.50  
(A3)  
L1 0.00  
L2 0.40  
0.10  
0.08  
A1  
DETAIL B  
Side View  
(Optional)  
A
MOUNTING FOOTPRINT*  
SEATING  
PLANE  
10X  
C
6X  
0.42  
SIDE VIEW  
6X  
0.22  
C
A1  
5X L  
3
1
L2  
6X b  
0.40  
PITCH  
1.07  
6
4
0.10 C A B  
0.05  
e
DIMENSIONS: MILLIMETERS  
C
NOTE 3  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
BOTTOM VIEW  
http://onsemi.com  
8
7SB3257  
PACKAGE DIMENSIONS  
UDFN6 1.45x1.0, 0.5P  
CASE 517AQ  
ISSUE C  
A
B
D
L
L
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
L1  
DETAIL A  
PIN ONE  
REFERENCE  
OPTIONAL  
E
MILLIMETERS  
CONSTRUCTIONS  
DIM MIN  
0.45  
A1 0.00  
MAX  
0.55  
0.05  
A
0.10  
C
EXPOSED Cu  
MOLD CMPD  
A2  
b
0.07 REF  
0.20  
TOP VIEW  
0.30  
0.10  
C
D
1.45 BSC  
E
e
1.00 BSC  
0.50 BSC  
DETAIL B  
L
L1  
0.30  
−−−  
0.40  
0.15  
DETAIL B  
OPTIONAL  
0.05  
0.05  
C
C
CONSTRUCTIONS  
A
MOUNTING FOOTPRINT  
6X  
A1  
6X  
SEATING  
PLANE  
A2  
C
0.30  
SIDE VIEW  
e
PACKAGE  
OUTLINE  
6X L  
1.24  
3
1
DETAIL A  
6X  
0.53  
1
0.50  
PITCH  
6
4
DIMENSIONS: MILLIMETERS  
6X b  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
0.10 C A B  
NOTE 3  
C
0.05  
BOTTOM VIEW  
http://onsemi.com  
9
7SB3257  
PACKAGE DIMENSIONS  
ULLGA6 1.0x1.0, 0.35P  
CASE 613AD  
ISSUE A  
NOTES:  
A
B
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
4. A MAXIMUM OF 0.05 PULL BACK OF THE  
PLATED TERMINAL FROM THE EDGE OF THE  
PACKAGE IS ALLOWED.  
PIN ONE  
REFERENCE  
E
MILLIMETERS  
DIM MIN  
−−−  
A1 0.00  
MAX  
0.40  
0.05  
0.22  
0.10  
C
A
TOP VIEW  
SIDE VIEW  
b
D
E
e
0.12  
1.00 BSC  
1.00 BSC  
0.35 BSC  
0.10  
C
0.05  
0.05  
C
C
L
0.25  
0.35  
0.40  
L1 0.30  
A
SEATING  
PLANE  
6X  
MOUNTING FOOTPRINT  
SOLDERMASK DEFINED*  
C
5X  
A1  
6X  
0.48  
0.22  
e
NOTE 4  
5X L  
3
1
1.18  
L1  
1
0.35  
0.53  
PKG  
PITCH  
6
4
OUTLINE  
6X b  
DIMENSIONS: MILLIMETERS  
0.10 C A B  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
NOTE 3  
C
0.05  
BOTTOM VIEW  
http://onsemi.com  
10  
7SB3257  
PACKAGE DIMENSIONS  
ULLGA6 1.2x1.0, 0.4P  
CASE 613AE  
ISSUE A  
NOTES:  
A
B
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
4. A MAXIMUM OF 0.05 PULL BACK OF THE  
PLATED TERMINAL FROM THE EDGE OF THE  
PACKAGE IS ALLOWED.  
PIN ONE  
REFERENCE  
E
MILLIMETERS  
DIM MIN  
−−−  
A1 0.00  
MAX  
0.40  
0.05  
0.25  
0.10  
C
A
TOP VIEW  
SIDE VIEW  
b
D
E
e
0.15  
1.20 BSC  
1.00 BSC  
0.40 BSC  
0.10  
C
0.05  
0.05  
C
C
L
0.25  
0.35  
0.45  
L1 0.35  
A
SEATING  
PLANE  
6X  
MOUNTING FOOTPRINT  
SOLDERMASK DEFINED*  
C
A1  
5X  
6X  
0.49  
0.26  
e
NOTE 4  
5X L  
3
1
1.24  
L1  
1
0.53  
0.40  
PITCH  
PKG  
OUTLINE  
6
4
6X b  
DIMENSIONS: MILLIMETERS  
0.10 C A B  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
NOTE 3  
C
0.05  
BOTTOM VIEW  
http://onsemi.com  
11  
7SB3257  
PACKAGE DIMENSIONS  
ULLGA6 1.45x1.0, 0.5P  
CASE 613AF  
ISSUE A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
A
B
D
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
4. A MAXIMUM OF 0.05 PULL BACK OF THE  
PLATED TERMINAL FROM THE EDGE OF THE  
PACKAGE IS ALLOWED.  
PIN ONE  
E
REFERENCE  
MILLIMETERS  
DIM MIN  
−−−  
A1 0.00  
MAX  
0.40  
0.05  
0.25  
A
0.10  
C
TOP VIEW  
SIDE VIEW  
b
D
E
e
0.15  
1.45 BSC  
1.00 BSC  
0.50 BSC  
0.10  
C
L
0.25  
0.35  
0.40  
0.05  
0.05  
C
C
L1 0.30  
A
MOUNTING FOOTPRINT  
SOLDERMASK DEFINED*  
SEATING  
PLANE  
6X  
5X  
A1  
C
6X  
0.49  
0.30  
e
NOTE 4  
5X L  
3
1
6
1.24  
L1  
1
0.53  
PKG  
OUTLINE  
0.50  
PITCH  
4
6X b  
DIMENSIONS: MILLIMETERS  
0.10 C A B  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
NOTE 3  
C
0.05  
BOTTOM VIEW  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer  
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
Japan Customer Focus Center  
Phone: 81−3−5817−1050  
ON Semiconductor Website: www.onsemi.com  
Order Literature: http://www.onsemi.com/orderlit  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
For additional information, please contact your local  
Sales Representative  
7SB3257/D  
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