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7SB3125BMX1TCG

型号：

7SB3125BMX1TCG

品牌：

ROCHESTER[ Rochester Electronics ]

页数：

11 页

PDF大小：

821 K

下载PDF手册
7SB3125  
Bus Switch  
The 7SB3125 Bus Switch is an advanced high−speed line switch in  
ultra−small footprint.  
Features  
• High Speed: t = 0.25 ns (Max) @ V = 4.5 V  
PD  
CC  
http://onsemi.com  
MARKING  
• 3 W Switch Connection Between 2 Ports  
• Power Down Protection Provided on Inputs  
• Ultra−Small Packages  
DIAGRAMS  
• These are Pb−Free Devices  
5
5
1
A
B
AH MG  
G
SOT−353/SC70−5/SC−88A  
DF SUFFIX  
1
5
OE  
CASE 419A  
Figure 1. Logic Diagram  
5
1
AE MG  
G
OE  
1
5
V
CC  
OE  
A
1
6
5
4
V
CC  
SOT23−5/TSOP−5/SC59−5  
DT SUFFIX  
1
A
CASE 483  
2
3
2
3
NC  
B
GND  
4
GND  
B
F
ULLGA6  
1.0 x 1.0  
CASE 613AD  
M
G
Figure 2. TSOP−5/SC−88A  
Figure 3. ULLGA6/UDFN6  
(Top View)  
1
(Top View)  
A
ULLGA6  
1.2 x 1.0  
CASE 613AE  
M
Function Table  
G
Input OE  
Function  
B = A  
Disconnect  
1
L
H
ULLGA6  
1.45 x 1.0  
CASE 613AF  
M
G
1
UDFN6  
1.2 x 1.0  
CASE 517AA  
M
G
1
AH, AE, F, A, 6, J = Specific Device Code  
M
= Date Code  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 4 of this data sheet.  
© Semiconductor Components Industries, LLC, 2010  
1
Publication Order Number:  
September, 2010 − Rev. 1  
7SB3125/D  
7SB3125  
Table 1. MAXIMUM RATINGS  
Symbol  
Parameter  
Value  
−0.5 to +7.0  
−0.5 to +7.0  
−0.5 to +7.0  
−50  
Unit  
V
V
CC  
DC Supply Voltage  
V
Control Pin Input Voltage  
V
IN  
I/O  
IK  
V
Switch Input / Output Voltage  
Control Pin DC Input Diode Current  
Switch I/O Port DC Diode Current  
On−State Switch Current  
V
I
V
< GND  
< GND  
I/O  
mA  
mA  
mA  
mA  
mA  
mA  
°C  
IN  
I
V
−50  
OK  
I
O
128  
Continuous Current Through V or GND  
150  
CC  
I
DC Supply Current per Supply Pin  
DC Ground Current per Ground Pin  
Storage Temperature Range  
150  
CC  
I
150  
GND  
T
STG  
−65 to +150  
260  
T
Lead Temperature, 1 mm from Case for 10 Seconds  
Junction Temperature Under Bias  
Thermal Resistance  
°C  
L
T
150  
°C  
J
q
SC70−5/SC−88A (Note 1)  
TSOP−5  
350  
230  
496  
°C/W  
JA  
ULLGA6/UDFN6  
P
D
Power Dissipation in Still Air at 85°C  
SC70−5/SC−88A (Note 1)  
TSOP−5  
150  
200  
252  
mW  
ULLGA6/UDFN6  
MSL  
Moisture Sensitivity  
Flammability Rating  
ESD Withstand Voltage  
Level 1  
F
R
Oxygen Index: 28 to 34  
UL 94 V−0 @ 0.125 in  
V
ESD  
Human Body Mode (Note 2)  
Machine Mode (Note 3)  
Charged Device Mode (Note 4)  
>2000  
>200  
N/A  
V
I
Latchup Performance Above V and Below GND at 85°C (Note 5)  
100  
mA  
LATCHUP  
CC  
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the  
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect  
device reliability.  
1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow.  
2. Tested to EIA/ JESD22−A114−A  
3. Tested to EIA/ JESD22−A115−A  
4. Tested to JESD22−C101−A  
5. Tested to EIA / JESD78.  
Table 2. RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
4.0  
0
Max  
5.5  
Unit  
V
V
CC  
Positive DC Supply Voltage  
Control Pin Input Voltage  
V
I
5.5  
V
V
Switch Input / Output Voltage  
Operating Free−Air Temperature  
Input Transition Rise or Fall Rate  
0
5.5  
V
I/O  
T
−55  
+125  
°C  
nS/V  
A
Dt / DV  
Control Input  
Switch I/O  
0
0
5
DC  
http://onsemi.com  
2
 
7SB3125  
Table 3. DC ELECTRICAL CHARACTERISTICS  
T
A
= 255C  
Typ  
T
A
= −555C to +1255C  
Min  
Max  
Min  
Max  
Symbol  
Parameter  
Conditions  
= −18 mA  
V
(V)  
Unit  
V
CC  
V
IK  
IH  
Clamp Diode Voltage  
I
4.5  
−1.2  
−1.2  
IN  
V
High−Level Input Voltage  
(Control)  
4.0 to 5.5  
2.0  
2.0  
V
V
IL  
Low−Level Input Voltage  
(Control)  
4.0 to 5.5  
0.8  
0.8  
V
I
Input Leakage Current  
0 ≤ V ≤ 5.5 V  
5.5  
0
0.1  
0.1  
0.1  
1.0  
1.0  
1.0  
mA  
mA  
mA  
IN  
IN  
I
Power Off Leakage Current  
Quiescent Supply Current  
V
I/O  
= 0 to 5.5 V  
OFF  
I
I
O
V
= 0, V =  
IN  
CC  
5.5  
CC  
or 0 V  
DI  
Increase in Supply Current  
(Control Pin)  
One input at 3.4  
V; Other inputs  
5.5  
4.5  
2.5  
mA  
CC  
at V or GND  
CC  
R
Switch ON Resistance  
V
I/O  
= 0,  
W
ON  
I
I/O  
I
I/O  
= 64 mA  
= 30 mA  
3
3
7
7
7
7
V
I/O  
= 2.4,  
4.5  
4.0  
I/O  
I
I
= 15 mA  
6
15  
20  
15  
20  
V
I/O  
= 2.4,  
= 15 mA  
I/O  
10  
Table 4. AC ELECTRICAL CHARACTERISTICS  
T
= −555C  
A
to +1255C  
T
A
= 255C  
Typ  
Min  
Max  
0.25  
0.25  
4.2  
Min  
Max  
Symbol  
Parameter  
V
(V)  
Test Condition  
Unit  
CC  
t
Propagation Delay,  
A to B or B to A  
4.0 to 5.5  
See Figure 3  
0.25  
0.25  
4.2  
ns  
PD  
t
Output Enable Time  
Output Disable Time  
4.5 to 5.5  
4.0  
0.8  
0.8  
0.8  
0.8  
2.5  
3.0  
3.1  
2.9  
2.0  
10  
0.8  
0.8  
0.8  
0.8  
ns  
ns  
EN  
4.6  
4.6  
t
4.5 to 5.5  
4.0  
4.8  
4.8  
DIS  
4.4  
4.4  
C
Control Input Capacitance  
Switch On Capacitance  
Switch Off Capacitance  
5.0  
V
IN  
= 3 V or 0  
pF  
pF  
pF  
IN  
C
5.0  
Switch ON  
Switch OFF  
IO(ON)  
C
5.0  
3.5  
IO(OFF)  
http://onsemi.com  
3
7SB3125  
AC Loading and Waveforms  
TEST  
S1  
7 V  
Open  
GND  
S1  
t
Open  
7 V  
GND  
500 W  
PD  
From Output  
Under Test  
t
t
/t  
PLZ PZL  
/t  
PHZ PZH  
C = 50 pF  
(see Note A)  
L
500 W  
3 V  
0 V  
Output  
Control  
LOAD CIRCUIT  
1.5 V  
1.5 V  
t
t
PLZ  
PZL  
Output  
3 V  
0 V  
3.5 V  
Waveform 1  
S1 at 7 V  
(see Note B)  
1.5 V  
Input  
1.5 V  
1.5 V  
V
V
+ 0.3 V  
OL  
V
OL  
t
t
t
t
PHL  
PLH  
PZH  
PHZ  
Output  
Waveform 2  
S1 at Open  
(see Note B)  
V
OH  
V
OH  
− 0.3 V  
OH  
1.5 V  
1.5 V  
1.5 V  
Output  
0 V  
V
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 W, t ≤ 2.5 ns, t ≤ 2.5 ns.  
O
r
f
D. The output is measured with one input transition per measurement.  
E. t  
F. t  
and t  
and t  
are the same as t  
.
PLZ  
PZL  
PHZ  
PZH  
dis  
.
are the same as t  
en  
G. t  
and t  
are the same as t  
.
PLH  
PHL  
pd  
Figure 4. Load Circuit and Voltage Waveforms  
DEVICE ORDERING INFORMATION  
†
Device  
Package  
Shipping  
7SB3125DTT1G  
TSOP−5  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
3000 / Tape & Reel  
(Pb−Free)  
7SB3125DFT2G  
SC−88A  
(Pb−Free)  
7SB3125AMX1TCG  
7SB3125BMX1TCG  
7SB3125CMX1TCG  
7SB3125MUTCG  
ULLGA6 − 0.5 mm Pitch  
(Pb−Free)  
ULLGA6 − 0.4 mm Pitch  
(Pb−Free)  
ULLGA6 − 0.35 mm Pitch  
(Pb−Free)  
UDFN6 − 0.4 mm Pitch  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
4
7SB3125  
PACKAGE DIMENSIONS  
SC−88A, SOT−353, SC−70  
CASE 419A−02  
ISSUE J  
A
NOTES:  
1. DIMENSIONING AND TOLERANCING  
PER ANSI Y14.5M, 1982.  
G
2. CONTROLLING DIMENSION: INCH.  
3. 419A−01 OBSOLETE. NEW STANDARD  
419A−02.  
4. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS, OR GATE  
BURRS.  
5
4
3
−B−  
S
INCHES  
DIM MIN MAX  
MILLIMETERS  
MIN  
1.80  
1.15  
0.80  
0.10  
MAX  
2.20  
1.35  
1.10  
0.30  
1
2
A
B
C
D
G
H
J
0.071  
0.045  
0.031  
0.004  
0.087  
0.053  
0.043  
0.012  
0.026 BSC  
0.65 BSC  
M
M
B
D 5 PL  
0.2 (0.008)  
---  
0.004  
0.004  
0.004  
0.010  
0.012  
---  
0.10  
0.10  
0.10  
0.25  
0.30  
K
N
S
N
0.008 REF  
0.20 REF  
0.079  
0.087  
2.00  
2.20  
J
C
K
H
http://onsemi.com  
5
7SB3125  
PACKAGE DIMENSIONS  
TSOP−5  
CASE 483−02  
ISSUE H  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
NOTE 5  
5X  
D
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. MAXIMUM LEAD THICKNESS INCLUDES  
LEAD FINISH THICKNESS. MINIMUM LEAD  
THICKNESS IS THE MINIMUM THICKNESS  
OF BASE MATERIAL.  
4. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD FLASH, PROTRUSIONS, OR GATE  
BURRS.  
5. OPTIONAL CONSTRUCTION: AN  
ADDITIONAL TRIMMED LEAD IS ALLOWED  
IN THIS LOCATION. TRIMMED LEAD NOT TO  
EXTEND MORE THAN 0.2 FROM BODY.  
0.20 C A B  
2X  
2X  
0.10  
T
T
M
5
4
3
0.20  
B
S
1
2
K
L
DETAIL Z  
G
A
MILLIMETERS  
DIM  
A
B
C
D
MIN  
3.00 BSC  
1.50 BSC  
MAX  
DETAIL Z  
J
0.90  
1.10  
0.50  
C
0.25  
SEATING  
PLANE  
0.05  
G
H
J
K
L
M
S
0.95 BSC  
H
0.01  
0.10  
0.20  
1.25  
0
0.10  
0.26  
0.60  
1.55  
10  
3.00  
T
_
_
2.50  
SOLDERING FOOTPRINT*  
1.9  
0.074  
0.95  
0.037  
2.4  
0.094  
1.0  
0.039  
0.7  
0.028  
mm  
inches  
ǒ
Ǔ
SCALE 10:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
6
7SB3125  
PACKAGE DIMENSIONS  
UDFN6 1.2x1.0, 0.4P  
CASE 517AA−01  
ISSUE C  
EDGE OF PACKAGE  
NOTES:  
A
B
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.25 AND  
0.30 mm FROM TERMINAL.  
L1  
4. COPLANARITY APPLIES TO THE EXPOSED  
PAD AS WELL AS THE TERMINALS.  
PIN ONE  
E
DETAIL A  
REFERENCE  
Bottom View  
MILLIMETERS  
2X  
DIM MIN  
0.45  
A1 0.00  
MAX  
0.55  
0.05  
(Optional)  
A
0.10  
C
MOLD CMPD  
EXPOSED Cu  
TOP VIEW  
A3  
b
D
0.127 REF  
2X  
0.15  
0.25  
0.10  
C
C
1.20 BSC  
E
e
1.00 BSC  
0.40 BSC  
A3  
L
0.30  
0.40  
0.15  
0.50  
(A3)  
L1 0.00  
L2 0.40  
0.10  
0.08  
A1  
DETAIL B  
Side View  
(Optional)  
A
MOUNTING FOOTPRINT*  
SEATING  
PLANE  
10X  
C
6X  
SIDE VIEW  
6X  
0.22  
0.42  
C
A1  
5X L  
3
1
L2  
6X b  
0.40  
PITCH  
1.07  
6
4
0.10 C A B  
0.05  
e
DIMENSIONS: MILLIMETERS  
C
NOTE 3  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
BOTTOM VIEW  
http://onsemi.com  
7
7SB3125  
PACKAGE DIMENSIONS  
ULLGA6 1.0x1.0, 0.35P  
CASE 613AD−01  
ISSUE A  
NOTES:  
A
B
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
4. A MAXIMUM OF 0.05 PULL BACK OF THE  
PLATED TERMINAL FROM THE EDGE OF THE  
PACKAGE IS ALLOWED.  
PIN ONE  
REFERENCE  
E
MILLIMETERS  
DIM MIN  
−−−  
A1 0.00  
MAX  
0.40  
0.05  
0.22  
0.10  
C
A
TOP VIEW  
SIDE VIEW  
b
D
E
e
0.12  
1.00 BSC  
1.00 BSC  
0.35 BSC  
0.25  
0.10  
C
0.05  
0.05  
C
C
L
0.35  
0.40  
L1 0.30  
A
SEATING  
6X  
MOUNTING FOOTPRINT  
SOLDERMASK DEFINED*  
PLANE  
C
05.4X8  
A1  
6X  
0.22  
e
NOTE 4  
5X L  
3
1
1.18  
L1  
1
0.35  
0.53  
PKG  
PITCH  
6
4
OUTLINE  
6X b  
DIMENSIONS: MILLIMETERS  
0.10 C A B  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
NOTE 3  
C
0.05  
BOTTOM VIEW  
http://onsemi.com  
8
7SB3125  
PACKAGE DIMENSIONS  
ULLGA6 1.2x1.0, 0.4P  
CASE 613AE−01  
ISSUE A  
NOTES:  
A
B
D
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
4. A MAXIMUM OF 0.05 PULL BACK OF THE  
PLATED TERMINAL FROM THE EDGE OF THE  
PACKAGE IS ALLOWED.  
PIN ONE  
E
REFERENCE  
MILLIMETERS  
DIM MIN  
−−−  
A1 0.00  
MAX  
0.40  
0.05  
0.25  
0.10  
C
A
TOP VIEW  
SIDE VIEW  
b
D
E
e
0.15  
1.20 BSC  
1.00 BSC  
0.40 BSC  
0.25  
0.10  
C
0.05  
0.05  
C
C
L
0.35  
0.45  
L1 0.35  
A
SEATING  
PLANE  
6X  
MOUNTING FOOTPRINT  
SOLDERMASK DEFINED*  
C
A1  
05.4X9  
6X  
0.26  
e
NOTE 4  
5X L  
3
1
1.24  
L1  
1
0.53  
0.40  
PITCH  
PKG  
OUTLINE  
6
4
6X b  
DIMENSIONS: MILLIMETERS  
0.10 C A B  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
NOTE 3  
C
0.05  
BOTTOM VIEW  
http://onsemi.com  
9
7SB3125  
PACKAGE DIMENSIONS  
ULLGA6 1.45x1.0, 0.5P  
CASE 613AF−01  
ISSUE A  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ASME Y14.5M, 1994.  
A
B
D
2. CONTROLLING DIMENSION: MILLIMETERS.  
3. DIMENSION b APPLIES TO PLATED TERMINAL  
AND IS MEASURED BETWEEN 0.15 AND  
0.30 mm FROM THE TERMINAL TIP.  
4. A MAXIMUM OF 0.05 PULL BACK OF THE  
PLATED TERMINAL FROM THE EDGE OF THE  
PACKAGE IS ALLOWED.  
PIN ONE  
E
REFERENCE  
MILLIMETERS  
DIM MIN  
−−−  
A1 0.00  
MAX  
0.40  
0.05  
0.25  
A
0.10  
C
TOP VIEW  
SIDE VIEW  
b
D
E
e
0.15  
1.45 BSC  
1.00 BSC  
0.50 BSC  
0.25  
0.10  
C
L
0.35  
0.40  
0.05  
0.05  
C
C
L1 0.30  
A
MOUNTING FOOTPRINT  
SOLDERMASK DEFINED*  
SEATING  
PLANE  
6X  
05.4X9  
A1  
C
6X  
0.30  
e
NOTE 4  
5X L  
3
1
6
1.24  
L1  
1
0.53  
PKG  
0.50  
PITCH  
OUTLINE  
4
6X b  
DIMENSIONS: MILLIMETERS  
0.10 C A B  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
NOTE 3  
C
0.05  
BOTTOM VIEW  
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
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7SB3125/D  
厂商 型号 描述 页数 下载

MURATA

 		7SB-34R7-3C EMIFIL （电容式），单电路类型的信号线[ EMIFIL (Capacitor type) Single Circuit Type for Signal Lines ] 35 页

ONSEMI

 		7SB3125 总线开关[ Bus Switch ] 10 页

ONSEMI

 		7SB3125AMX1TCG [ CBT/FST/QS/5C/B SERIES, 1-BIT DRIVER, INVERTED OUTPUT, DSO6, 1.45 X 1 MM, 0.50 MM PITCH, LEAD FREE, ULLGA-6 ] 10 页

ONSEMI

 		7SB3125BMX1TCG [ CBT/FST/QS/5C/B SERIES, 1-BIT DRIVER, INVERTED OUTPUT, DSO6, 1.20 X 1 MM, 0.40 MM PITCH, LEAD FREE, ULLGA-6 ] 10 页

ONSEMI

 		7SB3125CMX1TCG [ CBT/FST/QS/5C/B SERIES, 1-BIT DRIVER, INVERTED OUTPUT, DSO6, 1 X 1 MM, 0.35 MM PITCH, LEAD FREE, ULLGA-6 ] 10 页

ONSEMI

 		7SB3125DFT2G [ 1 Bit Bus Switch, SC-88A (SC-70-5 / SOT-353), 3000-REEL ] 10 页

ONSEMI

 		7SB3125DTT1G [ 1 Bit Bus Switch, TSOP-5, 3000-REEL ] 10 页

ONSEMI

 		7SB3125MUTCG [ 1 Bit Bus Switch, UDFN6, 1.2 x 1.0, 0.4P, 3000-REEL ] 10 页

ONSEMI

 		7SB3126 [ Bus Switch ] 10 页

ONSEMI

 		7SB3126AMX1TCG [ CBT/FST/QS/5C/B SERIES, 1-BIT DRIVER, INVERTED OUTPUT, DSO6, 1.45 X 1 MM, 0.50 MM PITCH, LEAD FREE, ULLGA-6 ] 10 页

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