请登录

免费注册
全部商品
电子元器件
方案中心
工业品
PDF资料
购物车 0
上传BOM

产品分类

找货询价

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

QQ咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

会员中心
购物车
技术支持

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

售后咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

UYGT801-S

型号：

UYGT801-S

品牌：

SEOUL[ Seoul Semiconductor ]

页数：

13 页

PDF大小：

329 K

下载PDF手册
Specification  
UYGT801-S  
SSC  
Customer  
Drawn  
Approval  
Approval  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
UYGT801-S  
1. Features  
2. Absolute Maximum Ratings  
3. Electro-Optical Characteristics  
4. Characteristic Graph  
5. Reliability  
6. Color & binning  
7. Outline Dimension  
8. Packing  
9. Soldering  
10. Precaution for use  
11. Handling of Silicone Resign LEDs  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
UYGT801-S  
Features  
UYGT801-S  
Description  
This surface-mount LED  
comes in PLCC standard  
package dimension. It has a  
substrate made up of a molded  
plastic reflector sitting on top  
of a bent lead frame. The die is  
attached within the reflector  
cavity and the cavity is  
• Industry Standard  
PLCC SMT package  
• High brightness  
using AlInGaP dice  
technologies  
• Available in multiple  
colors  
encapsulated by epoxy or  
silicone  
The package design coupled  
with careful selection of  
component materials allow  
these products to perform with  
high reliability in a larger  
temperature range -40℃ to  
100℃. The high reliability  
feature is crucial to Automotive  
interior and Indoor ESS.  
• High volume, high  
reliability  
Applications  
• Interior automotive  
• Electronic Signs and  
Signals  
• Office Automation,  
Electrical Appliances,  
Industrial Equipment  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
1. Features  
• Yellow-Green colored SMT package  
• Material AlInGaP  
• Suitable for all SMT assembly methods  
Suitable for all soldering methods  
• RoHS Compliant  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
2. Absolute maximum ratings  
Parameter  
Symbol  
Pd  
Value  
Unit  
mW  
mA  
mA  
V
Power Dissipation  
Forward Current  
75  
IF  
30  
*2  
Peak Forward Current  
Reverse Voltage  
IFM  
90  
VR  
5
Operating Temperature  
Storage Temperature  
Topr  
Tstg  
-40 ~ +100  
-40 ~ +100  
oC  
oC  
[1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.  
[2] IFM was measured at Tw≤1 msec of pulse width and D≤1/10 of duty ratio.  
[3] LED’s properties might be different from suggested values like above and below tables if operation condition  
will be exceeded our parameter range.  
3. Electro-Optical characteristics  
Parameter  
Forward Voltage  
Symbol  
Condition  
IF =20mA  
VR=5V  
Min  
1.7  
-
Typ  
2.1  
-
Max  
2.5  
10  
105  
-
Unit  
V
VF  
IR  
Reverse Current  
μA  
Luminance Intensity *1  
Peak Wavelength  
IV  
IF =20mA  
IF =20mA  
IF =20mA  
IF =20mA  
IF =20mA  
30  
-
90  
mcd  
nm  
nm  
nm  
deg.  
λP  
λd  
Δλ  
576  
572  
18  
Dominant Wavelength  
Spectral Bandwidth 50%  
Viewing Angle *2  
568  
-
574  
-
2θ  
-
120  
-
½
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of  
the LED package. Luminous Intensity Measurement allowance is ±10%  
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.  
*3. A tolerance of ±0.05V on forward voltage measurements  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
4. Characteristic Graph  
Relative Luminous Intensity vs Forward Current  
Forward Current vs. Forward Voltage  
(Ta=25 OC )  
(Ta=25 OC )  
102  
101  
100  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.8  
1.9  
2.0  
2.1  
2.2  
0
5
10  
15  
20  
25  
30  
35  
Forward Current IF [mA]  
Forward Voltage VF (V)  
Forward Current Derating Curve  
Radiation Diagram  
(Ta=25 OC )  
40  
30  
20  
10  
0
0
30  
-30  
60  
-60  
90  
-90  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
O
Ambient Temperature TA [ C]  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
5 Reliability  
Number  
of  
Damage  
Duration  
/ Cycle  
Item  
Reference  
Test Condition  
Ta =-40oC (30MIN) ~ 100oC (30MIN)  
100 Cycle  
100 Cycle  
Thermal Shock  
EIAJ ED-4701  
EIAJ ED-4701  
0/22  
0/22  
Ta =-40oC (30MIN) ~ 25oC (5MIN)  
~ 100oC (30MIN) ~ 25oC (5MIN)  
Temperature  
Cycle  
High Temperature  
Storage  
1000  
Hours  
Ta =100oC  
EIAJ ED-4701  
EIAJ ED-4701  
EIAJ ED-4701  
0/22  
0/22  
High Temperature  
High Humidity  
Storage  
1000  
Hours  
Ta =85oC, RH=85%  
Low Temperature  
Storage  
1000  
Hours  
Ta =-40oC  
0/22  
0/22  
Operating  
Endurance Test  
Internal  
Reference  
1000  
Hours  
Ta =25oC, IF =30mA  
High Temperature  
High Humidity  
Life Test  
Internal  
Reference  
300  
Hours  
Ta =85oC, RH=85%, IF =15mA  
0/22  
High Temperature  
Life Test  
Internal  
Reference  
1000  
Hours  
Ta =100oC, IF =5mA  
Ta =-40oC, IF =20mA  
1KV at 1.5kΩ; 100pF  
0/22  
0/22  
0/22  
Low Temperature  
Life Test  
Internal  
Reference  
1000  
Hours  
MIL-STD-  
883D  
ESD(HBM)  
3 Time  
Criteria for Judging the Damage  
Criteria for Judgement  
MIN MAX  
Item  
Symbol  
Condition  
Forward Voltage  
Reverse Current  
VF  
IR  
IF =20mA  
VR=5V  
-
-
USL*1 × 1.2  
USL*1 × 2.0  
Luminous  
Intensity  
IV  
IF =20mA  
LSL*2 × 0.5  
-
Note : *1 USL : Upper Standard Level  
*2 LSL : Lower Standard Level  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
6. Color & Binning  
● UYGT801-S BINNING  
RANK NAME  
VF [V]  
IV [mcd]  
75 ~ 85  
85 ~ 95  
95 ~ 105  
75 ~ 85  
85 ~ 95  
95 ~ 105  
75 ~ 85  
85 ~ 95  
95 ~ 105  
Wd [nm]  
A
B
C
D
E
F
570 ~ 572  
568 ~ 570  
572 ~ 574  
1.7~2.5  
G
H
I
J
570 ~ 572  
568 ~ 570  
572 ~ 574  
K
L
30 ~ 75  
[Note] All measurements were made under the standardized environment of SSC.  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
7.outline dimension  
Recommended Solder Pattern  
1.9  
2.8  
0.8  
2.2  
0.15  
Anode  
Cathode  
Cathode Mark  
2.2  
( Tolerance: ±0.2, Unit: mm )  
8. packing  
1.55  
± 0.05  
4.0±0.1  
0.22±0.05  
2.0±0.05  
1.0±0.1  
8°  
3.1±0.1  
2.22±0.1  
11.4±0.1  
9.0 ±0.3  
+0  
-3  
180  
2.0 ±0.2  
LABLE  
13±0.2  
30°  
10  
22  
(1) Quantity : 2000pcs/Reel  
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm  
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from  
the carrier tape at the angle of 10º to the carrier tape  
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
● Reel Packing Structure  
Reel  
RANK:  
XXX  
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
PART NUMBER :  
XXXXXX  
SEOUL SEMICONDUCTOR CO., LTD.  
HUMIDITY INDICATOR  
DESI PAK  
Aluminum Vinyl Bag  
RANK:  
XXX  
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
PART NUMBER :  
XXXXXX  
SEOUL SEMICONDUCTOR CO., LTD.  
Outer Box Structure  
Material : Paper(SW3B(B))  
SIZE (mm)  
TYPE  
a
c
b
245 220 142  
7inch  
SIDE  
1
c
RANK:  
XXX  
1
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
TOP LED  
a
RoHS  
b
PART NUMBER :  
XXXXXX  
SEOUL SEMICONDUCTOR CO., LTD.  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
9. soldering  
(1) Lead Solder  
Lead Solder  
Lead Solder  
o
o
2.5~5 C / sec.  
240 C Max.  
10 sec. Max.  
Pre-heat  
120~150℃  
Pre-heating  
120~150 C  
Pre-heat time  
120 sec. Max.  
240℃ Max.  
10 sec. Max.  
o
60sec. Max.  
Above 200 C  
2.5~5 C / sec.  
o
Peak-Temperature  
Soldering time Condition  
120sec. Max.  
(2) Lead-Free Solder  
Lead-frame Solder  
o
Lead Free Solder  
150~200℃  
o
1~5 C / sec.  
260 C Max.  
10 sec. Max.  
Pre-heat  
Pre-heating  
Pre-heat time  
120 sec. Max.  
260℃ Max.  
o
60sec. Max.  
Above 220 C  
o
150~200  
C
1~5 C / sec.  
o
Peak-Temperature  
Soldering time Condition  
10 sec. Max.  
120sec. Max.  
(3) Hand Soldering conditions  
Do not exceed 4 seconds at maximum 315ºC under soldering iron.  
(4) The encapsulated material of the LEDs is silicone.  
Precautions should be taken to avoid the strong pressure on the encapsulated part.  
So when using the chip mounter, the picking up nozzle that does not affect the silicone  
resign should be used.  
(5) It is recommended that the customer use the nitrogen reflow method.  
(6) Repairing should not be done after the LEDs have been soldered.  
(7) Reflow soldering should not be done more than two times.  
In the case of more than 24 hours passed soldering after first, LEDs will be damaged.  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
10. precaution for use  
(1) Storage  
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a  
desicator) with a desiccant. Otherwise, to store them in the following environment is  
recommended.  
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH  
(2) Attention after open.  
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect  
the light transmission efficiency, causing the light intensity to drop.  
Attention in followed; Keeping of a fraction  
Temperature : 5 ~ 40ºC Humidity : less than 10%  
(3) In the case of more than 4 week passed after opening or change color of indicator  
on desiccant, components shall be dried 10-12hr. at 60±5ºC.  
(4) Silver plating might be tarnished in the environment that contains corrosive gases  
and materials. Also any product that has tarnished lead might be decreased the  
solder-ability and optical-electrical properties compare to normal ones.  
Please do not expose the product in the corrosive environment during the storage.  
(5) Any mechanical force or any excess vibration shall not be accepted to apply during  
cooling process to normal temperature after soldering.  
(6) Quick cooling shall be avoided.  
(7) Components shall not be mounted on warped direction of PCB.  
(8) Anti radioactive ray design is not considered for the products.  
(9) This device should not be used in any type of fluid such as water, oil, organic  
solvent etc. When washing is required, IPA should be used.  
(10) When the LEDs are illuminating, operating current should be decided after considering  
the ambient maximum temperature.  
(11) The LEDs must be soldered within seven days after opening the moisture-proof packing.  
(12) Repack unused products with anti-moisture packing, fold to close any opening and then  
store in a dry place.  
(13) The appearance and specifications of the product may be modified for improvement  
without notice.  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
11. Handling of Silicone Resin LEDs  
(1) During processing, mechanical stress on the surface should be minimized as much as  
possible. Sharp objects of all types should not be used to pierce the sealing compound.  
(2) In general, LEDs should only be handled from the side. By the way, this also applies  
to LEDs without a silicone sealant, since the surface can also become scratched.  
(3) When populating boards in SMT production, there are basically no restrictions  
regarding the form of the pick and place nozzle, except that mechanical pressure on the  
surface of the resin must be prevented.  
This is assured by choosing a pick and place nozzle which is larger than the LED’s  
reflector area.  
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.  
These conditions must be considered during the handling of such devices. Compared to  
standard encapsulants, silicone is generally softer, and the surface is more likely to  
attract dust.  
As mentioned previously, the increased sensitivity to dust requires special care  
during processing. In cases where a minimal level of dirt and dust particles cannot be  
guaranteed, a suitable cleaning solution must be applied to the surface after the  
soldering of components.  
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it  
must be assured that these solvents do not dissolve the package or resin.  
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the  
LED.  
Rev. 00  
September 2010  
www.seoulsemicon.com  
서식번호 : SSC-QP-7-07-24 (Rev.00)  
厂商 型号 描述 页数 下载

SEOUL

 		UYGT801 表面贴装LED[ surface-mount LED ] 10 页

SEOUL

 		UYGT801S-KM [ 暂无描述 ] 10 页

购物指南

支付方式

配送服务

售后服务

发票须知

优惠券使用规则

特色服务

PCBA制造

国产品牌推荐

国产料号替代

质量保证

技术资料

行业资讯

关于我们

关于壹壹捌

联系我们

联系我们

服务热线：400-618-9990

企业邮箱：sales@ic118.com

服务时间：周一至周六 8:30-17:30

壹壹捌官方微信号

PDF索引：

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

IC型号索引：

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

Copyright 2024 gkzhan.com Al Rights Reserved 京ICP备06008810号-21 京

深圳网络警察报警平台
公共信息安全网络监察
经营性网站备案信息
不良信息举报中心
工商网监电子标识
全国公安机关备案
0.265767s