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UYGT801S-KM

型号:

UYGT801S-KM

品牌:

SEOUL[ Seoul Semiconductor ]

页数:

10 页

PDF大小:

421 K

Specification  
UYGT801  
SSC  
CUSTOMER  
Drawn  
Approval  
Approval  
Document No. : SSC-QP-7-07-24 (Rev.00)  
UYGT801  
1. Features  
2. Absolute Maximum Ratings  
3. Electro Characteristics  
4. Optical characteristics  
5. Outline Dimension  
6. Packing  
7. Soldering  
8. Precaution for use  
Document No. : SSC-QP-7-07-24 (Rev.00)  
UYGT801  
UYGT801  
Description  
Features  
This surface-mount LED comes  
in PLCC standard package  
dimension. It has a substrate  
made up of a molded plastic  
reflector sitting on top of a bent  
lead frame. The die is attached  
within the reflector cavity and the  
cavity is encapsulated by epoxy  
or silicone  
Industry Standard PLCC  
SMT package  
High brightness using  
AlInGaP and InGaN  
dice technologies  
Available in multiple  
colors  
The package design coupled  
with careful selection of  
High volume, high  
reliability  
component materials allow these  
products to perform with high  
reliability in a larger temperature  
range -40to 100. The high  
reliability feature is crucial to  
Automotive interior and Indoor  
ESS.  
Applications  
Interior automotive  
Electronic Signs and  
Signals  
Office Automation,  
Electrical Appliances,  
Industrial Equipment  
Document No. : SSC-QP-7-07-24 (Rev.00)  
1. Features  
• Yellow-Green colored SMT package  
• Material AlInGaP  
• Suitable for all SMT assembly methods  
Suitable for all soldering methods  
• RoHS Compliant  
Document No. : SSC-QP-7-07-24 (Rev.00)  
2. Absolute maximum ratings  
Parameter  
Symbol  
Value  
Unit  
mW  
mA  
mA  
V
oC  
oC  
Power Dissipation  
Forward Current  
Pd  
75  
IF  
30  
90  
*2  
Peak Forward Current  
Reverse Voltage  
IFM  
VR  
Topr  
Tstg  
5
Operating Temperature  
Storage Temperature  
-40 ~ +100  
-40 ~ +100  
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.  
*2 IFM was measured at TW 1msec of pulse width and D 1/10 of duty ratio.  
3. Electric characteristics  
Parameter  
Forward Voltage  
Symbol  
VF  
Condition  
IF =20mA  
VR=5V  
Min  
Typ  
2.1  
-
Max  
2.5  
10  
105  
-
Unit  
V
1.7  
Reverse Current  
Luminance Intensity *1  
IR  
-
75  
-
µA  
IV  
IF =20mA  
IF =20mA  
IF =20mA  
IF =20mA  
IF =20mA  
90  
mcd  
nm  
nm  
nm  
deg.  
Peak Wavelength  
λP  
576  
572  
18  
Dominant Wavelength  
Spectral Bandwidth 50%  
Viewing Angle *2  
λd  
568  
-
576  
-
∆λ  
2θ  
-
120  
-
½
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of  
the LED package. Luminous Intensity Measurement allowance is ±10%  
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.  
Document No. : SSC-QP-7-07-24 (Rev.00)  
4. Optical characteristics  
Relative Luminous Intensity vs Forward Current  
Forward Current vs. Forward Voltage  
O
O
(Ta=25 C )  
(Ta=25 C )  
102  
101  
100  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
1.8  
1.9  
2.0  
2.1  
2.2  
0
5
10  
15  
20  
25  
30  
35  
Forward Current IF [mA]  
Forward Voltage VF (V)  
Forward  
Curve  
Current  
Derating  
Radiation Diagram  
0
O
(Ta=25 C )  
40  
30  
20  
10  
0
30  
-30  
60  
-60  
90  
-90  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
O
Ambient Temperature TA [  
C]  
Document No. : SSC-QP-7-07-24 (Rev.00)  
5.outline dimension  
Recommended Solder Pattern  
1.9  
2.8  
0.8  
2.2  
0.15  
Anode  
Cathode  
Cathode Mark  
2.2  
( Tolerance: ±0.2, Unit: mm )  
6. packing  
1.55  
± 0.05  
4.0±0.1  
0.22±0.05  
2.0±0.05  
1.0±0.1  
8°  
3.1±0.1  
2.22±0.1  
11.4±0.1  
9.0 ±0.3  
+0  
-3  
180  
2.0 ±0.2  
LABLE  
13±0.2  
30°  
10  
22  
(1) Quantity : 2000pcs/Reel  
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm  
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from  
the carrier tape at the angle of 10º to the carrier tape  
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package  
Document No. : SSC-QP-7-07-24 (Rev.00)  
Reel Packing Structure  
Reel  
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
PART NUMBER :  
SEOUL SEMICONDUCTOR CO., LTD.  
HUMIDITY INDICATOR  
DESI PAK  
Aluminum Vinyl Bag  
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
PART NUMBER :  
SEOUL SEMICONDUCTOR CO., LTD.  
Outer Box Structure  
Material : Paper(SW3B(B))  
SIZE (mm)  
TYPE  
a
c
b
7inch 245 220 142  
1 SIDE  
c
1
QUANTITY : XXXX  
LOT NUMBER : XXXXXXXXXX  
RoHS  
b
PART NUMBER :  
a
SEOUL SEMICONDUCTOR CO., LTD.  
Document No. : SSC-QP-7-07-24 (Rev.00)  
7. soldering  
(1) Lead Solder  
Lead Solder  
Lead Solder  
o
o
2.5~5 C / sec.  
240 C Max.  
10 sec. Max.  
Pre-heat  
120~150  
Pre-heating  
Pre-heat time  
120 sec. Max.  
240Max.  
10 sec. Max.  
o
60sec. Max.  
120~150 C  
2.5~5 C / sec.  
o
Above 200 C  
Peak-Temperature  
Soldering time Condition  
120sec. Max.  
(2) Lead-Free Solder  
Lead-frame Solder  
o
Lead Free Solder  
o
1~5 C / sec.  
260 C Max.  
10 sec. Max.  
Pre-heat  
150~200℃  
Pre-heating  
o
Pre-heat time  
120 sec. Max.  
260Max.  
10 sec. Max.  
60sec. Max.  
o
150~200  
C
1~5 C / sec.  
o
Above 220 C  
Peak-Temperature  
Soldering time Condition  
120sec. Max.  
(3) Hand Soldering conditions  
Do not exceed 4 seconds at maximum 315ºC under soldering iron.  
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.  
Document No. : SSC-QP-7-07-24 (Rev.00)  
8. precaution for use  
(1) Storage  
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a  
desiccant. Otherwise, to store them in the following  
environment is recommended.  
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH  
(2) Attention after open.  
LED is correspond to SMD, when LED be soldered dip, interfacial separation may  
affect the light transmission efficiency, causing the light intensity to drop. Attention  
in followed; Keeping of a fraction  
Temperature : 5 ~ 40ºC Humidity : less than 10%  
(3) In the case of more than 1 week passed after opening or change color of  
indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC.  
(4) Any mechanical force or any excess vibration shall not be accepted to apply  
during cooling process to normal temperature after soldering.  
(5) Quick cooling shall be avoided.  
(6) Components shall not be mounted on warped direction of PCB.  
(7) Anti radioactive ray design is not considered for the products.  
(8) This device should not be used in any type of fluid such as water, oil, organic  
solvent etc. When washing is required, IPA should be used.  
(9) When the LEDs are illuminating, operating current should be decided after  
considering the ambient maximum temperature.  
(10) The LEDs must be soldered within seven days after opening the moisture-proof  
packing.  
(11) Repack unused products with anti-moisture packing, fold to close any opening  
and then store in a dry place.  
(12) The appearance and specifications of the product may be modified for  
improvement without notice.  
Document No. : SSC-QP-7-07-24 (Rev.00)  
厂商 型号 描述 页数 下载

SEOUL

UYGT801 表面贴装LED[ surface-mount LED ] 10 页

SEOUL

UYGT801-S [ Dual Color LED, Yellow/green, 2.4mm, ROHS COMPLIANT, PLASTIC, SMT, LCC-2 ] 13 页

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