IXTC160N10T
Symbol
gfs
Test Conditions
Characteristic Values
ISOPLUS220 (IXTC) Outline
(TJ = 25°C unless otherwise specified)
Min.
Typ.
Max.
VDS= 10 V; ID = 60 A, Note 1
65
102
S
Ciss
Coss
Crss
6600
880
pF
pF
pF
VGS = 0 V, VDS = 25 V, f = 1 MHz
135
td(on)
tr
td(off)
tf
33
61
49
42
ns
ns
ns
ns
VGS = 10 V, VDS = 0.5 VDSS, ID = 25 A
RG = 5 Ω (External)
1.Gate 2. Drain
3.Source
Note: Bottom heatsink (Pin 4) is
electrically isolated from Pins 1,2, and 3.
Qg(on)
Qgs
132
37
nC
nC
nC
VGS= 10 V, VDS = 0.5 VDSS, ID = 25 A
Qgd
40
RthJC
RthCS
1.06°C/W
°C/W
0.5
Source-Drain Diode
Characteristic Values
TJ = 25°C unless otherwise specified)
Symbol
IS
Test Conditions
Min.
Typ.
Max.
VGS = 0 V
160
A
A
ISM
VSD
trr
Pulse width limited by TJM
IF = 25 A, VGS = 0 V, Note 1
430
1.0
V
IF = 25 A, -di/dt = 100 A/μs
60
ns
VR = 30 V, VGS = 0 V
Notes: 1. Pulse test: t ≤ 300 μs, duty cycle d ≤ 2 %;
2. Drain and Source Kelvin contacts must be located less than 5 mm
from the plastic body.
PRELIMINARYTECHNICALINFORMATION
The product presented herein is under development. The Technical Specifications
offered are derived from data gathered during objective characterizations of preliminary
engineering lots; but also may yet contain some information supplied during a pre-
production design evaluation. IXYS reserves the right to change limits, test conditions,
and dimensions without notice.
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYSMOSFETs andIGBTsarecovered by
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5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
6,759,692
6,771,478B2 7,071,537
7,005,734B2
7,063,975B2
oneormoreofthefollowingU.S.patents: