IXTH50N30L2
Symbol
Test Conditions
Characteristic Values
TO-247 Outline
(TJ = 25°C, Unless Otherwise Specified)
Min.
Typ.
Max.
gfs
VDS = 10V, ID = 0.5 • ID25, Note 1
VGS = 0V, VDS = 25V, f = 1MHz
13
22
31
S
Ciss
Coss
Crss
9300
900
pF
pF
pF
260
td(on)
tr
td(off)
tf
36
ns
ns
Resistive Switching Times
100
V
GS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Pins: 1 - Gate
2,4 - Drain
140
50
ns
ns
RG = 2 (External)
3 - Source
Qg(on)
Qgs
330
52
nC
nC
nC
VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
180
RthJC
RthCS
0.23 °C/W
°C/W
0.21
Safe Operating Area Specification
Characteristic Values
Symbol
SOA
Test Conditions
Min.
Typ.
Max.
VDS = 300V, ID = 1.1A, TC = 75°C, Tp = 2s
330
W
Source-Drain Diode
Symbol
Test Conditions
Characteristic Values
(TJ = 25C, Unless Otherwise Specified)
Min.
Typ.
Max
IS
VGS = 0V
50
A
A
ISM
VSD
Repetitive, pulse Width Limited by TJM
IF = IS, VGS = 0V, Note 1
200
1.4
V
trr
QRM
IRM
430
11
52
ns
IF = 25A, -di/dt = 100A/μs
C
VR = 100V
A
Note 1: Pulse test, t 300s, duty cycle, d 2%.
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are
derived from a subjective evaluation of the design, based upon prior knowledge and experi-
ence, and constitute a "considered reflection" of the anticipated result. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
by one or more of the following U.S. patents: 4,860,072 5,017,508
4,881,106 5,034,796
4,835,592 4,931,844
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1 6,683,344
6,534,343
6,583,505
6,727,585
6,710,405 B2 6,759,692
6,710,463
7,005,734 B2 7,157,338B2
7,063,975 B2
6,771,478 B2 7,071,537