IXTC110N055T
Symbol
gfs
Test Conditions
Characteristic Values
ISOPLUS220 (IXTC) Outline
(TJ = 25°C unless otherwise specified)
Min. Typ.
Max.
VDS = 10 V, ID = 60 A, Note 1
75
120
S
Ciss
Coss
Crss
3080
1270
285
pF
pF
pF
VGS = 0 V, VDS = 25 V, f = 1 MHz
td(on)
tr
td(off)
tf
36
62
53
53
ns
ns
ns
ns
VGS = 10 V, VDS = 0.5 VDSS, ID = 25 A
RG = 5 Ω (External)
1.Gate 2. Drain
3.Source
Note: Bottom heatsink (Pin 4) is
electrically isolated from Pins 1,2, and 3.
Qg(on)
Qgs
67
42
46
nC
nC
nC
VGS= 10 V, VDS = 0.5 VDSS, ID = 25 A
Qgd
RthJC
RthCS
1.5°C/W
°C/W
0.25
Source-Drain Diode
Characteristic Values
TJ = 25°C unless otherwise specified)
Symbol
IS
Test Conditions
Min. Typ.
Max.
VGS = 0 V
220
A
A
ISM
VSD
trr
Pulse width limited by TJM
IF = 25 A, VGS = 0 V, Note 1
600
1.0
V
IF = 25 A, -di/dt = 100 A/μs
70
ns
VR = 30 V, VGS = 0 V
Notes: 1. Pulse test, t ≤ 300 μs, duty cycle d ≤ 2 %;
2. Drain and Source Kelvin contacts must be located less than 5 mm from
the plastic body.
PRELIMINARYTECHNICALINFORMATION
The product presented herein is under development. The Technical Specifications offered
are derived from data gathered during objective characterizations of preliminary engineering
lots; but also may yet contain some information supplied during a pre-production design
evaluation. IXYS reserves the right to change limits, test conditions, and dimensions
without notice.
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYSMOSFETs andIGBTsarecovered
byoneormoreofthefollowingU.S.patents:
4,835,592
4,850,072
4,881,106
4,931,844
5,017,508
5,034,796
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123B1
6,306,728B1
6,404,065B1
6,534,343
6,583,505
6,683,344
6,710,405B2
6,710,463
6,727,585
6,759,692
6,771,478B2 7,071,537
7,005,734B2 7,157,338B2
7,063,975B2