找货询价

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

QQ咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

技术支持

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

售后咨询

一对一服务 找料无忧

专属客服

服务时间

周一 - 周六 9:00-18:00

IXSH30N60U1

型号:

IXSH30N60U1

描述:

低VCE ( sat)的IGBT与二极管高速IGBT与二极管组合式包短路SOA能力[ Low VCE(sat) IGBT with Diode High Speed IGBT with Diode Combi Packs Short Circuit SOA Capability ]

品牌:

IXYS[ IXYS CORPORATION ]

页数:

6 页

PDF大小:

85 K

VCES  
IC25 VCE(sat)  
Low VCE(sat) IGBT with Diode  
High Speed IGBT with Diode  
IXSH30N60U1  
IXSH30N60AU1  
600V 50 A 2.5V  
600V 50 A 3.0V  
CombiPacks  
Short Circuit SOA Capability  
TO-247 AD  
Symbol  
TestConditions  
MaximumRatings  
VCES  
VCGR  
TJ = 25°C to 150°C  
600  
600  
V
V
TJ = 25°C to 150°C; RGE = 1 MW  
VGES  
VGEM  
Continuous  
Transient  
±20  
±30  
V
V
G
C
E
IC25  
IC90  
ICM  
TC = 25°C  
50  
30  
A
A
A
G = Gate,  
E = Emitter,  
C = Collector,  
TAB = Collector  
TC = 90°C  
TC = 25°C, 1 ms  
100  
SSOA  
(RBSOA)  
VGE= 15 V, TJ = 125°C, RG = 33 W  
Clamped inductive load, L = 100 mH  
ICM = 60  
@ 0.8 VCES  
A
Features  
tSC  
(SCSOA)  
VGE= 15 V, VCE = 360 V, TJ = 125°C  
RG = 33 W, non repetitive  
10  
ms  
W
• Internationalstandardpackage  
JEDEC TO-247 AD  
• High frequency IGBT with guaranteed  
Short Circuit SOA capability  
• IGBT and anti-parallel FRED in one  
package  
PC  
TC = 25°C  
200  
TJ  
-55 ... +150  
150  
°C  
°C  
°C  
TJM  
Tstg  
• 2nd generation HDMOSTM process  
• Low VCE(sat)  
-55 ... +150  
Md  
Mountingtorque  
1.13/10 Nm/lb.in.  
- for low on-state conduction losses  
• MOS Gate turn-on  
- drive simplicity  
Weight  
6
g
Maximumleadtemperatureforsoldering  
1.6 mm (0.062 in.) from case for 10 s  
300  
°C  
Applications  
• AC motor speed control  
• DC servo and robot drives  
• DC choppers  
• Uninterruptiblepowersupplies(UPS)  
• Switch-modeandresonant-mode  
powersupplies  
Symbol  
TestConditions  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
BVCES  
VGE(th)  
IC = 750 mA, VGE = 0 V  
600  
5
V
V
IC = 2.5 mA, VCE = VGE  
8
Advantages  
ICES  
VCE = 0.8 • VCES  
VGE = 0 V  
TJ = 25°C  
TJ = 125°C  
500 mA  
mA  
8
• Space savings (two devices in one  
package)  
• Easy to mount with 1 screw  
(isolatedmountingscrewhole)  
• Reduces assembly time and cost  
• High power density  
IGES  
VCE = 0 V, VGE = ±20 V  
±100 nA  
VCE(sat)  
IC = IC90, VGE = 15 V  
30N60U1  
30N60AU1  
2.5  
3.0  
V
V
IXYS reserves the right to change limits, test conditions, and dimensions.  
© 2000 IXYS All rights reserved  
92714F(12/96)  
1 - 6  
IXSH 30N60U1  
IXSH 30N60AU1  
Symbol  
TestConditions  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
TO-247 AD (IXSH) Outline  
gfs  
IC = IC90; VCE = 10 V,  
7
13  
S
Pulse test, t £ 300 ms, duty cycle £ 2 %  
IC(on)  
VGE = 15 V, VCE = 10 V  
100  
A
Cies  
Coes  
Cres  
2760  
240  
51  
pF  
pF  
pF  
VCE = 25 V, VGE = 0 V, f = 1 MHz  
Qg  
110  
34  
150 nC  
45 nC  
63 nC  
Qge  
Qgc  
IC = IC90, VGE = 15 V, VCE = 0.5 VCES  
47  
Dim. Millimeter  
Inches  
Min. Max. Min. Max.  
Inductive load, TJ = 25°C  
td(on)  
tri  
td(off)  
tfi  
60  
130  
400  
ns  
ns  
ns  
A
B
19.81 20.32 0.780 0.800  
20.80 21.46 0.819 0.845  
IC = IC90, VGE = 15 V, L = 100 mH,  
C
D
15.75 16.26 0.610 0.640  
3.55 3.65 0.140 0.144  
VCE = 0.8 VCES, RG = 4.7 W  
Remarks: Switching times  
may increase for  
30N60U1  
30N60AU1  
400  
200  
ns  
ns  
E
F
4.32 5.49 0.170 0.216  
5.4  
6.2 0.212 0.244  
VCE (Clamp) > 0.8 • VCES  
,
G
H
1.65 2.13 0.065 0.084  
Eoff  
30N60AU1  
2.5  
mJ  
higher TJ or increased RG  
-
4.5  
-
0.177  
J
K
1.0  
1.4 0.040 0.055  
td(on)  
tri  
60  
130  
4.2  
ns  
ns  
10.8 11.0 0.426 0.433  
Inductive load, TJ = 125°C  
L
M
4.7  
0.4  
5.3 0.185 0.209  
0.8 0.016 0.031  
IC = IC90, VGE = 15 V,  
L = 100 mH  
Eon  
td(off)  
mJ  
N
1.5 2.49 0.087 0.102  
30N60U1  
30N60AU1  
540 1000 ns  
340 525 ns  
VCE = 0.8 VCES, RG = 4.7 W  
Remarks: Switching times  
may increase for  
VCE (Clamp) > 0.8 • VCES, higher  
TJ or increased RG  
tfi  
30N60U1  
30N60AU1  
600 1500 ns  
340  
700 ns  
Eoff  
30N60U1  
30N60AU1  
12  
6
mJ  
mJ  
RthJC  
RthCK  
0.63 K/W  
K/W  
0.25  
Reverse Diode (FRED)  
CharacteristicValues  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
Symbol  
VF  
TestConditions  
IF = IC90, VGE = 0 V,  
1.6  
15  
V
Pulse test, t £ 300 ms, duty cycle d £ 2 %  
IRM  
trr  
IF = IC90, VGE = 0 V, -diF/dt = 240 A/ms  
VR = 360 V  
10  
150  
35  
A
ns  
TJ = 125°C  
IF = 1 A; -di/dt = 100 A/ms; VR = 30 V TJ = 25°C  
50 ns  
RthJC  
1 K/W  
IXYS MOSFETS and IGBTs are covered by one or more of the following U.S. patents:  
© 2000 IXYS All rights reserved  
2 - 6  
4,835,592  
4,850,072  
4,881,106  
4,931,844  
5,017,508  
5,034,796  
5,049,961  
5,063,307  
5,187,117  
5,237,481  
5,486,715  
5,381,025  
IXSH 30N60U1  
IXSH 30N60AU1  
Fig.1 Saturation Characteristics  
Fig.2 Output Characterstics  
60  
50  
40  
30  
20  
10  
0
100  
80  
60  
40  
20  
0
VGE = 15V  
VGE = 15V  
TJ = 25°C  
TJ = 25°C  
13V  
11V  
13V  
11V  
9V  
9V  
7V  
0
1
2
3
4
5
0
2
4
6
8
10 12 14 16 18 20  
VCE - Volts  
VCE - Volts  
Fig.3 Collector-Emitter Voltage  
vs. Gate-Emitter Voltage  
Fig.4 Temperature Dependence  
of Output Saturation Voltage  
10  
9
8
7
6
5
4
3
2
1
0
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
TJ = 25°C  
IC = 60A  
V
GE = 15V  
I
C = 60A  
IC = 30A  
IC = 30A  
IC = 15A  
IC = 15A  
-50 -25  
0
25 50 75 100 125 150  
TJ - Degrees C  
8
9
10  
11  
12  
13  
14  
15  
VGE - Volts  
Fig.5 Input Admittance  
Fig.6 Temperature Dependence of  
Breakdown and Threshold Voltage  
60  
50  
40  
30  
20  
10  
0
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
V
CE = 10V  
BVCES  
IC = 3mA  
TJ = 25°C  
TJ = 125°C  
VGE(th)  
IC = 2.5mA  
TJ = - 40°C  
5
6
7
8
9
10 11 12 13 14 15  
-50 -25  
0
25 50 75 100 125 150  
TJ - Degrees C  
VGE - Volts  
© 2000 IXYS All rights reserved  
3 - 6  
IXSH 30N60U1  
IXSH 30N60AU1  
Fig.7 Turn-Off Energy per Pulse and  
Fall Time on Collector Current  
Fig.8 Dependence of Turn-Off Energy  
Per Pulse and Fall Time on RG  
1000  
750  
500  
250  
0
10.0  
7.5  
5.0  
2.5  
0.0  
1000  
750  
500  
250  
0
10.0  
TJ = 125°C  
TJ = 125°C  
Eoff (-A)  
RG = 10  
I
C = 30A  
hi-speed  
7.5  
5.0  
2.5  
0.0  
Eoff (-A), hi-speed  
tfi (-A)  
hi-speed  
tfi (-A), hi-speed  
0
10  
20  
30  
40  
50  
0
10  
20  
30  
40  
50  
60  
IC - Amperes  
RG - Ohms  
Fig.9 Gate Charge Characteristic Curve  
Fig.10 Turn-Off Safe Operating Area  
15  
12  
9
100  
10  
IC = 30A  
VCE = 300V  
TJ = 125°C  
RG = 4.7  
dV/dt < 6V/ns  
1
6
0.1  
0.01  
3
0
0
25  
50  
75  
100  
125  
150  
0
100  
200  
300  
400  
500  
600  
Qg - nanocoulombs  
VCE - Volts  
Fig.11 Transient Thermal Impedance  
1
D=0.5  
0.1 D=0.2  
D=0.1  
D=0.05  
D=0.02  
D = Duty Cycle  
0.01  
D=0.01  
Single pulse  
0.001  
0.00001  
0.0001  
0.001  
0.01  
Pulse Width - Seconds  
0.1  
1
10  
© 2000 IXYS All rights reserved  
4 - 6  
IXSH 30N60U1  
IXSH 30N60AU1  
Fig.12 Maximum Forward Voltage Drop  
Fig.13 Peak Forward Voltage VFR and  
Forward Recovery Time tfr  
100  
80  
60  
40  
20  
0
25  
20  
15  
10  
5
1000  
TJ = 125°C  
IF = 37A  
800  
TJ = 150°C  
TJ = 100°C  
TJ = 25°C  
VFR  
600  
400  
200  
tfr  
0
0
600  
0.5  
1.0  
1.5  
2.0  
2.5  
0
100  
200  
300  
400  
500  
Voltage Drop - Volts  
diF /dt - A/µs  
Fig.14 Junction Temperature Dependence  
off IRM and Qr  
Fig.15 Reverse Recovery Chargee  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
4
3
2
1
0
TJ = 100°C  
VR = 350V  
IF = 30A  
max.  
IRM  
typ.  
IF = 60A  
Qr  
IF = 30A  
IF = 15A  
0
40  
80  
120  
160  
1
10  
100  
diF /dt - A/µs  
1000  
TJ - Degrees C  
Fig.16 Peak Reverse Recovery Current  
Fig.17 Reverse Recovery Time  
40  
30  
20  
10  
0
0.8  
0.6  
0.4  
0.2  
0.0  
IF = 30A  
max.  
TJ = 100°C  
TJ = 100°C  
R = 350V  
IF = 30A  
VR = 350V  
V
max.  
typ.  
IF = 60A  
typ.  
IF = 60A  
IF = 30A  
IF = 15A  
IF = 30A  
IF = 15A  
200  
400  
600  
0
200  
400  
600  
diF /dt - A/µs  
diF /dt - A/µs  
© 2000 IXYS All rights reserved  
5 - 6  
IXSH 30N60U1  
IXSH 30N60AU1  
Fig.18 Diode Transient Thermal resistance junction to case  
1.00  
0.10  
0.01  
0.001  
0.01  
0.1  
1
Pulse Width - Seconds  
© 2000 IXYS All rights reserved  
6 - 6  
厂商 型号 描述 页数 下载

LITTELFUSE

IXS839AD2 [ Half Bridge Based MOSFET Driver, DIE-12 ] 13 页

LITTELFUSE

IXS839AQ2 [ Half Bridge Based MOSFET Driver, MO-229VEED-5, QFN-10 ] 13 页

LITTELFUSE

IXS839AQ2T/R [ Half Bridge Based MOSFET Driver, MO-229VEED-5, QFN-10 ] 13 页

LITTELFUSE

IXS839BD2 [ Half Bridge Based MOSFET Driver, DIE-12 ] 13 页

LITTELFUSE

IXS839BQ2 [ Half Bridge Based MOSFET Driver, MO-229VEED-5, QFN-10 ] 13 页

LITTELFUSE

IXS839BQ2T/R [ Half Bridge Based MOSFET Driver, MO-229VEED-5, QFN-10 ] 13 页

LITTELFUSE

IXS839D1 [ Half Bridge Based MOSFET Driver, DIE-12 ] 13 页

LITTELFUSE

IXS839S1 [ Half Bridge Based MOSFET Driver, PDSO8, MS-012AA, SOIC-8 ] 13 页

LITTELFUSE

IXS839S1T/R [ Half Bridge Based MOSFET Driver, PDSO8, MS-012AA, SOIC-8 ] 13 页

IXYS

IXSA10N60B2D1 高速IGBT与二极管[ High Speed IGBT with Diode ] 6 页

PDF索引:

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

IC型号索引:

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z

0

1

2

3

4

5

6

7

8

9

Copyright 2024 gkzhan.com Al Rights Reserved 京ICP备06008810号-21 京

0.180871s