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OV7648

型号：

OV7648

描述：

COLOR | VGA | 640 ×480 |数码|的CameraChip |技术公告\n[ COLOR | VGA | 640 x 480 | DIGITAL | CameraChip | TECHNICAL BULLETIN ]

品牌：

ETC[ ETC ]

页数：

16 页

PDF大小：

283 K

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mni isionTM  
O
TECHNICAL BULLETIN  
OmniVision Packaging Specifications  
Last Modified: 3 February 2003  
Document Version: 1.2  
Revision Number  
Date  
Revision  
1.0  
1.1  
1.2  
04/02/02  
10/09/02  
02/03/03  
Release to Marketing  
Minor corrections  
Add backend chip package specifications and minor corrections  
This document is provided "as is" with no warranties whatsoever, including any warranty of merchantability, non-in-  
fringement, fitness for any particular purpose, or any warranty otherwise arising out of any proposal, specification, or  
sample.  
OmniVision Technologies, Inc. disclaims all liability, including liability for infringement of any proprietary  
rights, relating to the use of information in this document. No license, expressed or implied, by estoppel  
or otherwise, to any intellectual property rights is granted herein.  
* Third-party brands, names, and trademarks are the property of their respective owners.  
Note:  
The information contained in this document is considered proprietary to OmniVision Technologies, Inc. This  
information may be distributed only to individuals or organizations authorized by OmniVision Technologies, Inc. to  
receive said information. Individuals and/or organizations are not allowed to re-distribute said information  
OmniVision Packaging Specifications  
mni ision  
O
00Table of Contents  
Section 1, General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Section 2, Die Position. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2.1  
2.2  
2.3  
Die Shift Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Die Tilt Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Die Rotation Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
Section 3, CameraChip Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
3.1  
3.2  
3.3  
3.4  
3.5  
24-Pin CLCC Ceramic Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
28-Pin CLCC Ceramic Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
28-Pin PLCC Plastic Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
48-Pin CLCC Ceramic Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
48-Pin PLCC Plastic Package Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
Section 4, Backend Chip Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
4.1  
4.2  
4.3  
4.4  
64-Pin TQFP Package Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
100-Pin TQFP Package Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
64-Pin BGA Package Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
100-Pin BGA Package Specification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
2
Proprietary to OmniVision Technologies  
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mni ision  
O
00List of Figures  
Figure 2-1.  
Figure 2-2.  
Figure 2-3.  
Figure 3-1.  
Figure 3-2.  
Figure 3-3.  
Figure 3-4.  
Figure 3-5.  
Figure 4-1.  
Figure 4-2.  
Figure 4-3.  
Figure 4-4.  
Die Shift Tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
Die Tilt Tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
Die Rotation Tolerances . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
24-Pin CLCC Ceramic Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
28-Pin CLCC Ceramic Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
28-Pin PLCC Plastic Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
48-Pin CLCC Ceramic Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
48-Pin PLCC Plastic Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
64-Pin TQFP Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13  
100-Pin TQFP Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
64-Pin BGA Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15  
100-Pin BGA Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Version 1.2, February 3, 2003  
Proprietary to OmniVision Technologies  
3
OmniVision Packaging Specifications  
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00List of Tables  
Table 3-1  
Table 3-2  
Table 3-3  
Table 3-4  
Table 3-5  
24-Pin CLCC Ceramic Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
28-Pin CLCC Ceramic Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9  
28-Pin PLCC Plastic Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
48-Pin CLCC Ceramic Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
48-Pin PLCC Plastic Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12  
4
Proprietary to OmniVision Technologies  
Version 1.2, February 3, 2003  
General Description  
mni ision  
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1 General Description  
This document defines and describes the package specifications and dimensions for OmniVision  
TM  
Technologies CAMERACHIPS  
.
2 Die Position  
2.1 Die Shift Specification  
Figure 2-1. illustrates the CameraChip die shift tolerances which are as follows:  
•
•
X-axis: + 0.15 mm (6.0 mils) maximum  
Y-axis: + 0.15 mm (6.0 mils) maximum  
Figure 2-1.  
Die Shift Tolerances  
Package Substrate Dam Area  
Cavity  
Boundary of Maximum  
Die Shift Allowed  
Die  
(at package center)  
0.15 mm  
X-Axis  
0.15 mm  
Y-Axis  
Version 1.2, February 3, 2003  
Proprietary to OmniVision Technologies  
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2.2 Die Tilt Specification  
Figure 2-2. illustrates the OmniVision CAMERACHIP die tilt tolerances. The tilt angle (θ) must be less than 1  
degree.  
Figure 2-2.  
Die Tilt Tolerances  
e
f
a
b
c
d
e
f
b
d
a
c
a - b  
e
c - d  
f
tan  
tan  
=
<
tan  
tan  
=
<
0.017  
0.017  
< 1 degree  
< 1 degree  
6
Proprietary to OmniVision Technologies  
Version 1.2, February 3, 2003  
Die Position  
mni ision  
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2.3 Die Rotation Specification  
Figure 2-3. illustrates the OmniVision CAMERACHIP die rotation tolerances. The rotation angle (θ) must be less  
than 3 degrees.  
Figure 2-3.  
Die Rotation Tolerances  
a
b
Dam  
c
Chip  
a - b  
tan  
tan  
=
<
c
0.035  
< 3 degrees  
Version 1.2, February 3, 2003  
Proprietary to OmniVision Technologies  
7
OmniVision Packaging Specifications  
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3 CameraChip Package Specification  
3.1 24-Pin CLCC Ceramic Package Specification  
Figure 3-1.  
24-Pin CLCC Ceramic Package Specifications  
+
+ .010  
- .005  
.270 ± .006  
.065 ± .007  
.015 ± .002  
.030 ± .003  
.075  
.250 TYP  
.020 TYP  
.400 SQ  
± .010  
.050  
TYP  
.020 ± .002  
22  
24  
1
3
3
1
24  
22  
19  
.040 REF  
TYP  
.006 R TYP  
.006 R TYP  
.085 REF  
21  
4
6
1
24  
4
21  
.005 x 45o  
PIN 1 INDEX  
.320  
± .008  
.270  
± .006  
.009 R REF  
TYP  
.005 REF  
TYP  
9
16  
7
18  
16  
9
10  
15  
15  
10  
.012 R REF  
TYP  
.012 TYP  
.022 TYP  
MP-2  
MP-1  
.050 REF TYP  
(METALLIZED)  
CERAMIC  
KYOCERA A440  
(BLACK)  
MP-3  
Table 3-1.  
24-Pin CLCC Ceramic Package Dimensions  
Dimensions Millimeters (mm)  
Inches (in.)  
Package Size  
10.16 + 0.25 / -0.13 SQ  
2.24 + 0.28  
.400 +.01 / -.005 SQ  
.088 + .011  
Package Height  
0.51 + 0.05  
.020 + .002  
Substrate Height  
Cavity Size  
6.99 + 0.15 SQ  
1.14 + 0.13  
.275 + .006 SQ  
.045 + .005  
Castellation Height  
Pin #1 Pad Size  
Pad Size  
0.51 x 2.16  
.020 x .085  
0.51 x 1.02  
.020 x .04  
1.27 + 0.10  
.050 + .004  
Pad Pitch  
1.91 + 0.25  
.075 + .01  
Package Edge to First Lead Center  
End-to-End Pad Center-Center  
Glass Size  
6.35 + 0.13  
.250 + .005  
9.50 + 0.10 SQ  
0.55 + 0.05  
.374 + .004 SQ  
.022 + .002  
Glass Height  
8
Proprietary to OmniVision Technologies  
Version 1.2, February 3, 2003  
CameraChip Package Specification  
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3.2 28-Pin CLCC Ceramic Package Specification  
Figure 3-2.  
28-Pin CLCC Ceramic Package Specifications  
.083 ± .01  
.450 SQ ± .008  
.350 SQ ± .006  
.060 ± .006  
.020 ± .002  
.020 ± .002  
.300 ± .005  
.075  
± .010  
.013 MIN  
B/F EXPOSURE  
.011 MIN  
.050  
.020 ± .002  
± .004  
5
11  
11  
5
.012 R TYP.  
.050 TYP  
12  
8
7
4
4
.022 ± .004  
12  
9
6
.001 to .005 TYP  
.014 TYP  
.010 x 45o CHAMFER  
PIN 1 INDEX  
PIN NO. 1  
INDEX  
.409  
± .004  
.020 TYP  
1
1
1
.300 SQ  
± .005  
28  
28  
28  
.025 ± .003  
20  
.008 R REF  
TYP  
18  
23  
26  
26  
20  
21  
22  
19  
25  
25  
19  
.012 R TYP.  
.007 MAX  
B/F PULL BACK  
.035  
MIN.  
.040  
TYP  
.110 REF  
TYP  
.009 R REF  
TYP  
.015 MIN  
TYP  
.085 TYP  
.200 ± .005  
MP-2  
MP-3  
.040 REF  
(METALLIZED)  
CERAMIC  
MP-4  
KYOCERA A440  
(BLACK)  
Table 3-2.  
28-Pin CLCC Ceramic Package Dimensions  
Dimensions  
Millimeters (mm)  
11.43 + 0.20 SQ  
2.11 + 0.25  
Inches (in.)  
.450 + .008 SQ  
.083 + .01  
Package Size  
Package Height  
Substrate Height  
Cavity Size  
0.51 + 0.05  
.020 + .002  
.300 + .005 SQ  
.040 + .004  
.025 x .085  
7.62 + 0.13 SQ  
1.02 + 0.1  
Castellation Height  
Pin #1 Pad Size  
Pad Size  
0.64 x 2.16  
0.64 x 1.27  
.025 x .050  
Pad Pitch  
1.27 + 0.10  
.050 + .004  
.075 + .010  
.300 + .005  
.409 + .004 SQ  
.022 + .002  
Package Edge to First Lead Center  
End-to-End Pad Center-Center  
Glass Size  
1.91 + 0.25  
7.62 + 0.13  
10.41 + 0.10 SQ  
0.55 + 0.05  
Glass Height  
Version 1.2, February 3, 2003  
Proprietary to OmniVision Technologies  
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OmniVision Packaging Specifications  
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3.3 28-Pin PLCC Plastic Package Specification  
Figure 3-3.  
28-Pin PLCC Plastic Package Specifications  
.093 ± .004  
.042 ± .002  
.450 SQ ± .004  
.350 SQ ± .006  
.300 ± .004  
.075 ± .004  
.050 TYP  
.028 ± .002  
.275 SQ ± .004  
.050 ± .004  
5
11  
8
7
5
11  
12  
4
.012 x 45o  
12  
4
.022 ± .002  
9
6
.001 to .005 TYP  
Pin 1  
Index  
.010 x 45o Chamfer  
Pin 1 Index  
.406  
± .004  
1
1
1
28  
28  
28  
20  
23  
18  
26  
18  
26  
19  
25  
21  
19  
22  
25  
.009 R REF  
TYP  
.035  
MIN.  
.025 ± .003  
TYP  
.085  
TYP  
.028 ± .002  
(Metallized)  
Table 3-3.  
28-Pin PLCC Plastic Package Dimensions  
Dimensions  
Millimeters (mm)  
11.43 + 0.10 SQ  
2.35 + 0.1  
Inches (in.)  
.450 + .004 SQ  
.093 + .004  
.028 + .002  
.275 + .004 SQ  
.042 + .002  
.025 x .085  
Package Size  
Package Height  
0.70 + 0.05  
Substrate Height  
Cavity Size  
7.00 + 0.10 SQ  
1.07 + 0.05  
Castellation Height  
Pin #1 Pad Size  
Pad Size  
0.64 x 2.16  
0.64 x 1.27  
.025 x .050  
1.27 + 0.10  
.050 + .004  
.075 + .004  
.300 + .004  
.406 + .004 SQ  
.022 + .002  
Pad Pitch  
1.90 + 0.10  
Package Edge to First Lead Center  
End-to-End Pad Center-Center  
Glass Size  
7.62 + 0.10  
10.30 + 0.10 SQ  
0.55 + 0.05  
Glass Height  
10  
Proprietary to OmniVision Technologies  
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CameraChip Package Specification  
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3.4 48-Pin CLCC Ceramic Package Specification  
Figure 3-4.  
48-Pin CLCC Ceramic Package Specifications  
.088 ± .011  
.560 SQ + .012 / - .005  
.430 SQ ± .005  
.065 ± .007  
.030 ± .002  
.015 ± .002  
.020 ± .002  
.440 ± .005  
.06 + .010 / - .005  
.040 TYP  
.040 ± .003  
30  
.350 SQ ± .005  
31  
42  
42  
31  
.032 MIN  
43  
42  
31  
30  
43  
30  
43  
.022 ± .004  
.001 to .005  
TYP  
.488  
± .004  
48  
1
48  
1
48  
1
Pin 1  
Index  
.012 TYP  
REF  
6
7
19  
.020 TYP  
6
19  
6
19  
7
18  
18  
18  
R .0075  
(48 PLCS)  
7
.085 TYP  
R .0075  
(4 CORNERS)  
Table 3-4.  
48-Pin CLCC Ceramic Package Dimensions  
Dimensions Millimeters (mm)  
Inches (in.)  
.560 + .012 / - .005 SQ  
.088 + .011  
14.22 + 0.30 / -0.13 SQ  
2.23 + 0.28  
Package Size  
Package Height  
Substrate Height  
Cavity Size  
0.51 + 0.05  
.020 + .002  
8.89 + 0.13 SQ  
1.14 + 0.13  
.350 + .005 SQ  
.045 + .005  
Castellation Height  
Pin #1 Pad Size  
Pad Size  
0.51 x 2.16  
.020 x .085  
0.51 x 1.02  
.020 x .040  
1.02 + 0.08  
.040 + .003  
Pad Pitch  
1.524 + 0.25 / -0.13  
11.18 + 0.13  
.06 + .010 / - .005  
.440 + .005  
Package Edge to First Lead Center  
End-to-End Pad Center-Center  
Glass Size  
12.40 + 0.10 SQ / 13.00 + 0.10 SQ  
0.55 + 0.05  
.488 + .004 SQ / .512 + .004 SQ  
.022 + .002  
Glass Height  
Version 1.2, February 3, 2003  
Proprietary to OmniVision Technologies  
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OmniVision Packaging Specifications  
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3.5 48-Pin PLCC Plastic Package Specification  
Figure 3-5.  
48-Pin PLCC Plastic Package Specifications  
.091 ± .004  
.560 SQ ± .004  
.068 ± .004  
.442 ± .004  
.060 ± .004  
.044 TYP  
.442 SQ ± .004  
.040 ± .002  
.040 ± .004  
30  
.340 SQ ± .004  
.028 ± .002  
31  
31  
42  
42  
.036 MIN  
31  
30  
42  
43  
43  
43  
30  
.022 ± .002  
.001 to .005 TYP  
.512  
± .004  
48  
1
48  
1
48  
1
6
7
19  
.020 TYP  
6
6
19  
19  
18  
7
18  
7
18  
R .0075  
(48 PLCS)  
R .0075  
(4 CORNERS)  
.079 TYP  
Table 3-5.  
48-Pin PLCC Plastic Package Dimensions  
Dimensions Millimeters (mm)  
14.22 + 0.10 SQ  
Inches (in.)  
.560 + .004 SQ  
.091 + .004  
.028 + .002  
.340 + .004 SQ  
.040 + .002  
.020 x .079  
Package Size  
2.30 + 0.10  
0.70 + 0.05  
8.60 + 0.10 SQ  
1.02 + 0.05  
0.51 x 2.00  
Package Height  
Substrate Height  
Cavity Size  
Castellation Height  
Pin #1 Pad Size  
Pad Size  
0.51 x 1.11  
.020 x .044  
Pad Pitch  
1.02 + 0.10  
1.50 + 0.10  
11.22 + 0.10  
13.00 + 0.10 SQ  
0.55 + 0.05  
.040 + .004  
.060 + .004  
.442 + .004  
.512 + .004 SQ  
.022 + .002  
Package Edge to First Lead Center  
End-to-End Pad Center-Center  
Glass Size  
Glass Height  
12  
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Backend Chip Package Specifications  
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4 Backend Chip Package Specifications  
4.1 64-Pin TQFP Package Specification  
Figure 4-1.  
64-Pin TQFP Package Specifications  
12.00  
0 ~ 7o  
10.00  
48  
33  
49  
32  
64  
17  
0.60 + 0.15  
1
16  
0.22 + 0.05  
1.00 + 0.05  
0.5  
1.20 MAX  
0.05 ~ 0.15  
1.00  
0.60 + 0.15  
NOTE: All dimensions are in mm  
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4.2 100-Pin TQFP Package Specification  
Figure 4-2.  
100-Pin TQFP Package Specifications  
16.00  
0 ~ 7o  
14.00  
75  
51  
76  
50  
14.00  
16.00  
100  
26  
0.60 + 0.15  
1
25  
0.22 + 0.05  
0.5  
1.00 + 0.05  
0.08  
1.20 MAX  
0.60 + 0.15  
1.00  
NOTE: All dimensions are in mm  
14  
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Backend Chip Package Specifications  
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4.3 64-Pin BGA Package Specification  
Figure 4-3.  
64-Pin BGA Package Specifications  
Detail A  
0.10  
Indicates  
Ball A1  
8.00 + 0.20  
8 7 6 5 4 3 2 1  
A
B
C
D
E
F
0.80 BCS  
8.00  
+ 0.20  
8.00  
+ 0.20  
5.60 BCS  
G
H
5.60 BCS  
8.00 + 0.20  
Top View  
Bottom View  
Detail B  
0.50 + 0.05  
1.20 + 0.10  
1.20 + 0.20  
0.50 + 0.05  
Side View  
Detail A  
0.70  
+ 0.05  
1.25  
+ 0.15  
0.25 + 0.05  
0.30 + 0.05  
Seating Plane  
0.12 Max  
Detail B  
NOTE: All dimensions are in mm  
Version 1.2, February 3, 2003  
Proprietary to OmniVision Technologies  
15  
OmniVision Packaging Specifications  
mni ision  
O
4.4 100-Pin BGA Package Specification  
Figure 4-4.  
100-Pin BGA Package Specifications  
Detail A  
0.10  
Indicates  
Ball A1  
9.00 + 0.20  
10 9 8 7 6 5 4 3 2 1  
A
B
C
D
E
F
G
H
I
0.80 BCS  
9.00  
+ 0.20  
9.00  
+ 0.20  
7.20 BCS  
J
9.00 + 0.20  
Top View  
7.20 BCS  
Bottom View  
Detail B  
0.50 + 0.05  
0.90 + 0.10  
0.90 + 0.20  
0.50 + 0.05  
Side View  
Detail A  
0.70  
+ 0.05  
1.25  
+ 0.15  
0.25 + 0.05  
0.30 + 0.05  
Seating Plane  
0.10 Max  
Detail B  
NOTE: All dimensions are in mm  
16  
Proprietary to OmniVision Technologies  
Version 1.2, February 3, 2003  
厂商 型号 描述 页数 下载

ETC

 		OV7 水暖OVERSINK\n[ WATER HEATING OVERSINK ] 2 页

ETC

 		OV7141 OV7640彩色CMOS VGA （ 640 ×480 ）的CameraChip OV7141黑白CMOS VGA （ 640 ×480 ）的CameraChip[ OV7640 Color CMOS VGA (640 x 480) CAMERACHIP OV7141 B&W CMOS VGA (640 x 480) CAMERACHIP ] 20 页

ETC

 		OV7410 单片CMOS彩色PAL摄像机[ SINGLE-CHIP CMOS COLOR PAL CAMERA ] 18 页

ETC

 		OV7410P 单片CMOS彩色PAL摄像机[ SINGLE-CHIP CMOS COLOR PAL CAMERA ] 18 页

ETC

 		OV7411 单片CMOS彩色PAL摄像机[ SINGLE-CHIP CMOS COLOR PAL CAMERA ] 18 页

ETC

 		OV7411N B / W | NTSC | 508 X 492 |模拟|的CameraChip |技术公告[ B/W | NTSC | 508 x 492 | ANALOG | CameraChip | TECHNICAL BULLETIN ] 16 页

ETC

 		OV7411P 单片CMOS彩色PAL摄像机[ SINGLE-CHIP CMOS COLOR PAL CAMERA ] 18 页

ETC

 		OV7431 B / W | NTSC | 508 X 492 |模拟|的CameraChip |技术公告[ B/W | NTSC | 508 x 492 | ANALOG | CameraChip | TECHNICAL BULLETIN ] 16 页

GOLLEDGE

 		OV7604C7 CMOS振荡器低功耗[ CMOS Oscillator Low Power ] 1 页

GOLLEDGE

 		OV7604C7/A [ HCMOS Output Clock Oscillator, 0.032768MHz Nom ] 1 页

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