Chip Resistor Networks
Chip Resistor Networks
Type:
EXBD:1206
EXBE:1608
EXBA:2512
EXBQ:1506
■ Features
■ High density placing for digital signal circuits
·
Bussed 8 or 15 resistors for pull up/down circuits
×
×
EXBD: 3.2 mm 1.6 mm 0.55 mm, 0.635 mm pitch
×
×
EXBE: 4.0 mm 2.1 mm 0.55 mm, 0.8 mm pitch
×
×
EXBA: 6.4 mm 3.1 mm 0.55 mm, 1.27 mm pitch
×
×
EXBQ: 3.8 mm 1.6 mm 0.45 mm, 0.5 mm pitch
Available direct placing on the bus line by means of half pitch spacing without through-holes on PWB
·
“
”
( High density placing is shown below)
■ High speed mounting using conventional placing machine
…
■ Reference Standard IEC 60115-9, JIS C 5201-9, EIAJ RC-2130
■ RoHS compliant
<High density placing>
Pull up resistors
VCC
Direct placement on the bus line
EXBE10C
VCC
EXBA10P
VCC
IC
IC
IC
IC
IC
IC
No through hole
Through holes
0.4 mm pitch
0.635 mm pitch
■Packaging Methods, Land Pattern, Soldering Conditions and Safety Precautions
Please see Data Files
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
&
9
#
&
ꢀ
ꢁ
$
ꢀ
ꢁ
ꢂ
+
Circuit Configuration
Resistance Value
Product Code
Dimension Code of
Chip Resistor Network
Resistance Suffix for Special
Tolerance Requirements
5 ꢀ
Code Common Terminal Position
The first two digits are
significant figures of
resistance value and
the third one denotes
the number of zeros
following.
Thick Film
Resistor
Network
Type: inches
D : 1206
E : 1608
A : 2512
Q : 1506
Dimensions
3.2 mmL1.6 mm
4.0 mmL2.1 mm
6.4 mmL3.1 mm
3.8 mmL1.6 mm
J
Center common circuit
(EXBD, EXBE)
C
Diagonal common circuit
(Terminal 5 and Terminal 10)
(EXBA)
P
One side common circuit
(Terminal 16)
(EXBQ)
P
E
Number of
Terminals
Diagonal common circuit
(Terminal 1 and Terminal 6)
(EXBA)
10(EXBD,E,A)
16(EXBQ)
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
01 Aug. 2012
36
