N-channel MOS-FET
2SK2908-01L,S
600V 1,2W
±9A
60W
FAP-IIIB Series
> Characteristics
Typical Output Characteristics
Drain-Source On-State Resistance vs. Tch
Typical Transfer Characteristics
ID=f(VDS); 80µs pulse test; TC=25°C
RDS(on) = f(Tch); ID=4,5A; VGS=10V
ID=f(VGS); 80µs pulse test; VDS=25V; Tch=25°C
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VDS [V]
Tch [°C]
VGS [V]
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Typical Drain-Source On-State-Resistance vs. ID
Typical Forward Transconductance vs. ID
Gate Threshold Voltage vs. Tch
RDS(on)=f(ID); 80µs pulse test; TC=25°C
gfs=f(ID); 80µs pulse test; VDS=25V; Tch=25°C
VGS(th)=f(Tch); ID=1mA; VDS=VGS
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ID [A]
ID [A]
Tch [°C]
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Typical Capacitances vs. VDS
Typical Gate Charge Characteristic
Forward Characteristics of Reverse Diode
C=f(VDS); VGS=0V; f=1MHz
VGS=f(Qg); ID=9A; TC=25°C
IF=f(VSD); 80µs pulse test;VGS=0V
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7
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9
VDS [V]
VSD [V]
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Qg [nC] ®
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Maximum Avalanche Energy vs. starting Tch
Safe Operation Area
ID=f(VDS): D=0,01, Tc=25°C
Eas=f(starting Tch): VCC=60V; IAV £9A
Transient Thermal impedance
Zthch=f(t) parameter:D=t/T
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starting Tch [°C]
VDS [V]
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t [s] ®
This specification is subject to change without notice!
