IXTA26P20P IXTP26P20P
IXTP26P20P IXTQ26P20P
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
Min.
Typ. Max.
gfs
VDS = -10V, ID = 0.5 • ID25, (Note 1)
10
17
S
Ciss
Coss
Crss
2920
540
pF
pF
pF
VGS = 0V, VDS = -25V, f = 1MHz
100
td(on)
tr
td(off)
tf
18
33
46
21
ns
ns
ns
ns
Resistive Switching Times
VGS = -10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 3.3Ω (External)
Qg(on)
Qgs
56
18
20
nC
nC
nC
VGS = -10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
RthJC
RthCS
0.5 °C/W
°C/W
(TO-3P)(TO-247)
(TO-220)
0.21
0.25
°C/W
Source-Drain Diode
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
Min. Typ.
Max.
IS
VGS = 0V
- 26
A
A
V
ISM
VSD
Repetitive
- 104
- 3.0
IF = -13A, VGS = 0V, Note 1
trr
QRM
IRM
240
2.20
-18.0
ns
μC
A
IF = -13A, -di/dt = -100A/μs
VR = -100V, VGS = 0V
Note 1: Pulse test, t ≤ 300μs; duty cycle, d ≤ 2%.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered
by one or moreof the following U.S. patents: 4,850,072 5,017,508
4,881,106 5,034,796
4,835,592 4,931,844
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1 6,683,344
6,534,343
6,583,505
6,727,585
6,710,405 B2 6,759,692
6,710,463
7,005,734 B2 7,157,338B2
7,063,975 B2
6,771,478 B2 7,071,537