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ZXTP2027F

型号:

ZXTP2027F

描述:

60V , SOT23 , PNP中等功率晶体管[ 60V, SOT23, PNP medium power transistor ]

品牌:

DIODES[ DIODES INCORPORATED ]

页数:

8 页

PDF大小:

428 K

ZXTP2027F  
60V, SOT23, PNP medium power transistor  
Summary  
V
> -100V, V  
> -60V  
(BR)CEO  
(BR)CEV  
I
= -4A  
C(cont)  
R
= 31 mtypical  
CE(sat)  
V
< -60 mV @ -1A  
CE(sat)  
P = 1.2W  
D
Complementary part number ZXTN2018F  
Description  
C
E
Advanced process capability and package design have been used to  
maximize the power handling and performance of this small outline  
transistor. The compact size and ratings of this device make it ideally suited  
to applications where space is at a premium.  
B
Features  
Higher power dissipation SOT23 package  
High peak current  
Low saturation voltage  
100V forward blocking voltage  
E
B
Applications  
MOSFET and IGBT gate driving  
Motor drive  
C
Relay, lamp and solenoid drive  
High side switches  
Pinout - top view  
Ordering information  
Device  
Reel size  
(inches)  
Tape width  
Quantity per reel  
ZXTP2027FTA  
7
8mm  
3,000  
Device marking  
951  
Issue 3 - May 2007  
© Zetex Semiconductors plc 2007  
1
www.zetex.com  
ZXTP2027F  
Absolute maximum ratings  
Parameter  
Symbol  
Limit  
Unit  
Collector-base voltage  
V
V
V
V
-100  
-100  
-60  
-7  
V
CBO  
Collector-emitter voltage  
Collector-emitter voltage  
Emitter-base voltage  
Peak pulse current  
V
V
(BR)CEV  
CEO  
V
EBO  
I
I
I
-10  
-4  
A
A
A
W
CM  
(b)  
C
B
Continuous collector current  
Base current  
-1  
o
(a)  
(b)  
(c)  
P
P
P
1.0  
8.0  
Power dissipation @ T =25 C  
Linear derating factor  
D
D
D
A
o
mW/ C  
o
1.2  
9.6  
W
Power dissipation @ T =25 C  
Linear derating factor  
A
o
mW/ C  
o
1.56  
12.5  
W
Power dissipation @ T =25 C  
Linear derating factor  
A
o
mW/ C  
o
Operating and storage temperature  
T :T  
-55 to +150  
j
stg  
C
Thermal resistance  
Parameter  
Symbol  
Value  
Unit  
(a)  
o
Rθ  
125  
JA  
Junction to ambient  
C/W  
(b)  
o
Rθ  
104  
80  
JA  
Junction to ambient  
C/W  
(c)  
o
Rθ  
JA  
Junction to ambient  
C/W  
NOTES:  
(a) Mounted on 18mm x 18mm x 1.6mm FR4 PCB with a very high coverage of 2 oz weight copper in still air conditions.  
(b)Mounted on 30mm x 30mm x 1.6mm FR4 PCB with a very high coverage of 2 oz weight copper in still air conditions.  
(c) As (b) above measured at t<5secs.  
Issue 3 - May 2007  
© Zetex Semiconductors plc 2007  
2
www.zetex.com  
ZXTP2027F  
Characteristics  
Issue 3 - May 2007  
© Zetex Semiconductors plc 2007  
3
www.zetex.com  
ZXTP2027F  
Electrical characteristics (at T  
= 25°C unless otherwise stated)  
amb  
Parameter  
Symbol  
Min. Typ. Max. Unit Conditions  
Collector-base breakdown  
voltage  
V
V
V
V
-100 -120  
V
I =-100μA  
C
(BR)CBO  
(BR)CEV  
(BR)CEO  
(BR)EBO  
Collector-emitter breakdown  
voltage  
-100 -120  
V
I =  
1  
μA, 1V> V >-0.3V  
C
BE  
(a)  
Collector-emitter breakdown  
voltage  
-60  
-75  
V
I =-10mA  
C
Emitter-base breakdown  
voltage  
-7.0  
-8.2  
V
I =-100μA  
E
Collector-emitter cut-off  
current  
I
-20  
nA  
V
V
=-80V,  
= 1V  
CEV  
CE  
BE  
Collector-base cut-off current  
Emitter-base cut-off current  
I
I
-20  
-10  
nA  
nA  
V
V
=-80V  
CBO  
CB  
EB  
=-6V  
EBO  
(a)  
(a)  
Static forward current transfer  
ratio  
H
100  
100  
80  
250  
200  
145  
40  
FE  
I =-10mA, V =-2V  
C
CE  
(a)  
300  
I =-2A, V =-2V  
C
CE  
(a)  
Ic=-4A, V =-2V  
CE  
(a)  
20  
Ic=-10A, V =-2V  
CE  
Collector-emitter saturation  
voltage  
V
-15  
-45  
-70  
-25  
-60  
-95  
mV  
mV  
mV  
mV  
CE(SAT)  
I =-100mA, I =-10mA  
C
B
(a)  
(a)  
(a)  
I =-1A, I =-100mA  
C
B
I =-2A, I =-200mA  
C
B
-155 -240  
-0.89 -1.0  
I =-4A, I =-200mA  
C
B
(a)  
Base-Emitter saturation  
voltage  
V
V
V
BE(SAT)  
BE(on)  
I =-4A, I =-200mA  
C B  
(a)  
Base-Emitter turn-on voltage  
-0.81 -0.95  
165  
V
I =-4A, V =-2V  
C
CE  
Transition frequency  
f
MHz Ic=-100mA, V =-10V,  
T
CE  
f=50MHz  
Output capacitance  
Delay timetime  
Rise time  
C
44  
12.6  
10.2  
220  
21  
pF  
ns  
ns  
ns  
ns  
V
V
=-10V, f=1MHz  
obo  
CB  
t
t
t
t
=-10V, I =-2A,  
C
=I =-200mA  
(d)  
CC  
I
B1 B2  
(r)  
Storage time  
Fall time  
(stg)  
(f)  
NOTES:  
(a) Measured under pulsed conditions. Pulse width=300S. Duty cycle Յ2%.  
Issue 3 - May 2007  
© Zetex Semiconductors plc 2007  
4
www.zetex.com  
ZXTP2027F  
Typical characteristics  
Issue 3 - May 2007  
© Zetex Semiconductors plc 2007  
5
www.zetex.com  
ZXTP2027F  
Intentionally left blank  
Issue 3 - May 2007  
© Zetex Semiconductors plc 2007  
6
www.zetex.com  
ZXTP2027F  
Package outline - SOT23  
E
e
e1  
b
3 leads  
D
L1  
E1  
A
L
c
A1  
Dim.  
Millimeters  
Min. Max.  
Inches  
Dim.  
Millimeters  
Min. Max.  
1.90 NOM  
Inches  
Min.  
-
Max.  
0.044  
0.004  
0.020  
0.008  
0.120  
Min.  
Max.  
A
A1  
b
-
1.12  
0.10  
0.50  
0.20  
3.04  
e1  
E
0.075 NOM  
0.01  
0.30  
0.085  
2.80  
0.0004  
0.012  
0.003  
0.110  
2.10  
2.64  
1.40  
0.60  
0.62  
-
0.083  
0.047  
0.104  
0.055  
E1  
L
1.20  
0.25  
0.45  
-
c
0.0098 0.0236  
D
e
L1  
-
0.018  
-
0.024  
-
0.95 NOM  
0.037 NOM  
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches  
Issue 3 - May 2007  
© Zetex Semiconductors plc 2007  
7
www.zetex.com  
ZXTP2027F  
Definitions  
Product change  
Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or  
service. Customers are solely responsible for obtaining the latest relevant information before placing orders.  
Applications disclaimer  
The circuits in this design/application note are offered as design ideas. It is the responsibility of the user to ensure that the circuit is fit for  
the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoever is  
assumed by Zetex with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights  
arising from such use or otherwise. Zetex does not assume any legal responsibility or will not be held legally liable (whether in contract,  
tort (including negligence), breach of statutory duty, restriction or otherwise) for any damages, loss of profit, business, contract,  
opportunity or consequential loss in the use of these circuit applications, under any circumstances.  
Life support  
Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written  
approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein:  
A. Life support devices or systems are devices or systems which:  
1. are intended to implant into the body  
or  
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the  
labeling can be reasonably expected to result in significant injury to the user.  
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to  
cause the failure of the life support device or to affect its safety or effectiveness.  
Reproduction  
The product specifications contained in this publication are issued to provide outline information only which (unless agreed by the  
company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a  
representation relating to the products or services concerned.  
Terms and Conditions  
All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict between the two  
when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement.  
For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office.  
Quality of product  
Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer.  
To ensure quality of service and products we strongly advise the purchase of parts directly from Zetex Semiconductors or one of our  
regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork  
Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels.  
ESD (Electrostatic discharge)  
Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices.  
The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent  
of damage can vary from immediate functional or parametric malfunction to degradation of function or performance in use over time.  
Devices suspected of being affected should be replaced.  
Green compliance  
Zetex Semiconductors is committed to environmental excellence in all aspects of its operations which includes meeting or exceeding reg-  
ulatory requirements with respect to the use of hazardous substances. Numerous successful programs have been implemented to reduce  
the use of hazardous substances and/or emissions.  
All Zetex components are compliant with the RoHS directive, and through this it is supporting its customers in their compliance with  
WEEE and ELV directives.  
Product status key:  
“Preview”  
“Active”  
Future device intended for production at some point. Samples may be available  
Product status recommended for new designs  
“Last time buy (LTB)”  
Device will be discontinued and last time buy period and delivery is in effect  
“Not recommended for new designs” Device is still in production to support existing designs and production  
“Obsolete”  
Production has been discontinued  
Datasheet status key:  
“Draft version”  
This term denotes a very early datasheet version and contains highly provisional information, which  
may change in any manner without notice.  
“Provisional version”  
“Issue”  
This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance.  
However, changes to the test conditions and specifications may occur, at any time and without notice.  
This term denotes an issued datasheet containing finalized specifications. However, changes to  
specifications may occur, at any time and without notice.  
Zetex sales offices  
Europe  
Americas  
Asia Pacific  
Corporate Headquarters  
Zetex GmbH  
Kustermann-park  
Balanstraße 59  
D-81541 München  
Germany  
Zetex Inc  
Zetex (Asia Ltd)  
Zetex Semiconductors plc  
Zetex Technology Park, Chadderton  
Oldham, OL9 9LL  
700 Veterans Memorial Highway  
Hauppauge, NY 11788  
USA  
3701-04 Metroplaza Tower 1  
Hing Fong Road, Kwai Fong  
Hong Kong  
United Kingdom  
Telefon: (49) 89 45 49 49 0  
Fax: (49) 89 45 49 49 49  
europe.sales@zetex.com  
Telephone: (1) 631 360 2222  
Fax: (1) 631 360 8222  
usa.sales@zetex.com  
Telephone: (852) 26100 611  
Fax: (852) 24250 494  
asia.sales@zetex.com  
Telephone: (44) 161 622 4444  
Fax: (44) 161 622 4446  
hq@zetex.com  
© 2007 Published by Zetex Semiconductors plc  
Issue 3 - May 2007  
© Zetex Semiconductors plc 2007  
8
www.zetex.com  
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