Precautions
■ Precautions for Correct Use
Handling
Mounting
• Only air can be used as pressure media on the products directly. It
is prohibited to use pressure media including corrosive gases (e.g.
organic solvents gases, sulfur dioxide and hydrogen sulfide gases),
fluid and any other foreign materials.
• Use lands on the printed-circuit boards to which the sensor can be
securely fixed.
• Fix pin No.2 on the printed-circuit boards, not fixed causes fluctua-
tion of sensor output signals.
• The products are not water proof. Please keep dry in use.
Soldering
• Don't use the products under dew-condensing conditions. Frozen
fluid on sensor chips may also cause fluctuation of sensor output
and other troubles.
• Due to its small size, the thermal capacity of the pressure sensor is
low. Therefore, take steps to minimize the effects of external heat.
• Don't put foreign materials (e.g. a wire or pin) into connecting tube.
It may cause breakage of pressure sensor chips or fluctuation of
sensor output caused by clogging the tube.
• Use the products within rated pressure. Usage at pressure out of
the range may cause breakage.
• Dip soldering bath: Max.260°C, within 10 sec.
• Soldering iron: Max. 260°C, within 10 sec.
• Do not heat the case of sensor package, heat only terminal.
• Use a non-corrosive resin type of flux. Since the pressure sensor
chip is exposed to the atmosphere, do not allow flux to enter inside.
• Don't use under high-frequency vibration including ultrasonic wave.
Cleaning
• The products may be broken by static electricity. Charged materials
(e.g. a workbench and a floor) and workers must provide measures
against static electricity, including ground connection.
• Since the pressure sensor chip is exposed to atmosphere, do not
allow cleaning fluid to enter inside.
• Overpowering terminals may deform them and detract their solder-
ability. Don't drop or handle the products roughly.
• Avoid ultrasonic cleaning since this may cause breaks or discon-
nections in the wiring.
• Don't use the products under humid or dusty condition.
• Terminals connection of pressure sensors must be handled as
directed by a connection diagram.
Coating
• Do not coat the pressure sensor when it is mounted to the print cir-
cuit board.
• Do not wash the print circuit board after the pressure sensor is
mounted using detergent containing silicone. Otherwise, the deter-
gent may remain on the surface of the pressure sensor.
Environmental Conditions for Transport and Storage
• It is prohibited to keep the products with corrosive gases (e.g.
organic solvents gases, sulfur dioxide and hydrogen sulfide gases).
• The products are not water proof. Please keep dry during storage.
• An anti-static treatment has been applied to the sleeves. Please
note the following points.
1. Getting wet may remove an anti-static treatment and elimi-
nate its effect.
2. The sleeves may feel sticky under hot and humid condition
due to the nature of the anti-static treatment.
3. Anti-static has aging degradation. It is prohibited to keep the
sleeves for more than six months. The sleeves are also non-
reusable.
• Don't keep the products under humid or dusty condition.
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MEMS Gauge Pressure Sensor 2SMPP
