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TXS0102_09

型号：

TXS0102_09

描述：

2位双向​​电压电平转换为漏极开路和推挽应用[ 2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS ]

品牌：

TI[ TEXAS INSTRUMENTS ]

页数：

18 页

PDF大小：

509 K

下载PDF手册
TXS0102  
www.ti.com .............................................................................................................................................. SCES640B–JANUARY 2007–REVISED JANUARY 2009  
2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR  
FOR OPEN-DRAIN AND PUSH-PULL APPLICATIONS  
1
FEATURES  
TYPICAL LEVEL-SHIFTER  
APPLICATIONS  
2
•
No Direction-Control Signal Needed  
•
•
•
I2C/SMBus  
UART  
•
Max Data Rates  
–
–
24 Mbps (Push Pull)  
2 Mbps (Open Drain)  
GPIO  
•
•
•
Available in the Texas Instruments NanoFree™  
Package  
DCT OR DCU PACKAGE  
(TOP VIEW)  
1.65 V to 3.6 V on A port and 2.3 V to 5.5 V on  
B1  
1
2
3
4
8
7
6
5
B2  
B port (VCCA ≤ VCCB  
)
GND  
VCCA  
A2  
VCC Isolation Feature – If Either VCC Input Is at  
GND, Both Ports Are in the High-Impedance  
State  
VCCB  
OE  
A1  
•
•
•
•
No Power-Supply Sequencing Required –  
Either VCCA or VCCB Can Be Ramped First  
Ioff Supports Partial-Power-Down Mode  
Operation  
YZP PACKAGE  
(BOTTOM VIEW)  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
D1  
C1  
B1  
A1  
D2  
C2  
B2  
A2  
4 5  
3 6  
2 7  
1 8  
A2  
A1  
VCCA  
OE  
ESD Protection Exceeds JESD 22  
VCCB  
GND  
B2  
–
A Port  
B1  
–
–
–
2500-V Human-Body Model (A114-B)  
250-V Machine Model (A115-A)  
1500-V Charged-Device Model (C101)  
–
B Port  
–
–
–
8-kV Human-Body Model (A114-B)  
250-V Machine Model (A115-A)  
1500-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This two-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to  
track VCCA. VCCA accepts any supply voltage from 1.65 V to 3.6 V. The B port is designed to track VCCB. VCCA  
must be less than or equal to VCCB. VCCB accepts any supply voltage from 2.3 V to 5.5 V. This allows for  
low-voltage bidirectional translation between any of the 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes.  
When the output-enable (OE) input is low, all outputs are placed in the high-impedance state.  
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a  
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2007–2009, Texas Instruments Incorporated  
TXS0102  
SCES640B–JANUARY 2007–REVISED JANUARY 2009 .............................................................................................................................................. www.ti.com  
ORDERING INFORMATION  
TA  
PACKAGE(1)(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING(3)  
2H_  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP  
Reel of 3000  
TXS0102YZPR  
Reel of 3000  
Tube of 250  
Reel of 3000  
TXS0102DCTR  
TXS0102DCTT  
TXS0102DCUR  
NFE_ _ _  
NFE _ _ _  
NFE_  
–40°C to 85°C  
SSOP – DCT  
VSSOP – DCU  
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(3) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
PIN DESCRIPTION  
(DCT AND DCU PACKAGES)  
NO.  
1
NAME  
B2  
FUNCTION  
Input/output B. Referenced to VCCB  
Ground  
.
2
GND  
VCCA  
A2  
3
A-port supply voltage. 1.65 V ≤ VCCA ≤ 3.6 V and VCCA ≤ VCCB  
4
Input/output A. Referenced to VCCA  
Input/output A. Referenced to VCCA  
.
.
5
A1  
3-state output mode enable. Pull OE low to place all outputs in 3-state mode.  
Referenced to VCCA  
6
OE  
.
7
8
VCCB  
B1  
B-port supply voltage. 2.3 V ≤ VCCB ≤ 5.5 V  
Input/output B. Referenced to VCCB  
.
TYPICAL OPERATING CIRCUIT  
1.8 V  
3.3 V  
0.1 mF  
0.1 mF  
1 mF  
V
CCA  
V
CCB  
1.8 V  
3.3 V  
System  
Controller  
System  
OE  
A1  
A2  
B1  
B2  
Data  
Data  
2
Submit Documentation Feedback  
Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TXS0102  
TXS0102  
www.ti.com .............................................................................................................................................. SCES640B–JANUARY 2007–REVISED JANUARY 2009  
ABSOLUTE MAXIMUM RATINGS(1)  
over recommended operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
–0.5  
–0.5  
–0.5  
MAX  
4.6  
6.5  
4.6  
6.5  
4.6  
6.5  
UNIT  
V
VCCA  
VCCB  
Supply voltage range  
Supply voltage range  
V
A port  
B port  
A port  
B port  
A port  
B port  
VI < 0  
VO < 0  
VI  
Input voltage range(2)  
V
V
V
Voltage range applied to any output  
VO  
VO  
in the high-impedance or power-off state(2)  
–0.5 VCCA + 0.5  
Voltage range applied to any output in the high or low state(2)(3)  
–0.5 VCCB + 0.5  
IIK  
IOK  
IO  
Input clamp current  
–50  
–50  
±50  
mA  
mA  
mA  
mA  
Output clamp current  
Continuous output current  
Continuous current through VCCA, VCCB, or GND  
±100  
220  
227  
102  
DCT package  
DCU package  
YZP package  
θJA  
Package thermal impedance(4)  
°C/W  
°C  
Tstg  
Storage temperature range  
–65  
150  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) The value of VCCA and VCCB are provided in the recommended operating conditions table.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
RECOMMENDED OPERATING CONDITIONS(1)(2)  
VCCA  
VCCB  
MIN  
MAX  
UNIT  
VCCA  
VCCB  
1.65  
3.6  
Supply  
V
voltage(3)  
2.3  
VCCI – 0.2  
VCCI – 0.4  
VCCI – 0.4  
VCCA × 0.65  
0
5.5  
1.65 V to 1.95 V  
2.3 V to 3.6 V  
VCCI  
A-port I/Os  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
VCCI  
High-level  
input voltage  
VIH  
V
V
B-port I/Os  
VCCI  
1.65 V to 3.6 V  
OE input  
5.5  
A-port I/Os  
0.15  
Low-level  
input voltage  
VIL  
B-port I/Os  
1.65 V to 3.6 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
0
0.15  
OE input  
0
VCCA × 0.35  
A-port I/Os, push-pull driving  
B-port I/Os, push-pull driving  
Control input  
10  
10  
10  
85  
Input transition  
rise or fall rate  
Δt/Δv  
1.65 V to 3.6 V  
ns/V  
°C  
TA  
Operating free-air temperature  
–40  
(1) VCCI is the supply voltage associated with the input port.  
(2) VCCO is the supply voltage associated with the output port.  
(3) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
3
Product Folder Link(s): TXS0102  
TXS0102  
SCES640B–JANUARY 2007–REVISED JANUARY 2009 .............................................................................................................................................. www.ti.com  
ELECTRICAL CHARACTERISTICS(1)(2)(3)  
over recommended operating free-air temperature range (unless otherwise noted)  
TA = 25°C  
–40°C to 85°C  
MIN MAX  
TEST  
CONDITIONS  
PARAMETER  
VOHA  
VOLA  
VOHB  
VOLB  
II  
VCCA  
VCCB  
UNIT  
MIN TYP MAX  
IOH = –20 µA,  
VIB ≥ VCCB – 0.4 V  
1.65 V to 3.6 V  
1.65 V to 3.6 V  
1.65 V to 3.6 V  
1.65 V to 3.6 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
VCCA × 0.67  
V
V
V
V
IOL = 1 mA,  
VIB ≤ 0.15 V  
0.4  
IOH = –20 µA,  
VIA ≥ VCCA – 0.2 V  
VCCB × 0.67  
IOL = 1 mA,  
VIA ≤ 0.15 V  
0.4  
OE  
1.65 V to 3.6 V  
0 V  
2.3 V to 5.5 V  
0 to 5.5 V  
0 V  
±1  
±1  
±1  
±1  
±2  
±2  
±2  
±2  
2.4  
2.2  
–1  
12  
–1  
1
µA  
µA  
µA  
µA  
A port  
B port  
A or B port  
Ioff  
0 to 3.6 V  
1.65 V to 3.6 V  
1.65 V to VCCB  
3.6 V  
IOZ  
2.3 V to 5.5 V  
2.3 V to 5.5 V  
0 V  
VI = VO = open,  
IO = 0  
ICCA  
µA  
µA  
0 V  
5.5 V  
1.65 V to VCCB  
3.6 V  
2.3 V to 5.5 V  
0 V  
VI = VO = open,  
IO = 0  
ICCB  
0 V  
5.5 V  
VI = VCCI or GND,  
IO = 0  
ICCA + ICCB  
1.65 V to VCCB  
2.3 V to 5.5 V  
14.4  
3.5  
µA  
CI  
OE  
3.3 V  
3.3 V  
3.3 V  
3.3 V  
2.5  
10  
5
pF  
A or B port  
A port  
B port  
Cio  
6
pF  
6
7.5  
(1) VCCI is the VCC associated with the input port.  
(2) VCCO is the VCC associated with the output port.  
(3) VCCA must be less than or equal to VCCB, and VCCA must not exceed 3.6 V.  
4
Submit Documentation Feedback  
Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TXS0102  
TXS0102  
www.ti.com .............................................................................................................................................. SCES640B–JANUARY 2007–REVISED JANUARY 2009  
TIMING REQUIREMENTS  
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)  
VCCB = 2.5 V  
± 0.2 V  
VCC = 3.3 V  
± 0.3 V  
VCC = 5 V  
± 0.5 V  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
21  
2
22  
2
24  
2
Data rate  
Mbps  
ns  
tw  
47  
45  
41  
Pulse  
duration  
Data inputs  
500  
500  
500  
TIMING REQUIREMENTS  
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)  
VCCB = 2.5 V  
± 0.2 V  
VCC = 3.3 V  
± 0.3 V  
VCC = 5 V  
± 0.5 V  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
24  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
20  
2
22  
2
Data rate  
Mbps  
ns  
2
tw  
50  
45  
41  
Pulse  
duration  
Data inputs  
500  
500  
500  
TIMING REQUIREMENTS  
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)  
VCC = 3.3 V  
± 0.3 V  
VCC = 5 V  
± 0.5 V  
UNIT  
MIN  
MAX  
23  
MIN  
MAX  
24  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Data rate  
Mbps  
ns  
2
2
tw  
43  
41  
Pulse duration  
Data inputs  
500  
500  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
5
Product Folder Link(s): TXS0102  
TXS0102  
SCES640B–JANUARY 2007–REVISED JANUARY 2009 .............................................................................................................................................. www.ti.com  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, VCCA = 1.8 V ± 0.15 V (unless otherwise noted)  
VCCB = 2.5 V VCCB = 3.3  
VCCB = 5 V  
± 0.2 V  
V
FROM  
(INPUT)  
TO  
(OUTPUT)  
TEST  
CONDITIONS  
± 0.5 V  
PARAMETER  
UNIT  
± 0.3 V  
MIN MAX MIN MAX MIN MAX  
Push-pull driving  
5.3  
8.8  
6.8  
5.4  
9.6  
7.1  
6.8  
10  
tPHL  
tPLH  
tPHL  
tPLH  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
2.3  
2.4  
2.6  
A
B
B
A
ns  
7.5  
45 260  
4.4  
36 208  
4.5  
27 198  
4.7  
1.9  
5.3  
5.3  
1.1  
4.4  
4.5  
1.2  
4
ns  
0.5  
45 175  
200  
36 140  
200  
27 102  
200  
ten  
OE  
OE  
A or B  
A or B  
ns  
ns  
tdis  
50  
40  
35  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
3.2  
38 165  
10.8  
34 145  
9.5  
2.3  
30 132  
2.7 9.1  
23 106  
9.3  
2
22  
7.6  
95  
trA  
trB  
tfA  
A-port rise time  
ns  
ns  
4
2.7  
10  
7.6  
58  
B-port rise time  
A-port fall time  
2
5.9  
6.9  
1.9  
4.3  
6
1.7 13.3  
4.2 6.1  
2.8 16.2  
4.4  
6.4  
ns  
2.9 13.8  
2.8 16.2  
tfB  
B-port fall time  
6.9 13.8  
7.5 16.2  
7
16.2  
0.7  
tSK(O)  
Channel-to-channel skew  
0.7  
0.7  
ns  
Push-pull driving  
21  
2
22  
2
24  
2
Max data rate  
Mbps  
Open-drain driving  
6
Submit Documentation Feedback  
Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TXS0102  
TXS0102  
www.ti.com .............................................................................................................................................. SCES640B–JANUARY 2007–REVISED JANUARY 2009  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, VCCA = 2.5 V ± 0.2 V (unless otherwise noted)  
VCCB = 2.5  
VCCB = 3.3 V VCCB = 5 V  
V
FROM  
(INPUT)  
TO  
(OUTPUT)  
TEST  
CONDITIONS  
± 0.3 V  
± 0.5 V  
PARAMETER  
UNIT  
± 0.2 V  
MIN MAX MIN  
MAX MIN MAX  
Push-pull driving  
3.2  
3.7  
6
3.8  
5.8  
4.4  
190  
4.3  
4
tPHL  
tPLH  
tPHL  
tPLH  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
1.7  
43  
6.3  
3.5  
250  
3
2
36  
2.1  
27  
A
B
B
A
ns  
4.1  
206  
3.6  
4.2  
1.6  
140  
200  
40  
1.8  
44  
4.7  
2.5  
170  
200  
50  
2.6  
37  
1.2  
27  
ns  
1
103  
200  
35  
ten  
OE  
OE  
A or B  
A or B  
ns  
ns  
tdis  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
2.8  
34  
7.4  
149  
8.3  
151  
5.7  
6.9  
7.8  
8.8  
0.7  
2.6  
28  
6.6  
121  
7.2  
112  
5.5  
6.2  
6.7  
9.4  
0.7  
1.8  
24  
5.6  
89  
trA  
trB  
tfA  
A-port rise time  
ns  
ns  
ns  
3.2  
35  
2.9  
24  
2.4  
12  
6.1  
64  
B-port rise time  
A-port fall time  
1.9  
4.4  
2.2  
5.1  
1.9  
4.3  
2.4  
5.4  
1.8  
4.2  
2.6  
5.3  
5.8  
6.6  
tfB  
B-port fall time  
ns  
ns  
5.4 10.4  
tSK(O)  
Channel-to-channel skew  
0.7  
Push-pull driving  
20  
2
22  
2
24  
2
Max data rate  
Mbps  
Open-drain driving  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
7
Product Folder Link(s): TXS0102  
TXS0102  
SCES640B–JANUARY 2007–REVISED JANUARY 2009 .............................................................................................................................................. www.ti.com  
SWITCHING CHARACTERISTICS  
over recommended operating free-air temperature range, VCCA = 3.3 V ± 0.3 V (unless otherwise noted)  
VCCB = 3.3 V  
± 0.3 V  
VCCB = 5 V  
± 0.5 V  
FROM  
(INPUT)  
TO  
(OUTPUT)  
TEST  
CONDITIONS  
PARAMETER  
UNIT  
MIN  
1.3  
36  
1
MAX MIN MAX  
Push-pull driving  
2.4  
4.2  
4.2  
204  
2.5  
124  
2.5  
139  
200  
40  
3.1  
4.6  
4.4  
165  
3.3  
97  
tPHL  
tPLH  
tPHL  
tPLH  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
1.4  
28  
1
A
B
B
A
ns  
ns  
2.6  
105  
200  
35  
3
3
ten  
OE  
OE  
A or B  
A or B  
ns  
ns  
tdis  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
Push-pull driving  
Open-drain driving  
2.3  
25  
2.5  
26  
2
5.6  
116  
6.4  
116  
5.4  
6.1  
7.4  
7.6  
0.7  
1.9  
19  
4.8  
85  
trA  
trB  
tfA  
A-port rise time  
ns  
ns  
ns  
2.1  
14  
7.4  
72  
B-port rise time  
A-port fall time  
B-port fall time  
1.9  
4.2  
2.4  
4.8  
5
4.3  
2.3  
5
5.7  
7.6  
8.3  
0.7  
tfB  
ns  
ns  
tSK(O)  
Channel-to-channel skew  
Push-pull driving  
23  
2
24  
2
Max data rate  
Mbps  
Open-drain driving  
8
Submit Documentation Feedback  
Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TXS0102  
TXS0102  
www.ti.com .............................................................................................................................................. SCES640B–JANUARY 2007–REVISED JANUARY 2009  
PRINCIPLES OF OPERATION  
Applications  
The TXS0102 can be used in level-translation applications for interfacing devices or systems operating at  
different interface voltages with one another. The TXS0102 is ideal for use in applications where an open-drain  
driver is connected to the data I/Os. The TXS0102 can also be used in applications where a push-pull driver is  
connected to the data I/Os, but the TXB0102 might be a better option for such push-pull applications.  
Architecture  
The TXS0102 architecture (see Figure 1) does not require a direction-control signal to control the direction of  
data flow from A to B or from B to A.  
VCCB  
VCCA  
One-  
shot  
One-  
shot  
T1  
T2  
10k  
10k  
Gate Bias  
A
B
Figure 1. Architecture of a TXS01xx Cell  
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup  
resistor to VCCB. The output one-shots detect rising edges on the A or B ports. During a rising edge, the one-shot  
turns on the PMOS transistors (T1, T2) for a short duration, which speeds up the low-to-high transition.  
Input Driver Requirements  
The fall time (tfA, tfB) of a signal depends on the output impedance of the external device driving the data I/Os of  
the TXS0102. Similarly, the tPHL and max data rates also depend on the output impedance of the external driver.  
The values for tfA, tfB, tPHL, and maximum data rates in the data sheet assume that the output impedance of the  
external driver is less than 50 Ω.  
Power Up  
During operation, ensure that VCCA ≤ VCCB at all times. During power-up sequencing, VCCA ≥ VCCB does not  
damage the device, so any power supply can be ramped up first.  
Enable and Disable  
The TXS0102 has an OE input that is used to disable the device by setting OE low, which places all I/Os in the  
Hi-Z state. The disable time (tdis) indicates the delay between the time when OE goes low and when the outputs  
actually get disabled (Hi-Z). The enable time (ten) indicates the amount of time the user must allow for the  
one-shot circuitry to become operational after OE is taken high.  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
9
Product Folder Link(s): TXS0102  
 
TXS0102  
SCES640B–JANUARY 2007–REVISED JANUARY 2009 .............................................................................................................................................. www.ti.com  
Pullup or Pulldown Resistors on I/O Lines  
Each A-port I/O has an internal 10-kΩ pullup resistor to VCCA, and each B-port I/O has an internal 10-kΩ pullup  
resistor to VCCB. If a smaller value of pullup resistor is required, an external resistor must be added from the I/O  
to VCCA or VCCB (in parallel with the internal 10-kΩ resistors).  
10  
Submit Documentation Feedback  
Copyright © 2007–2009, Texas Instruments Incorporated  
Product Folder Link(s): TXS0102  
TXS0102  
www.ti.com .............................................................................................................................................. SCES640B–JANUARY 2007–REVISED JANUARY 2009  
PARAMETER MEASUREMENT INFORMATION  
V
CCI  
V
CCO  
V
CCI  
V
CCO  
DUT  
DUT  
IN  
IN  
OUT  
OUT  
1 MW  
1 MW  
15 pF  
15 pF  
DATA RATE, PULSE DURATION, PROPAGATION DELAY,  
OUTPUT RISE AND FALL TIME MEASUREMENT USING  
AN OPEN-DRAIN DRIVER  
DATA RATE, PULSE DURATION, PROPAGATION DELAY,  
OUTPUT RISE AND FALL TIME MEASUREMENT USING  
A PUSH-PULL DRIVER  
2 × V  
CCO  
S1  
50 kW  
Open  
From Output  
Under Test  
15 pF  
50 kW  
TEST  
/t  
S1  
2 × V  
t
PZL PLZ  
CCO  
LOAD CIRCUIT FOR ENABLE/DISABLE  
TIME MEASUREMENT  
t
/t  
Open  
PHZ PZH  
t
w
V
CCI  
V
CCA  
V
/2  
V
/2  
Output  
Control  
(low-level  
enabling)  
Input  
CCI  
CCI  
V /2  
CCA  
V /2  
CCA  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
0 V  
t
PLZ  
t
PZL  
V
V
CCO  
Output  
Waveform 1  
V
CCI  
V
V
/2  
CCO  
Input  
V
/2  
/2  
V
/2  
CCI  
CCI  
0.1 y V  
CCO  
S1 at 2 × V  
CCO  
OL  
0 V  
(see Note B)  
t
PHZ  
t
t
t
PLH  
PHL  
PZH  
Output  
Waveform 2  
S1 at GND  
V
OH  
0.9 y V  
V
OH  
CCO  
0.9 y V  
CCO  
/2  
Output  
V
CCO  
V
CCO  
/2  
CCO  
(see Note B)  
0.1 y V  
CCO  
0 V  
V
OL  
t
f
t
r
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
A.  
C
L
includes probe and jig capacitance.  
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRRv10 MHz, Z = 50 Ω, dv/dt ≥ 1 V/ns.  
O
D. The outputs are measured one at a time, with one transition per measurement.  
E.  
F.  
G.  
H.  
I.  
t
t
t
V
V
and t  
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PZL  
PLH  
PHZ  
are the same as t  
PZH  
en  
are the same as t .  
pd  
PHL  
is the V associated with the input port.  
CC  
CCI  
is the V associated with the output port.  
CCO  
CC  
J. All parameters and waveforms are not applicable to all devices.  
Figure 2. Load Circuit and Voltage Waveforms  
Copyright © 2007–2009, Texas Instruments Incorporated  
Submit Documentation Feedback  
11  
Product Folder Link(s): TXS0102  
PACKAGE OPTION ADDENDUM  
www.ti.com  
16-Dec-2008  
PACKAGING INFORMATION  
Orderable Device  
TXS0102DCTR  
TXS0102DCTRE4  
TXS0102DCTT  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SM8  
DCT  
8
8
8
8
8
8
8
8
8
8
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SM8  
SM8  
SM8  
SM8  
US8  
DCT  
DCT  
DCT  
DCT  
DCU  
DCU  
DCU  
DCU  
YZP  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TXS0102DCTTE4  
TXS0102DCTTG4  
TXS0102DCUR  
TXS0102DCURG4  
TXS0102DCUT  
TXS0102DCUTG4  
TXS0102YZPR  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
US8  
3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
US8  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
US8  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DSBGA  
3000 Green (RoHS &  
no Sb/Br)  
SNAGCU  
Level-1-260C-UNLIM  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-Dec-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
TXS0102DCUR  
TXS0102YZPR  
US8  
DCU  
YZP  
8
8
3000  
3000  
180.0  
180.0  
9.2  
8.4  
2.25  
1.1  
3.35  
2.1  
1.05  
0.56  
4.0  
4.0  
8.0  
8.0  
Q3  
Q1  
DSBGA  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
16-Dec-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
TXS0102DCUR  
TXS0102YZPR  
US8  
DCU  
YZP  
8
8
3000  
3000  
202.0  
220.0  
201.0  
220.0  
28.0  
34.0  
DSBGA  
Pack Materials-Page 2  
MECHANICAL DATA  
MPDS049B – MAY 1999 – REVISED OCTOBER 2002  
DCT (R-PDSO-G8)  
PLASTIC SMALL-OUTLINE PACKAGE  
0,30  
0,15  
M
0,13  
0,65  
8
5
0,15 NOM  
2,90  
2,70  
4,25  
3,75  
Gage Plane  
PIN 1  
INDEX AREA  
0,25  
1
4
0° – 8°  
0,60  
0,20  
3,15  
2,75  
1,30 MAX  
Seating Plane  
0,10  
0,10  
0,00  
4188781/C 09/02  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion  
D. Falls within JEDEC MO-187 variation DA.  
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