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MZ5004GW

型号：

MZ5004GW

描述：

集成硅压力传感器片上信号调节，温度补偿和校准[ Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated ]

品牌：

FREESCALE[ Freescale ]

页数：

22 页

PDF大小：

464 K

下载PDF手册
Pressure  
MPXV5004G  
Rev 12, 09/2009  
Freescale Semiconductor  
Integrated Silicon Pressure Sensor  
On-Chip Signal Conditioned,  
Temperature Compensated and  
Calibrated  
The MPxx5004 series piezoresistive transducer is a state-of-the-art  
monolithic silicon pressure sensor designed for a wide range of applications,  
but particularly those employing a microcontroller or microprocessor with A/D  
inputs. This sensor combines a highly sensitive implanted strain gauge with  
advanced micromachining techniques, thin-film metallization, and bipolar  
processing to provide an accurate, high level analog output signal that is  
proportional to the applied pressure.  
MPXV5004  
MPVZ5004  
Series  
0 to 3.92 kPa  
(0 to 400 mm H2O)  
1.0 to 4.9 V Output  
Application Examples  
• Washing Machine Water Level  
• Ideally Suited for Microprocessor or  
Microcontroller-Based Systems  
• Appliance Liquid Level and Pressure  
Measurement  
Features  
• Respiratory Equipment  
• 1.5% Maximum Error for 0 to 100 mm H2O over +10° to +60°C with Auto Zero  
• 2.5% Maximum Error for 100 to 400 mm H2O over +10° to +60°C with Auto Zero  
• 6.25% Maximum Error for 0 to 400 mm H2O over +10° to +60°C without Auto Zero  
• Temperature Compensated over 10° to 60°C  
• Available in Gauge Surface Mount (SMT) or Through-Hole (DIP) Configurations  
• Durable Thermoplastic (PPS) Package  
ORDERING INFORMATION  
# of Ports  
Single  
Pressure Type  
Case  
No.  
Device  
Marking  
Device Name  
None  
Dual  
Gauge  
Differential Absolute  
Small Outline Package (MPXV5004 Series)  
MPXV5004DP  
1351  
482A  
482A  
482C  
1369  
1369  
1368  
•
•
MPXV5004DP  
MPXV5004G  
MPXV5004G  
MPXV5004G  
MPXV5004GP  
MPXV5004GP  
MPXV5004GVP  
MPXV5004GC6T1  
MPXV5004GC6U  
MPXV5004GC7U  
MPXV5004GP  
•
•
•
•
•
•
•
•
•
•
•
•
MPXV5004GPT1  
MPXV5004GVP  
Small Outline Package (Media Resistant Gel) (MPVZ5004 Series)  
MPVZ5004G6T1  
MPVZ5004G6U  
MPVZ5004G7U  
MPVZ5004GC6U  
MPVZ5004GW6U  
MPVZ5004GW7U  
482  
482  
•
•
•
•
•
•
•
•
•
MPVZ5004G  
MPVZ5004G  
MPVZ5004G  
MPVZ5004G  
MZ5004GW  
MZ5004GW  
482B  
482A  
1735  
1560  
•
•
•
© Freescale Semiconductor, Inc., 2006-2009. All rights reserved.  
Pressure  
SMALL OUTLINE PACKAGES THROUGH-HOLE  
MPVZ5004G7U  
CASE 482B-03  
MPXV5004GC7U  
CASE 482C-03  
MPVZ5004GW7U  
CASE 1560-02  
SMALL OUTLINE PACKAGES SURFACE MOUNT  
MPVZ5004G6U/6T1  
CASE 482-01  
MPXV5004G6U/6T1, MPVZ5004GC6U  
CASE 482A-01  
MPXV5004DP  
CASE 1351-01  
MPXV5004GVP  
CASE 1368-01  
MPVZ5004GW6U  
CASE 1735-01  
MPXV5004GP/GPT1  
CASE 1369-01  
MPXV5004G  
Sensors  
2
Freescale Semiconductor  
Pressure  
Operating Characteristics  
Table 1. Operating Characteristics (VS = 5.0 VDC, TA = 25°C unless otherwise noted, P1 > P2)  
Characteristic  
Symbol  
Min  
Typ  
Max  
Units  
Pressure Range  
POP  
0
—
3.92  
400  
kPa  
mm H2O  
Supply Voltage(1)  
Supply Current  
VS  
IS  
4.75  
—
5.0  
—
5.25  
10  
VDC  
mAdc  
V
Span @ 306 mm H2O (3 kPa)(2)  
VFSS  
—
—
3.0  
4.0  
—
—
Full Scale Span @ 400 mm H2O (3.92 kPa)(2)  
Offset(3)  
VOFF  
V/P  
—
0.75  
—
1.0  
1.0  
—
1.25  
—
V
Sensitivity  
V/kPa  
Accuracy (4) (5)  
0 to 100 mm H2O (10 to 60°C)  
—
±1.5  
%VFSS withauto  
zero  
100 to 400 mm H2O (10 to 60°C)  
0 to 400 mm H2O (10 to 60°C  
—
—
—
—
—
—
±2.5  
%VFSS withauto  
zero  
%VFSS without  
auto zero  
±6.25  
1. Device is ratiometric within this specified excitation range.  
2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated  
pressure.  
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.  
4. Accuracy (error budget) consists of the following:  
Linearity:Output deviation from a straight line relationship with pressure over the specified pressure range.  
Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and  
from the minimum or maximum operating temperature points, with zero differential pressure applied.  
Pressure Hysteresis:Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or  
maximum rated pressure, at 25°C.  
Offset Stability:Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with minimum rated pressure  
applied.  
TcSpan:Output deviation over the temperature range of 10 to 60°C, relative to 25°C.  
TcOffset:Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C, relative to 25°C.  
Variation from Nominal:The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.  
5. Auto Zero at Factory Installation: Due to the sensitivity of the MPVZ5004G, external mechanical stresses and mounting position can affect  
the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's  
output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature  
change of ±5°C between autozero and measurement.  
MPXV5004G  
Sensors  
Freescale Semiconductor  
3
Pressure  
Maximum Ratings  
Table 2. Maximum Ratings(1)  
Rating  
Symbol  
PMAX  
TSTG  
TA  
Value  
16  
Unit  
kPa  
°C  
Maximum Pressure (P1 > P2)  
Storage Temperature  
–30 to +100  
0 to +85  
Operating Temperature  
°C  
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.  
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.  
VS  
2
Gain Stage #2  
and  
Ground  
Reference  
Shift Circuitry  
Thin Film  
Temperature  
Compensation  
and Calibration  
Circuitry  
4
Sensing  
Element  
VOUT  
Pins 1, 5, 6, 7, and 8 are NO CONNECTS  
for small outline package device.  
3
GND  
Figure 1. Integrated Pressure Sensor Schematic  
On-chip Temperature Compensation and Calibration  
The performance over temperature is achieved by  
integrating the shear-stress strain gauge, temperature  
compensation, calibration and signal conditioning circuitry  
onto a single monolithic chip.  
Figure 2 illustrates the gauge configuration in the basic  
chip carrier (Case 482). A fluorosilicone gel isolates the die  
surface and wire bonds from the environment, while allowing  
the pressure signal to be transmitted to the silicon diaphragm.  
The MPxx5004G series sensor operating characteristics  
are based on use of dry air as pressure media. Media, other  
than dry air, may have adverse effects on sensor  
qualification test for dry air, and other media, are available  
from the factory. Contact the factory for information regarding  
media tolerance in your application.  
Figure 3 shows the recommended decoupling circuit for  
interfacing the output of the MPxx5004G to the A/D input of  
the microprocessor or microcontroller. Proper decoupling of  
the power supply is recommended.  
Typical, minimum and maximum output curves are shown  
for operation over a temperature range of 10°C to 60°C using  
the decoupling circuit shown in Figure 3. The output will  
saturate outside of the specified pressure range.  
performance and long-term reliability. Internal reliability and  
Stainless  
Steel Cap  
Fluorosilicone  
Gel Die Coat  
Die  
P1  
Thermoplastic  
Case  
Wire Bond  
Lead Frame  
P2  
Die Bond  
Differential Sensing Element  
Figure 2. Cross-Sectional Diagram (Not to Scale)  
MPXV5004G  
Sensors  
4
Freescale Semiconductor  
Pressure  
+5 V  
OUTPUT  
Vout  
Vs  
IPS  
GND  
1.0 μF  
470 pF  
0.01 μF  
Figure 3. Recommended Power Supply Decoupling and Output Filtering  
(For additional output filtering, please refer to AN1646.)  
5.0  
5.0  
4.0  
TRANSFER FUNCTION:  
out = VS*[(0.2*P) + 0.2] ± 2.5% VFSS  
TRANSFER FUNCTION:  
out = VS*[(0.2*P) + 0.2] ± 6.25% VFSS  
VS = 5.0 Vdc  
V
V
4.0  
3.0  
2.0  
VS = 5.0 Vdc  
TEMP = 10 to 60°C  
TEMP = 10 to 60°C  
3.0  
2.0  
MAX  
MAX  
TYPICAL  
TYPICAL  
MIN  
MIN  
1.0  
0
1.0  
0
0
1.0  
2.0  
Differential Pressure (kPa)  
3.0  
4.0  
0
1.0  
2.0  
3.0  
4.0  
Differential Pressure (kPa)  
Figure 4. Output vs. Pressure Differential  
at ±6.25% VFSS (without auto zero, Table 1., note 5)  
Figure 5. Output vs. Pressure Differential  
at ±2.5% VFSS (with auto zero, Table 1., note 5))  
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE  
Freescale Semiconductor designates the two sides of the  
The Freescale Semiconductor pressure sensor is  
designed to operate with positive differential pressure  
applied, P1 > P2.  
The Pressure (P1) side may be identified by using the  
table below.  
pressure sensor as the Pressure (P1) side and the Vacuum  
(P2) side. The Pressure (P1) side is the side containing  
silicone gel which isolates the die from the environment.  
Part Number  
Case Type  
Pressure (P1) Side Identifier  
Side with Part Marking  
MPXV5004DP  
1351  
482A  
MPXV5004GC6U/6T1,  
MPVZ5004GC6U  
Side with Port Attached  
MPXV5004GC7U  
MPXV5004GP/GPT1  
MPXV5004GVP  
Side with Port Attached  
Side with Port Attached  
Stainless Steel Cap  
Stainless Steel Cap  
Stainless Steel Cap  
Vertical Port Attached  
Vertical Port Attached  
482C  
1369  
1368  
482  
MPVZ5004G6U/6T1  
MPVZ5004G7U  
482B  
1735  
1560  
MPVZ5004GW6U  
MPVZ5004GW7U  
MPXV5004G  
Sensors  
Freescale Semiconductor  
5
Pressure  
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)  
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE  
MOUNTED APPLICATIONS  
between the board and the package. With the correct  
footprint, the packages will self align when subjected to a  
solder reflow process. It is always recommended to design  
boards with a solder mask layer to avoid bridging and  
shorting between solder pads.  
Surface mount board layout is a critical portion of the total  
design. The footprint for the surface mount packages must be  
the correct size to ensure proper solder connection interface  
0.100 TYP 8X  
2.54  
0.660  
16.76  
0.060 TYP 8X  
1.52  
0.300  
7.62  
inch  
0.100 TYP 8X  
2.54  
mm SCALE 2:1  
Figure 6. SOP Footprint (Case 482)  
MPXV5004G  
Sensors  
6
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
-A-  
D 8 PL  
0.25 (0.010)  
4
1
M
S
S
A
T
B
5
8
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
-B-  
G
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
INCHES  
MIN MAX  
MILLIMETERS  
S
N
DIM  
A
B
C
D
G
H
J
K
M
N
MIN  
10.54  
10.54  
5.38  
MAX  
10.79  
10.79  
5.84  
0.415 0.425  
0.415 0.425  
0.212 0.230  
0.038 0.042  
0.100 BSC  
0.96  
1.07  
2.54 BSC  
0.002 0.010  
0.009 0.011  
0.061 0.071  
0.05  
0.23  
1.55  
0˚  
0.25  
0.28  
1.80  
7˚  
H
C
J
0˚  
7˚  
-T-  
0.405 0.415  
0.709 0.725  
10.29  
18.01  
10.54  
18.41  
SEATING  
PLANE  
S
PIN 1 IDENTIFIER  
K
M
CASE 482-01  
ISSUE O  
SMALL OUTLINE PACKAGE  
SURFACE MOUNT  
-A-  
D 8 PL  
4
M
S
S
A
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
0.25 (0.010)  
T
B
5
8
N
-B-  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
G
1
INCHES  
MIN MAX  
MILLIMETERS  
DIM  
A
B
C
D
G
H
J
K
M
N
MIN  
10.54  
10.54  
12.70  
0.96  
MAX  
10.79  
10.79  
13.21  
1.07  
S
0.415 0.425  
0.415 0.425  
0.500 0.520  
0.038 0.042  
0.100 BSC  
W
2.54 BSC  
0.002 0.010  
0.009 0.011  
0.061 0.071  
0.05  
0.23  
1.55  
0˚  
0.25  
0.28  
1.80  
7˚  
V
0˚  
7˚  
C
0.444 0.448  
0.709 0.725  
0.245 0.255  
0.115 0.125  
11.28  
18.01  
6.22  
2.92  
11.38  
18.41  
6.48  
3.17  
S
V
W
H
J
-T-  
SEATING  
PLANE  
PIN 1 IDENTIFIER  
M
K
CASE 482A-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
SURFACE MOUNT  
MPXV5004G  
Sensors  
Freescale Semiconductor  
7
Pressure  
PACKAGE DIMENSIONS  
–A–  
NOTES:  
4
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.  
6. DIMENSION S TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
5
–B–  
8
G
D 8 PL  
1
M
S
S
0.25 (0.010)  
T
B
A
INCHES  
MILLIMETERS  
DIM  
A
B
C
D
G
J
K
M
N
S
MIN  
MAX  
0.425  
0.425  
0.220  
0.034  
MIN  
10.54  
10.54  
5.33  
0.66  
2.54 BSC  
0.23  
2.54  
0
10.29  
13.72  
MAX  
10.79  
10.79  
5.59  
DETAIL X  
0.415  
0.415  
0.210  
0.026  
S
N
PIN 1 IDENTIFIER  
0.864  
0.100 BSC  
0.009  
0.100  
0
0.405  
0.540  
0.011  
0.120  
15  
0.415  
0.560  
0.28  
3.05  
15  
10.54  
14.22  
C
SEATING  
PLANE  
–T–  
K
M
J
DETAIL X  
CASE 482B-03  
ISSUE B  
SMALL OUTLINE PACKAGE  
THROUGH-HOLE  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
-A-  
4
5
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.  
6. DIMENSION S TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
N
-B-  
D 8 PL  
G
M
S
S
A
INCHES  
MILLIMETERS  
8
0.25 (0.010)  
T B  
1
DIM MIN MAX MIN  
MAX  
10.79  
10.79  
13.21  
0.864  
A
B
C
D
G
J
K
M
N
S
0.415  
0.425 10.54  
0.425 10.54  
0.520 12.70  
DETAIL X  
0.415  
0.500  
0.026  
S
W
0.034  
0.66  
0.100 BSC  
2.54 BSC  
0.009  
0.100  
0˚  
0.011  
0.120  
15˚  
0.23  
2.54  
0˚  
0.28  
3.05  
15˚  
V
PIN 1  
IDENTIFIER  
0.444  
0.540  
0.245  
0.115  
0.448 11.28  
0.560 13.72  
11.38  
14.22  
6.48  
3.17  
C
V
W
0.255  
0.125  
6.22  
2.92  
SEATING  
PLANE  
-T-  
K
M
J
DETAIL X  
CASE 482C-03  
ISSUE B  
SMALL OUTLINE PACKAGE  
THROUGH-HOLE  
MPXV5004G  
Sensors  
Freescale Semiconductor  
8
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 1351-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
SURFACE MOUNT  
MPXV5004G  
Sensors  
Freescale Semiconductor  
9
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 1351-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
SURFACE MOUNT  
MPXV5004G  
10  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 3  
CASE 1368-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
SURFACE MOUNT  
MPXV5004G  
Sensors  
Freescale Semiconductor  
11  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 3  
CASE 1368-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
SURFACE MOUNT  
MPXV5004G  
12  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 3 OF 3  
CASE 1368-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
SURFACE MOUNT  
MPXV5004G  
Sensors  
Freescale Semiconductor  
13  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 2  
CASE 1369-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPXV5004G  
14  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 2  
CASE 1369-01  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPXV5004G  
Sensors  
Freescale Semiconductor  
15  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 3  
1560-03  
ISSUE C  
SMALL OUTLINE PACKAGE  
MPXV5004G  
16  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 3  
CASE 1560-03  
ISSUE D  
SMALL OUTLINE PACKAGE  
MPXV5004G  
Sensors  
Freescale Semiconductor  
17  
Pressure  
PACKAGE DIMENSIONS  
PAGE 3 OF 3  
CASE 1560-03  
ISSUE D  
SMALL OUTLINE PACKAGE  
MPXV5004G  
18  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 1 OF 3  
CASE 1735-02  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPXV5004G  
Sensors  
Freescale Semiconductor  
19  
Pressure  
PACKAGE DIMENSIONS  
PAGE 2 OF 3  
CASE 1735-02  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPXV5004G  
20  
Sensors  
Freescale Semiconductor  
Pressure  
PACKAGE DIMENSIONS  
PAGE 3 OF 3  
CASE 1735-02  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPXV5004G  
Sensors  
Freescale Semiconductor  
21  
How to Reach Us:  
Home Page:  
www.freescale.com  
Web Support:  
http://www.freescale.com/support  
USA/Europe or Locations Not Listed:  
Freescale Semiconductor, Inc.  
Technical Information Center, EL516  
2100 East Elliot Road  
Tempe, Arizona 85284  
1-800-521-6274 or +1-480-768-2130  
www.freescale.com/support  
Europe, Middle East, and Africa:  
Freescale Halbleiter Deutschland GmbH  
Technical Information Center  
Schatzbogen 7  
81829 Muenchen, Germany  
+44 1296 380 456 (English)  
+46 8 52200080 (English)  
+49 89 92103 559 (German)  
+33 1 69 35 48 48 (French)  
www.freescale.com/support  
Information in this document is provided solely to enable system and software  
implementers to use Freescale Semiconductor products. There are no express or  
implied copyright licenses granted hereunder to design or fabricate any integrated  
circuits or integrated circuits based on the information in this document.  
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厂商 型号 描述 页数 下载

MOTOROLA

 		MZ500-11 [ Zener Diode, 6.2V V(Z), 10%, 0.4W, Silicon, Unidirectional, DO-7, MINIATURE, PLASTIC, CASE 51, 2 PIN ] 2 页

MOTOROLA

 		MZ500-4 [ 3.3V, 0.4W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-7, MINIATURE, PLASTIC, CASE 51, 2 PIN ] 2 页

TE

 		MZ5010 三重平衡混频器[ Triple-Balanced Mixer ] 3 页

TE

 		MZ5010C 三重平衡混频器[ Triple-Balanced Mixer ] 3 页

FREESCALE

 		MZ5010G 集成硅压力传感器片上信号调节，温度补偿和校准[ Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated ] 14 页

FREESCALE

 		MZ5010GW 集成硅压力传感器片上信号调节，温度补偿和校准[ Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated ] 14 页

ETC

 		MZ51256-25 X8 SRAM\n[ x8 SRAM ] 9 页

ETC

 		MZ51256-35 X8 SRAM\n[ x8 SRAM ] 9 页

ETC

 		MZ51256-45 X8 SRAM\n[ x8 SRAM ] 9 页

ETC

 		MZ51256-70 X8 SRAM\n[ x8 SRAM ] 9 页

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