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DS1302

型号:

DS1302

描述:

涓流充电时钟芯片[ Trickle Charge Timekeeping Chip ]

品牌:

DALLAS[ DALLAS SEMICONDUCTOR ]

页数:

14 页

PDF大小:

219 K

DS1302  
Trickle Charge Timekeeping Chip  
www.dalsemi.com  
FEATURES  
PIN ASSIGNMENT  
Real time clock counts seconds, minutes  
hours, date of the month, month, day of the  
week, and year with leap year compensation  
valid up to 2100  
VCC2  
X1  
1
2
3
4
8
7
6
5
VCC1  
SCLK  
I/O  
X2  
31 x 8 RAM for scratchpad data storage  
Serial I/O for minimum pin count  
2.0–5.5V full operation  
GND  
RST  
DS1302  
8-Pin DIP (300 mil)  
Uses less than 300 nA at 2.0V  
Single–byte or multiple–byte (burst mode)  
data transfer for read or write of clock or  
RAM data  
VCC2  
X1  
1
2
3
4
8
7
6
5
VCC1  
SCLK  
I/O  
X2  
8–pin DIP or optional 8–pin SOICs for  
surface mount  
GND  
RST  
DS1302S 8-Pin SOIC (200 mil)  
DS1302Z 8-Pin SOIC (150 mil)  
Simple 3–wire interface  
TTL–compatible (VCC = 5V)  
Optional industrial temperature range  
–40°C to +85°C  
VCC2  
VCC1  
NC  
SCLK  
NC  
I/O  
NC  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
NC  
DS1202 compatible  
X1  
Recognized by Underwriters Laboratory  
NC  
X2  
NC  
ORDERING INFORMATION  
NC  
NC  
PART #  
DESCRIPTION  
GND  
RST  
DS1302  
8–Pin DIP  
16-Pin SOIC  
DS1302N  
DS1302S  
8-Pin DIP (Industrial)  
8–Pin SOIC (200 mil)  
8–Pin SOIC (Industrial)  
8–Pin SOIC (150 mil)  
8–Pin SOIC (Industrial)  
16-Pin SOIC (300 mil)  
16-Pin SOIC (Industrial)  
DS1302SN  
DS1302Z  
PIN DESCRIPTION  
DS1302ZN  
DS1302S-16  
DS1302SN-16  
X1, X2  
– 32.768 kHz Crystal Pins  
GND  
– Ground  
– Reset  
RST  
I/O  
– Data Input/Output  
– Serial Clock  
– Power Supply Pins  
SCLK  
VCC1, VCC2  
DESCRIPTION  
The DS1302 Trickle Charge Timekeeping Chip contains a real time clock/calendar and 31 bytes of static  
RAM. It communicates with a microprocessor via a simple serial interface. The real time clock/calendar  
provides seconds, minutes, hours, day, date, month, and year information. The end of the month date is  
automatically adjusted for months with less than 31 days, including corrections for leap year. The clock  
operates in either the 24–hour or 12–hour format with an AM/PM indicator.  
1 of 14  
070900  
DS1302  
Interfacing the DS1302 with a microprocessor is simplified by using synchronous serial communication.  
Only three wires are required to communicate with the clock/RAM: (1) RST (Reset), (2) I/O (Data line),  
and (3) SCLK (Serial clock). Data can be transferred to and from the clock/RAM 1 byte at a time or in a  
burst of up to 31 bytes. The DS1302 is designed to operate on very low power and retain data and clock  
information on less than 1 microwatt.  
The DS1302 is the successor to the DS1202. In addition to the basic timekeeping functions of the  
DS1202, the DS1302 has the additional features of dual power pins for primary and back–up power  
supplies, programmable trickle charger for VCC1, and seven additional bytes of scratchpad memory.  
OPERATION  
The main elements of the Serial Timekeeper are shown in Figure 1: shift register, control logic, oscillator,  
real time clock, and RAM.  
DS1302 BLOCK DIAGRAM Figure 1  
SIGNAL DESCRIPTIONS  
V
CC1 VCC1 provides low power operation in single supply and battery operated systems as well as low  
power battery backup. In systems using the trickle charger, the rechargeable energy source is connected  
to this pin.  
V
CC2 Vcc2 is the primary power supply pin in a dual supply configuration. VCC1 is connected to a  
backup source to maintain the time and date in the absence of primary power.  
The DS1302 will operate from the larger of VCC1 or VCC2. When VCC2 is greater than VCC1 + 0.2V, VCC2  
will power the DS1302. When VCC2 is less than VCC1, VCC1 will power the DS1302.  
SCLK (Serial Clock Input) SCLK is used to synchronize data movement on the serial interface.  
I/O (Data Input/Output) The I/O pin is the bi-directional data pin for the 3-wire interface.  
RST (Reset) The reset signal must be asserted high during a read or a write.  
2 of 14  
DS1302  
X1, X2 Connections for a standard 32.768 kHz quartz crystal. The internal oscillator is designed for  
operation with a crystal having a specified load capacitance of 6 pF. For more information on crystal  
selection and crystal layout considerations, please consult Application Note 58, “Crystal Considerations  
with Dallas Real Time Clocks.” The DS1302 can also be driven by an external 32.768 kHz oscillator. In  
this configuration, the X1 pin is connected to the external oscillator signal and the X2 pin is floated.  
COMMAND BYTE  
The command byte is shown in Figure 2. Each data transfer is initiated by a command byte. The MSB  
(Bit 7) must be a logic 1. If it is 0, writes to the DS1302 will be disabled. Bit 6 specifies clock/calendar  
data if logic 0 or RAM data if logic 1. Bits 1 through 5 specify the designated registers to be input or  
output, and the LSB (bit 0) specifies a write operation (input) if logic 0 or read operation (output) if logic  
1. The command byte is always input starting with the LSB (bit 0).  
ADDRESS/COMMAND BYTE Figure 2  
RESET AND CLOCK CONTROL  
All data transfers are initiated by driving the RST input high. The RST input serves two functions. First,  
RST turns on the control logic which allows access to the shift register for the address/command  
sequence. Second, the RST signal provides a method of terminating either single byte or multiple byte  
data transfer.  
A clock cycle is a sequence of a falling edge followed by a rising edge. For data inputs, data must be  
valid during the rising edge of the clock and data bits are output on the falling edge of clock. If the RST  
input is low all data transfer terminates and the I/O pin goes to a high impedance state. Data transfer is  
illustrated in Figure 3. At power–up, RST must be a logic 0 until VCC > 2.0 volts. Also SCLK must be at  
a logic 0 when RST is driven to a logic 1 state.  
DATA INPUT  
Following the eight SCLK cycles that input a write command byte, a data byte is input on the rising edge  
of the next eight SCLK cycles. Additional SCLK cycles are ignored should they inadvertently occur.  
Data is input starting with bit 0.  
DATA OUTPUT  
Following the eight SCLK cycles that input a read command byte, a data byte is output on the falling  
edge of the next eight SCLK cycles. Note that the first data bit to be transmitted occurs on the first falling  
edge after the last bit of the command byte is written. Additional SCLK cycles retransmit the data bytes  
should they inadvertently occur so long as RST remains high. This operation permits continuous burst  
mode read capability. Also, the I/O pin is tri–stated upon each rising edge of SCLK. Data is output  
starting with bit 0.  
BURST MODE  
Burst mode may be specified for either the clock/calendar or the RAM registers by addressing location 31  
decimal (address/command bits 1 through 5 = logic 1). As before, bit 6 specifies clock or RAM and bit 0  
3 of 14  
DS1302  
specifies read or write. There is no data storage capacity at locations 9 through 31 in the Clock/Calendar  
Registers or location 31 in the RAM registers. Reads or writes in burst mode start with bit 0 of address 0.  
When writing to the clock registers in the burst mode, the first eight registers must be written in order for  
the data to be transferred. However, when writing to RAM in burst mode it is not necessary to write all  
31 bytes for the data to transfer. Each byte that is written to will be transferred to RAM regardless of  
whether all 31 bytes are written or not.  
CLOCK/CALENDAR  
The clock/calendar is contained in seven write/read registers as shown in Figure 4. Data contained in the  
clock/ calendar registers is in binary coded decimal format (BCD).  
CLOCK HALT FLAG  
Bit 7 of the seconds register is defined as the clock halt flag. When this bit is set to logic 1, the clock  
oscillator is stopped and the DS1302 is placed into a low–power standby mode with a current drain of less  
than 100 nanoamps. When this bit is written to logic 0, the clock will start. The initial power on state is  
not defined.  
AM-PM/12-24 MODE  
Bit 7 of the hours register is defined as the 12– or 24–hour mode select bit. When high, the 12–hour  
mode is selected. In the 12–hour mode, bit 5 is the AM/PM bit with logic high being PM. In the 24–hour  
mode, bit 5 is the second 10-hour bit (20 – 23 hours).  
WRITE PROTECT BIT  
Bit 7 of the control register is the write-protect bit. The first seven bits (bits 0 – 6) are forced to 0 and  
will always read a 0 when read. Before any write operation to the clock or RAM, bit 7 must be 0. When  
high, the write protect bit prevents a write operation to any other register. The initial power on state is not  
defined. Therefore the WP bit should be cleared before attempting to write to the device.  
TRICKLE CHARGE REGISTER  
This register controls the trickle charge characteristics of the DS1302. The simplified schematic of  
Figure 5 shows the basic components of the trickle charger. The trickle charge select (TCS) bits (bits  
4 -7) control the selection of the trickle charger. In order to prevent accidental enabling, only a pattern of  
1010 will enable the trickle charger. All other patterns will disable the trickle charger. The DS1302  
powers up with the trickle charger disabled. The diode select (DS) bits (bits 2 – 3) select whether one  
diode or two diodes are connected between VCC2 and VCC1. If DS is 01, one diode is selected or if DS is  
10, two diodes are selected. If DS is 00 or 11, the trickle charger is disabled independently of TCS. The  
RS bits (bits 0 -1) select the resistor that is connected between VCC2 and VCC1. The resistor selected by  
the resistor select (RS) bits is as follows:  
RS Bits  
00  
Resistor  
None  
R1  
Typical Value  
None  
01  
2 k  
10  
11  
R2  
4 kΩ  
8 kΩ  
R3  
If RS is 00, the trickle charger is disabled independently of TCS.  
4 of 14  
DS1302  
Diode and resistor selection is determined by the user according to the maximum current desired for  
battery or super cap charging. The maximum charging current can be calculated as illustrated in the  
following example. Assume that a system power supply of 5 volt is applied to VCC2 and a super cap is  
connected to VCC1. Also assume that the trickle charger has been enabled with one diode and resistor R1  
between VCC2 and VCC1. The maximum current Imax would therefore be calculated as follows:  
Imax = (5.0V – diode drop) / R1  
~ (5.0V – 0.7V) / 2 kΩ  
~ 2.2 mA  
Obviously, as the super cap charges, the voltage drop between VCC2 and VCC1 will decrease and therefore  
the charge current will decrease.  
CLOCK/CALENDAR BURST MODE  
The clock/calendar command byte specifies burst mode operation. In this mode the first eight  
clock/calendar registers can be consecutively read or written (see Figure 4) starting with bit 0 of address  
0.  
If the write protect bit is set high when a write clock/calendar burst mode is specified, no data transfer  
will occur to any of the eight clock/calendar registers (this includes the control register). The trickle  
charger is not accessible in burst mode.  
At the beginning of a clock burst read, the current time is transferred to a second set of registers. The  
time information is read from these secondary registers, while the clock may continue to run. This  
eliminates the need to re-read the registers in case of an update of the main registers during a read.  
RAM  
The static RAM is 31 x 8 bytes addressed consecutively in the RAM address space.  
RAM BURST MODE  
The RAM command byte specifies burst mode operation. In this mode, the 31 RAM registers can be  
consecutively read or written (see Figure 4) starting with bit 0 of address 0.  
REGISTER SUMMARY  
A register data format summary is shown in Figure 4.  
CRYSTAL SELECTION  
A 32.768 kHz crystal can be directly connected to the DS1302 via X1 and X2. The crystal selected for  
use should have a specified load capacitance (CL) of 6 pF. For more information on crystal selection and  
crystal layout consideration, please consult Application Note 58, “Crystal Considerations with Dallas  
Real Time Clocks."  
5 of 14  
DS1302  
DATA TRANSFER SUMMARY Figure 3  
SINGLE BYTE READ  
RST  
SCLK  
I/O  
R/ W A0 A1 A2  
A3 A4 R/C 1  
SINGLE BYTE WRITE  
RST  
SCLK  
I/O  
R/ W A0 A1 A2  
A3 A4 R/C 1  
D0  
D1 D2 D3 D4 D5 D6 D7  
In burst mode, RST is kept high and additional SCLK cycles are sent until the end of the burst.  
6 of 14  
DS1302  
REGISTER ADDRESS/DEFINITION Figure 4  
7 of 14  
DS1302  
DS1302 PROGRAMMABLE TRICKLE CHARGER Figure 5  
8 of 14  
DS1302  
ABSOLUTE MAXIMUM RATINGS*  
Voltage on Any Pin Relative to Ground –0.5V to +7.0V  
Operating Temperature  
Storage Temperature  
Soldering Temperature  
0°C to 70°C or - 40°C to +85°C for industrial  
–55°C to +125°C  
260°C for 10 seconds (DIP)  
See IPC/JEDEC Standard J-STD-020A for  
Surface Mount Devices  
* This is a stress rating only and functional operation of the device at these or any other conditions above  
those indicated in the operation sections of this specification is not implied. Exposure to absolute  
maximum rating conditions for extended periods of time may affect reliability.  
RECOMMENDED DC OPERATING CONDITIONS  
(0ºC to 70ºC or -40°C to +85°C)  
PARAMETER  
Supply Voltage VCC1, VCC2  
Logic 1 Input  
SYMBOL  
VCC1,  
MIN TYP  
2.0  
MAX  
UNITS NOTES  
5.5  
V
1, 11  
VCC2  
VIH  
2.0  
VCC+0.3  
+0.3  
+0.8  
V
V
1
1
VCC=2.0V -0.3  
VCC=5V  
Logic 0 Input  
VIL  
–0.3  
*-40°C to +85°C for industrial device.  
DC ELECTRICAL CHARACTERISTICS  
(0ºC to 70ºC or -40°C to +85°C; VCC = 2.0 to 5.5V*)  
PARAMETER  
Input Leakage  
I/O Leakage  
SYMBOL  
MIN TYP MAX UNITS NOTES  
ILI  
+500  
µA  
6
ILO  
+500  
µA  
6
VCC=2.0V  
VCC=5V  
1.6  
2.4  
Logic 1 Output  
VOH  
V
V
2
VCC=2.0V  
VCC=5V  
0.4  
0.4  
0.4  
1.2  
0.3  
1
Logic 0 Output  
VOL  
3
VCC1=2.0V  
VCC1=5V  
VCC1=2.0V  
VCC1=5V  
VCC1=2.0V  
VCC1=5V  
IND  
Active Supply Current  
Timekeeping Current  
ICC1A  
ICC1T  
mA  
µA  
5, 12  
4, 12  
100  
100  
200  
0.425  
1.28  
25.3  
81  
10, 12,  
14  
Standby Current  
ICC1S  
nA  
VCC2=2.0V  
VCC2=5V  
VCC2=2.0V  
VCC2=5V  
VCC2=2.0V  
VCC2=5V  
Active Supply Current  
Timekeeping Current  
Standby Current  
ICC2A  
ICC2T  
ICC2S  
mA  
µA  
µA  
5, 13  
4, 13  
25  
10, 13  
80  
R1  
R2  
2
4
kꢀ  
kꢀ  
kꢀ  
V
Trickle Charge Resistors  
R3  
8
Trickle Charge Diode Voltage Drop  
*Unless otherwise noted.  
VTD  
0.7  
9 of 14  
DS1302  
CAPACITANCE  
PARAMETER  
(tA = 25ºC)  
SYMBOL MIN  
TYP  
10  
MAX  
UNITS NOTES  
Input Capacitance  
CI  
CI/O  
CX  
pF  
pF  
pF  
I/O Capacitance  
15  
Crystal Capacitance  
6
AC ELECTRICAL CHARACTERISTICS  
(0ºC to 70ºC or -40°C to +85°C; VCC = 2.0 to 5.5V*)  
PARAMETER  
SYMBOL  
MIN TYP MAX UNITS NOTES  
VCC=2.0V  
200  
Data to CLK Setup  
tDC  
tCDH  
tCDD  
tCL  
ns  
ns  
7
VCC=5V  
VCC=2.0V  
VCC=5V  
50  
280  
70  
CLK to Data Hold  
CLK to Data Delay  
CLK Low Time  
7
VCC=2.0V  
VCC=5V  
800  
200  
ns  
7, 8, 9  
VCC=2.0V 1000  
ns  
7
7
7
VCC=5V  
250  
VCC=2.0V 1000  
CLK High Time  
CLK Frequency  
tCH  
ns  
VCC=5V  
VCC=2.0V  
VCC=5V  
250  
DC  
0.5  
2.0  
2000  
500  
tCLK  
tR, tF  
tCC  
MHz  
ns  
VCC=2.0V  
VCC=5V  
CLK Rise and Fall  
RST to CLK Setup  
CLK to RST Hold  
RST Inactive Time  
RST to I/O High Z  
VCC=2.0V  
VCC=5V  
4
1
7
7
7
7
7
µs  
ns  
VCC=2.0V  
VCC=5V  
240  
60  
4
tCCH  
tCWH  
tCDZ  
tCCZ  
VCC=2.0V  
VCC=5V  
µs  
ns  
1
VCC=2.0V  
VCC=5V  
280  
70  
280  
70  
VCC=2.0V  
VCC=5V  
SCLK to I/O High Z  
ns  
*Unless otherwise noted.  
10 of 14  
DS1302  
TIMING DIAGRAM: READ DATA TRANSFER Figure 5  
TIMING DIAGRAM: WRITE DATA TRANSFER Figure 6  
NOTES:  
1. All voltages are referenced to ground.  
2. Logic one voltages are specified at a source current of 1 mA at VCC=5V and 0.4 mA at VCC=2.0V,  
VOH=VCC for capacitive loads.  
3. Logic zero voltages are specified at a sink current of 4 mA at VCC=5V and 1.5 mA at VCC=2.0V,  
VOL=GND for capacitive loads.  
4. ICC1T and ICC2T are specified with I/O open, RST set to a logic “0”, and clock halt flag=0 (oscillator  
enabled).  
5. ICC1A and ICC2A are specified with the I/O pin open, RST high, SCLK=2 MHz at VCC=5V;  
SCLK=500 kHz, VCC=2.0V and clock halt flag=0 (oscillator enabled).  
6. RST , SCLK, and I/O all have 40 kpull–down resistors to ground.  
7. Measured at VIH=2.0V or VIL=0.8V and 10 ns maximum rise and fall time.  
8. Measured at VOH=2.4V or VOL=0.4V.  
9. Load capacitance = 50 pF.  
10. ICC1S and ICC2S are specified with RST , I/O, and SCLK open. The clock halt flag must be set to logic  
one (oscillator disabled).  
11. VCC=VCC2, when VCC2>VCC1 +0.2V; VCC=VCC1, when VCC1>VCC2  
.
12. VCC2=0V.  
13. VCC1=0V.  
14. Typical values are at 25°C.  
11 of 14  
DS1302  
DS1302 SERIAL TIMEKEEPER 8–PIN DIP (300-MIL)  
PKG  
DIM  
8-PIN  
MIN  
MAX  
A IN.  
MM  
B IN.  
MM  
0.360  
9.14  
0.240  
6.10  
0.400  
10.16  
0.260  
6.60  
C IN.  
MM  
0.120  
3.05  
0.140  
3.56  
D IN.  
MM  
0.300  
7.62  
0.325  
8.26  
E IN.  
MM  
0.015  
0.38  
0.040  
1.02  
F IN.  
MM  
0.120  
3.04  
0.140  
3.56  
G IN.  
MM  
0.090  
2.29  
0.110  
2.79  
H IN.  
MM  
0.320  
8.13  
0.370  
9.40  
J IN.  
MM  
0.008  
0.20  
0.012  
0.30  
K IN.  
MM  
0.015  
0.38  
0.021  
0.53  
12 of 14  
DS1302  
DS1302S SERIAL TIMEKEEPER 8–PIN SOIC (150-MIL AND 200-MIL)  
PKG  
DIM  
8-PIN  
(150 MIL)  
8-PIN  
(200 MIL)  
MIN  
MAX  
MIN  
MAX  
A IN.  
MM  
0.188  
4.78  
0.196  
4.98  
0.203  
5.16  
0.213  
5.41  
B IN.  
MM  
0.150  
3.81  
0.158  
4.01  
0.203  
5.16  
0.213  
5.41  
C IN.  
MM  
0.048  
1.22  
0.062  
1.57  
0.070  
1.78  
0.074  
1.88  
E IN.  
MM  
0.004  
0.10  
0.010  
0.25  
0.004  
0.10  
0.010  
0.25  
F IN.  
MM  
0.053  
1.35  
0.069  
1.75  
0.074  
1.88  
0.084  
2.13  
G IN.  
MM  
0.050 BSC  
1.27 BSC  
H IN.  
MM  
J IN.  
MM  
0.230  
5.84  
0.007  
0.18  
0.244  
0.302  
7.67  
0.006  
0.15  
0.318  
8.08  
0.010  
0.25  
6.20  
0.011  
0.28  
K IN.  
MM  
0.012  
0.30  
0.020  
0.51  
0.013  
0.33  
0.020  
0.51  
L IN.  
MM  
0.016  
0.41  
0.050  
1.27  
0.019  
0.48  
0.030  
0.76  
phi  
0°  
8°  
0°  
8°  
13 of 14  
DS1302  
DS1302S SERIAL TIMEKEEPER 16-PIN SOIC  
PKG  
16-PIN  
MIN MAX  
0.398 0.412  
MM 10.11 10.46  
IN 0.290 0.300  
MM 7.37 7.62  
IN 0.089 0.095  
MM 2.26 2.41  
IN 0.004 0.012  
MM 0.102 0.30  
IN 0.004 0.105  
DIM  
A
B
IN  
C
E
F
MM 2.39  
2.67  
G
H
J
IN  
0.050 BSC  
1.27 BSC  
MM  
IN  
0.398 0.416  
MM 10.11 10.57  
IN  
MM 0.229 0.33  
IN 0.013 0.020  
MM 0.33 0.51  
0.009 0.013  
K
L
IN  
0.016 0.040  
MM 0.40  
1.02  
phi  
0°  
8°  
14 of 14  
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DS1-16D [ Rectifier Diode, 1 Phase, 1 Element, 2.3A, 1600V V(RRM), Silicon, ] 1 页

SCHURTER

DS1-175-0001 存储扼流圈,全密封辞职[ Storage Choke, fully potted resign ] 3 页

SCHURTER

DS1-175-0002 存储扼流圈,全密封辞职[ Storage Choke, fully potted resign ] 3 页

SCHURTER

DS1-175-0003 存储扼流圈,全密封辞职[ Storage Choke, fully potted resign ] 3 页

SCHURTER

DS1-175-0004 存储扼流圈,全密封辞职[ Storage Choke, fully potted resign ] 3 页

SCHURTER

DS1-175-0005 存储扼流圈,全密封辞职[ Storage Choke, fully potted resign ] 3 页

SCHURTER

DS1-20-0001 存储扼流圈,全密封辞职[ Storage Choke, fully potted resign ] 3 页

SCHURTER

DS1-20-0002 存储扼流圈,全密封辞职[ Storage Choke, fully potted resign ] 3 页

SCHURTER

DS1-20-0003 存储扼流圈,全密封辞职[ Storage Choke, fully potted resign ] 3 页

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