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3SD11-SHARP

型号：

3SD11-SHARP

品牌：

ETC[ ETC ]

页数：

16 页

PDF大小：

327 K

下载PDF手册
PC3SD11NTZ Series  
VDRM : 600V  
Non-zero cross type  
DIP 6pin  
PC3SD11NTZ  
Series  
Phototriac Coupler for triggering  
∗Zero cross type is also available.  
(PC3SD21NTZ Series)  
■ Description  
■ Agency approvals/Compliance  
1. Recognized by UL1577 (Double protection isolation),  
file No. E64380 (as model No. 3SD11)  
PC3SD11NTZ Series Phototriac Coupler include an  
infrared emitting diode (IRED) optically coupled to an  
output Phototriac.  
2. Approved by CSA, file No. CA95323 (as model No.  
These devices feature full wave control and are  
ideal isolated drivers for medium to high current Triacs.  
DIP package provides 5.0kV isolation from input to  
output with superior commutative noise immunity.  
3SD11)  
3. Optionary available VDE Approved (∗)(DIN EN 60747-  
5-2), file No. 40008189 (as model No. 3SD11)  
4. Package resin : UL flammability grade (94V-0)  
(∗)  
DIN EN60747-5-2 : successor standard of DIN VDE0884.  
Up to Date code "RD" (December 2003), approval of DIN  
VDE0884.  
■ Features  
From Date code "S1" (January 2004), approval of DIN  
EN60747-5-2.  
1. High repetitive peak off-state voltage (VDRM : 600V)  
2. Non-zero crossing functionality  
3. IFT ranks available (see Model Line-up section in this  
datasheet)  
(∗∗) Reinforced insulation type is also available.  
(PC3SF11YVZ Series)  
4. 6 pin DIP package  
■ Applications  
1. Triggering for Triacs used to switch on and off  
5. Superior noise immunity (dV/dt : MIN. 1 000V/µs)  
6. Lead-free components are also available (see Model  
Line-up section in this datasheet)  
7. Double transfer mold construction (Ideal for Flow  
Soldering)  
devices which require AC Loads.  
For example heaters, fans, motors, solenoids, and  
valves.  
2. Triggering for Triacs used for implementing phase  
control in applications such as lighting control and  
temperature control (HVAC).  
9. High isolation voltage between input and output  
(Viso(rms) : 5.0kV)  
3. AC line control in power supply applications.  
Notice The content of data sheet is subject to change without prior notice.  
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP  
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.  
Sheet No.: D2-A07501EN  
1
Date Mar. 31. 2004  
© SHARP Corporation  
PC3SD11NTZ Series  
■ Internal Connection Diagram  
1
2
3
4
5
6
Anode  
Cathode  
NC  
Anode/Cathode  
No external connection  
Cathode/Anode  
1
2
6
5
3
4
(Unit : mm)  
■ Outline Dimensions  
1. Through-Hole [ex. PC3SD11NTZ]  
2. Wide Through-Hole Lead-Form [ex. PC3SD11NVZ]  
1.2±0.3  
1.2±0.3  
0.6±0.2  
0.6±0.2  
6
4
5
Model No.  
Model No.  
Rank mark  
6
5
4
SHARP  
mark  
"S"  
SHARP  
mark  
"S"  
Rank mark  
3 S D 1 1  
3 S D 1 1  
Anode  
mark  
Anode  
mark  
Date code (2 digit)  
Date code (2 digit)  
1
2
3
1
3
Factory identification mark  
2
Factory identification mark  
7.62±0.3  
7.12±0.5  
7.12±0.5  
7.62±0.3  
Epoxy resin  
Epoxy resin  
10.16±0.5  
0.26±0.1  
0.5±0.1  
2.54±0.25  
2.54±0.25  
θ
θ
0.5±0.1  
θ : 0 to 13˚  
Product mass : approx. 0.35g  
Product mass : approx. 0.35g  
3. SMT Gullwing Lead-Form [ex. PC3SD11NXP]  
4. Wide SMT Gullwing Lead-Form [ex. PC3SD11NWP]  
1.2±0.3  
0.6±0.2  
0.6±0.2  
1.2±0.3  
6
5
4
Model No.  
Rank mark  
6
5
4
Model No.  
Rank mark  
SHARP  
mark  
"S"  
SHARP  
mark  
"S"  
3 S D 1 1  
3 S D 1 1  
Anode  
mark  
Anode  
mark  
Date code (2 digit)  
Date code (2 digit)  
1
2
3
1
2
3Factory identification mark  
7.62±0.3  
Factory identification mark  
7.12±0.5  
7.12±0.5  
7.62±0.3  
Epoxy resin  
2.54±0.25  
Epoxy resin  
2.54±0.25  
+0.4  
+0.4  
1.0  
1.0  
−0  
−0  
+0  
10.0  
−0.5  
0.75±0.25  
10.16±0.5  
12.0MAX.  
0.75±0.25  
Product mass : approx. 0.33g  
Product mass : approx. 0.34g  
Sheet No.: D2-A07501EN  
2
PC3SD11NTZ Series  
(Unit : mm)  
■ Outline Dimensions  
5. Through-Hole VDE option [ex. PC3SD11YTZ]  
6. Wide Through-Hole Lead-Form VDE option  
[ex. PC3SD11YVZ]  
1.2±0.3  
1.2±0.3  
0.6±0.2  
0.6±0.2  
6
4
5
Model No.  
Model No.  
Rank mark  
SHARP  
mark  
"S"  
6
5
4
SHARP  
mark  
"S"  
Rank mark  
3 S D 1 1  
3 S D 1 1  
Anode  
mark  
Anode  
mark  
4
4
Date code (2 digit)  
Date code (2 digit)  
1
2
3
VDE  
identification mark  
Factory identification mark  
1
3
2
VDE  
identification mark  
Factory identification mark  
7.12±0.5  
7.62±0.3  
7.12±0.5  
7.62±0.3  
Epoxy resin  
0.5±0.1  
2.54±0.25  
θ
θ
Epoxy resin  
10.16±0.5  
0.26±0.1  
θ : 0 to 13˚  
2.54±0.25  
0.5±0.1  
Product mass : approx. 0.35g  
Product mass : approx. 0.35g  
7. SMT Gullwing Lead-Form VDE option  
8. Wide SMT Gullwing Lead-Form VDE option  
[ex. PC3SD11YXP]  
[ex. PC3SD11YWP]  
1.2±0.3  
0.6±0.2  
0.6±0.2  
1.2±0.3  
6
5
4
6
5
4
Model No.  
Rank mark  
Model No.  
Rank mark  
SHARP  
mark  
"S"  
SHARP  
mark  
"S"  
3 S D 1 1  
3 S D 1 1  
Anode  
mark  
Anode  
mark  
4
4
Date code (2 digit)  
Date code (2 digit)  
1
2
3
1
2
3
Factory identification mark  
VDE  
identification mark  
Factory identification mark  
7.62±0.3  
VDE  
identification mark  
7.12±0.5  
7.12±0.5  
7.62±0.3  
Epoxy resin  
2.54±0.25  
Epoxy resin  
2.54±0.25  
+0.4  
+0.4  
1.0  
1.0  
−0  
−0  
+0  
10.0  
−0.5  
0.75±0.25  
10.16±0.5  
12.0MAX.  
0.75±0.25  
Product mass : approx. 0.33g  
Product mass : approx. 0.34g  
5
∗Pin is not allowed external connection  
Sheet No.: D2-A07501EN  
3
PC3SD11NTZ Series  
Date code (2 digit)  
1st digit  
2nd digit  
Year of production  
Month of production  
A.D.  
1990  
1991  
1992  
1993  
1994  
1995  
1996  
1997  
1998  
1999  
2000  
2001  
A.D  
2002  
2003  
2004  
2005  
2006  
2007  
2008  
2009  
2010  
2011  
2012  
Mark  
P
Month  
Mark  
1
Mark  
A
B
January  
February  
March  
R
2
S
3
C
T
April  
4
D
E
U
May  
5
F
V
June  
6
H
J
W
X
July  
7
August  
September  
October  
November  
December  
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle  
Factory identification mark  
Factory identification Mark  
Country of origin  
no mark  
Japan  
Indonesia  
Philippines  
China  
* This factory marking is for identification purpose only.  
Please contact the local SHARP sales representative to see the actural status of the  
production.  
Rank mark  
Refer to the Model Line-up table  
Sheet No.: D2-A07501EN  
4
PC3SD11NTZ Series  
■ Absolute Maximum Ratings  
(Ta=25˚C)  
Parameter  
Symbol  
IF  
VR  
Rating  
50  
6
Unit  
mA  
V
Forward current  
Input  
Reverse voltage  
IT(rms)  
Isurge  
0.1  
A
RMS ON-state current  
Peak one cycle surge current  
Repetitive peak OFF-state voltage  
Output  
1.2 *3  
A
VDRM  
Viso(rms)  
Topr  
600  
V
*1  
5.0  
kV  
˚C  
˚C  
˚C  
Isolation voltage  
−30 to +100  
−55 to +125  
270*4  
Operating temperature  
Storage temperature  
Soldering temperature  
Tstg  
Soldering area  
*2  
Tsol  
*1 40 to 60%RH, AC for 1minute, f=60Hz  
*2 For 10s  
*3 f=50Hz sine wave  
*4 Lead solder plating models: 260˚C  
■ Electro-optical Characteristics  
(Ta=25˚C)  
Parameter  
Symbol  
VF  
Conditions  
MIN. TYP. MAX. Unit  
−
−
1.2  
−
1.4  
10  
1
V
µA  
µA  
V
IF=20mA  
VR=3V  
Forward voltage  
Input  
IR  
Reverse current  
IDRM  
VT  
VD=VDRM  
IT=0.1A  
VD=6V  
−
−
Repentitive peak OFF-state current  
−
−
2.5  
3.5  
−
ON-state voltage  
Output  
IH  
0.1  
−
mA  
V/µs  
Holding current  
−
dV/dt  
VD=1/√2 ·VDRM  
Critical rate of rise of OFF-state voltage  
1 000 2 000  
−
−
−
−
−
−
10  
7
Rank A  
IFT  
VD=6V, RL=100Ω  
Minimum trigger current  
mA  
Rank B  
Rank C  
Transfer  
charac-  
teristics  
5
RISO  
ton  
DC500V,40 to 60%RH  
Isolation resistance  
Turn-on time  
5
×
1010 1011  
−
Ω
VD=6V, RL=100Ω, IF=20mA  
−
−
100  
µs  
Sheet No.: D2-A07501EN  
5
PC3SD11NTZ Series  
■ Model Line-up (1) (Lead-free components)  
Lead Form  
Through-Hole  
SMT Gullwing  
Sleeve  
Wide Through-Hole  
Approved  
IFT[mA]  
Shipping Package  
50pcs/sleeve  
(VD=6V,  
Rank mark  
RL=100Ω)  
DIN  
Approved  
Approved  
EN60747-5-2  
MAX.10  
MAX.7  
MAX.5  
PC3SD11NTZAF PC3SD11YTZAF PC3SD11NXZAF PC3SD11YXZAF PC3SD11NVZAF PC3SD11YVZAF  
PC3SD11NTZBF PC3SD11YTZBF PC3SD11NXZBF PC3SD11YXZBF PC3SD11NVZBF PC3SD11YVZBF  
PC3SD11NTZCF PC3SD11YTZCF PC3SD11NXZCF PC3SD11YXZCF PC3SD11NVZCF PC3SD11YVZCF  
A
B
C
Model No.  
Lead Form  
Wide SMT Gullwing  
Sleeve  
SMT Gullwing  
Wide SMT Gullwing  
Taping  
1 000pcs/reel  
IFT[mA]  
(VD=6V,  
RL=100Ω)  
Shipping Package  
50pcs/sleeve  
Rank mark  
DIN  
Approved  
Approved  
Approved  
EN60747-5-2  
MAX.10  
MAX.7  
MAX.5  
PC3SD11NWZAF PC3SD11YWZAF PC3SD11NXPAF PC3SD11YXPAF PC3SD11NWPAF PC3SD11YWPAF  
PC3SD11NWZBF PC3SD11YWZBF PC3SD11NXPBF PC3SD11YXPBF PC3SD11NWPBF PC3SD11YWPBF  
PC3SD11NWZCF PC3SD11YWZCF PC3SD11NXPCF PC3SD11YXPCF PC3SD11NWPCF PC3SD11YWPCF  
A
B
C
Model No.  
■ Model Line-up (2) (Lead solder plating components)  
Lead Form  
Through-Hole  
SMT Gullwing  
Sleeve  
Wide Through-Hole  
Approved  
IFT[mA]  
(VD=6V,  
RL=100Ω)  
Shipping Package  
50pcs/sleeve  
Rank mark  
DIN  
Approved  
Approved  
EN60747-5-2  
MAX.10  
MAX.7  
MAX.5  
PC3SD11NTZA PC3SD11YTZA PC3SD11NXZA PC3SD11YXZA PC3SD11NVZA PC3SD11YVZA  
PC3SD11NTZB PC3SD11YTZB PC3SD11NXZB PC3SD11YXZB PC3SD11NVZB PC3SD11YVZB  
PC3SD11NTZC PC3SD11YTZC PC3SD11NXZC PC3SD11YXZC PC3SD11NVZC PC3SD11YVZC  
A
B
C
Model No.  
Lead Form  
Wide SMT Gullwing  
Sleeve  
SMT Gullwing  
Wide SMT Gullwing  
Taping  
1 000pcs/reel  
IFT[mA]  
(VD=6V,  
RL=100Ω)  
Shipping Package  
50pcs/sleeve  
Rank mark  
DIN  
Approved  
Approved  
Approved  
EN60747-5-2  
MAX.10  
MAX.7  
MAX.5  
PC3SD11NWZA PC3SD11YWZA PC3SD11NXPA PC3SD11YXPA PC3SD11NWPA PC3SD11YWPA  
PC3SD11NWZB PC3SD11YWZB PC3SD11NXPB PC3SD11YXPB PC3SD11NWPB PC3SD11YWPB  
PC3SD11NWZC PC3SD11YWZC PC3SD11NXPC PC3SD11YXPC PC3SD11NWPC PC3SD11YWPC  
A
B
C
Model No.  
Please contact a local SHARP sales representative to inquire about production status.  
Sheet No.: D2-A07501EN  
6
PC3SD11NTZ Series  
Fig.2 RMS ON-state Current vs.  
Fig.1 Forward Current vs. Ambient  
Temperature  
Ambient Temperature  
175  
70  
150  
125  
100  
75  
60  
50  
40  
30  
20  
50  
25  
0
10  
0
−30  
0
50  
100  
−30  
0
50  
100  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Fig.3-a Forward Current vs. Forward Voltage  
(Rank A)  
Fig.3-b Forward Current vs. Forward Voltage  
(Rank B, Rank C)  
100  
100  
Ta=75˚C  
Ta=100°C  
50  
50  
50˚C  
75°C  
50°C  
25°C  
25˚C  
0˚C  
0°C  
10  
5
10  
−30°C  
5
−25˚C  
1
1
0
0.5  
1
1.5  
2
2.5  
3
0.9  
1
1.1  
1.2  
1.3  
1.4  
1.5  
Forward voltage VF (V)  
Forward voltage VF (V)  
Fig.4-a Minimum Trigger Current vs. Ambient  
Temperature (Rank A)  
Fig.4-b Minimum Trigger Current vs. Ambient  
Temperature (Rank B, Rank C)  
10  
10  
VD=6V  
RL=100Ω  
VD=6V  
RL=100Ω  
8
6
4
8
6
4
2
0
2
0
−40 −20  
0
20  
40  
60  
80  
100  
−40 −20  
0
20  
40  
60  
80  
100  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Sheet No.: D2-A07501EN  
7
PC3SD11NTZ Series  
Fig.6 ON-state Voltage vs.  
Fig.5 Relative Repetitive Peak OFF-state  
Voltage vs. Ambient Temperature  
Ambient Temperature  
1.3  
IT=100mA  
2.4  
2.2  
2
1.2  
1.1  
1
1.8  
1.6  
1.4  
0.9  
0.8  
0.7  
1.2  
1
−40 −20  
0
20  
40  
60  
80  
100  
−40 −20  
0
20  
40  
60  
80  
100  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Fig.7 Holding Current vs.  
Fig.8 Repetitive Peak OFF-state Current vs.  
Ambient Temperature  
Ambient Temperature  
10−6  
10  
VD=6V  
VD=600V  
10−7  
10−8  
1
10−9  
10−10  
0.1  
−40 −20  
0
20  
40  
60  
80  
100  
−40 −20  
0
20  
40  
60  
80  
100  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Fig.9-a Turn-on Time vs. Forward Current  
(Rank A)  
Fig.9-b Turn-on Time vs. Forward Current  
(Rank B, Rank C)  
1 000  
1 000  
VD=6V  
RL=100Ω  
Ta=25˚C  
VD=6V  
RL=100Ω  
Ta=25˚C  
100  
100  
10  
10  
1
10  
100  
1
10  
100  
Forward current IF (mA)  
Forward current IF (mA)  
Remarks : Please be aware that all data in the graph are just for reference.  
8
Sheet No.: D2-A07501EN  
PC3SD11NTZ Series  
■ Design Considerations  
● Design guide  
In order for the Phototriac to turn off, the triggering current (IF) must be 0.1mA or less.  
Please refrain from using these devices in a direct drive configuration.  
These Phototriac Coupler are intended to be used as triggering device for main Triacs.  
Please ensure that the output rating of these devices will be sufficient for triggering the main output Triac of  
your choice. Failure to do may result in malfunctions.  
In phase control applications or where the Phototriac Coupler is being by a pulse signal, please ensure that  
the pulse width is a minimum of 1ms.  
For designs that will experience excessive noise or sudden changes in load voltage, please include an  
appropriate snubber circuit as shown in the below circuit.  
Please keep in mind that Sharp Phototriac Couplers incorporate superor dV/dt ratings which can often  
eliminate the need for a snubber circuit.  
● Degradation  
In general, the emission of the IRED used in Phototriac Couplers will degrade over time.  
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to  
the devices, please allow for a worst case scenario of 50% degradation over 5years.  
Therefore in order to maintain proper operation, a design implementing these Phototriac Couplers should  
provide at least twice the minimum required triggering current from initial operation.  
● Recommended Foot Print (reference)  
SMT Gullwing Lead-form  
Wide SMT Gullwing Lead-form  
10.2  
8.2  
2.2  
2.2  
(Unit : mm)  
Sheet No.: D2-A07501EN  
9
PC3SD11NTZ Series  
● Standard Circuit (Medium/High Power Triac Drive Circuit)  
PC3SD11NTZ  
1
6
5
4
Load  
AC Line  
Triac  
2
3
Note) Please add the snubber circuit according to a condition.  
Any snubber or varistor used for the above mentioned scenarios should be located  
as close to the main output triac as possible.  
✩
For additional design assistance, please review our corresponding Optoelectronic Application Notes.  
Sheet No.: D2-A07501EN  
10  
PC3SD11NTZ Series  
■ Manufacturing Guidelines  
● Soldering Method  
Reflow Soldering:  
Reflow soldering should follow the temperature profile shown below.  
Soldering should not exceed the curve of temperature profile and time.  
Please don't solder more than twice.  
(˚C)  
300  
Terminal : 260˚C peak  
( package surface : 250˚C peak)  
200  
Reflow  
220˚C or more, 60s or less  
Preheat  
100  
150 to 180˚C, 120s or less  
0
0
1
2
3
4
(min)  
Flow Soldering :  
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below  
listed guidelines.  
Flow soldering should be completed below 270˚C and within 10s.  
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.  
Please don't solder more than twice.  
Hand soldering  
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.  
Please don't solder more than twice.  
Other notices  
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact  
on the junction between the device and PCB varies depending on the tooling and soldering conditions.  
Sheet No.: D2-A07501EN  
11  
PC3SD11NTZ Series  
● Cleaning instructions  
Solvent cleaning :  
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.  
Ultrasonic cleaning :  
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,  
size of PCB and mounting method of the device.  
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of  
mass production.  
Recommended solvent materials :  
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.  
In case the other type of solvent materials are intended to be used, please make sure they work fine in  
actual using conditions since some materials may erode the packaging resin.  
● Presence of ODC  
This product shall not contain the following materials.  
And they are not used in the production process for this device.  
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)  
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.  
Sheet No.: D2-A07501EN  
12  
PC3SD11NTZ Series  
■ Package specification  
● Sleeve package  
1. Through-Hole or SMT Gullwing  
Package materials  
Sleeve : HIPS (with anti-static material)  
Stopper : Styrene-Elastomer  
Package method  
MAX. 50pcs of products shall be packaged in a sleeve.  
Both ends shall be closed by tabbed and tabless stoppers.  
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.  
MAX. 20 sleeves in one case.  
Sleeve outline dimensions  
12.0  
6.7  
(Unit : mm)  
2. Wide Through-Hole or Wide SMT Gullwing  
Package materials  
Sleeve : HIPS (with anti-static material)  
Stopper : Styrene-Elastomer  
Package method  
MAX. 50pcs of products shall be packaged in a sleeve.  
Both ends shall be closed by tabbed and tabless stoppers.  
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.  
MAX. 20 sleeves in one case.  
Sleeve outline dimensions  
15.0  
6.35  
(Unit : mm)  
Sheet No.: D2-A07501EN  
13  
PC3SD11NTZ Series  
● Tape and Reel package  
1. SMT Gullwing  
Package materials  
Carrier tape : A-PET (with anti-static material)  
Cover tape : PET (three layer system)  
Reel : PS  
Carrier tape structure and Dimensions  
J
F
D
G
I
E
K
Dimensions List  
(Unit:mm)  
A
B
C
D
E
F
G
+0.1  
16.0±0.3  
7.5±0.1  
1.75±0.1  
12.0±0.1  
2.0±0.1  
4.0±0.1  
φ1.5  
−0  
H
I
J
K
10.4±0.1  
0.4±0.05  
4.2±0.1  
7.8±0.1  
Reel structure and Dimensions  
e
d
g
Dimensions List  
(Unit : mm)  
a
b
c
d
330  
e
23±1.0  
17.5±1.5  
100±1.0  
13±0.5  
f
f
g
b
2.0±0.5  
2.0±0.5  
a
Direction of product insertion  
Pull-out direction  
[Packing : 1 000pcs/reel]  
Sheet No.: D2-A07501EN  
14  
PC3SD11NTZ Series  
2. Wide SMT Gullwing  
Package materials  
Carrier tape : A-PET (with anti-static material)  
Cover tape : PET (three layer system)  
Reel : PS  
Carrier tape structure and Dimensions  
F
D
J
G
C
I
E
K
Dimensions List  
(Unit : mm)  
A
B
C
D
E
F
G
+0.1  
24.0±0.3  
11.5±0.1  
1.75±0.1  
12.0±0.1  
2.0±0.1  
4.0±0.1  
φ1.5  
−0  
H
I
J
K
12.2±0.1  
0.4±0.05  
4.15±0.1  
7.6±0.1  
Reel structure and Dimensions  
e
d
g
Dimensions List  
(Unit : mm)  
a
b
c
d
330  
e
23±1.0  
25.5±1.5  
100±1.0  
13±0.5  
f
g
f
b
2.0±0.5  
2.0±0.5  
a
Direction of product insertion  
Pull-out direction  
[Packing : 1 000pcs/reel]  
Sheet No.: D2-A07501EN  
15  
PC3SD11NTZ Series  
■ Important Notices  
· The circuit application examples in this publication are  
provided to explain representative applications of  
SHARP devices and are not intended to guarantee any  
circuit design or license any intellectual property rights.  
SHARP takes no responsibility for any problems rela-  
ted to any intellectual property right of a third party re-  
sulting from the use of SHARP's devices.  
with equipment that requires higher reliability such as:  
--- Transportation control and safety equipment (i.e.,  
aircraft, trains, automobiles, etc.)  
--- Traffic signals  
--- Gas leakage sensor breakers  
--- Alarm equipment  
--- Various safety devices, etc.  
(iii) SHARP devices shall not be used for or in connec-  
tion with equipment that requires an extremely high lev-  
el of reliability and safety such as:  
--- Space applications  
--- Telecommunication equipment [trunk lines]  
--- Nuclear power control equipment  
--- Medical and other life support equipment (e.g.,  
scuba).  
· Contact SHARP in order to obtain the latest device  
specification sheets before using any SHARP device.  
SHARP reserves the right to make changes in the spec-  
ifications, characteristics, data, materials, structure,  
and other contents described herein at any time without  
notice in order to improve design or reliability. Manufac-  
turing locations are also subject to change without no-  
tice.  
· If the SHARP devices listed in this publication fall with-  
in the scope of strategic products described in the For-  
eign Exchange and Foreign Trade Law of Japan, it is  
necessary to obtain approval to export such SHARP de-  
vices.  
· Observe the following points when using any devices  
in this publication. SHARP takes no responsibility for  
damage caused by improper use of the devices which  
does not meet the conditions and absolute maximum  
ratings to be used specified in the relevant specification  
sheet nor meet the following conditions:  
(i) The devices in this publication are designed for use  
in general electronic equipment designs such as:  
--- Personal computers  
· This publication is the proprietary product of SHARP  
and is copyrighted, with all rights reserved. Under the  
copyright laws, no part of this publication may be repro-  
duced or transmitted in any form or by any means, elec-  
tronic or mechanical, for any purpose, in whole or in  
part, without the express written permission of SHARP.  
Express written permission is also required before any  
use of this publication may be made by a third party.  
--- Office automation equipment  
--- Telecommunication equipment [terminal]  
--- Test and measurement equipment  
--- Industrial control  
--- Audio visual equipment  
--- Consumer electronics  
· Contact and consult with a SHARP representative if  
there are any questions about the contents of this pub-  
lication.  
(ii) Measures such as fail-safe function and redundant  
design should be taken to ensure reliability and safety  
when SHARP devices are used for or in connection  
Sheet No.: D2-A07501EN  
16  
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