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LZ2463A

型号：

LZ2463A

描述：

四分之一型彩色CCD传感器面积与470的k个像素[ 1/4-type Color CCD Area Sensor with 470 k Pixels ]

品牌：

SHARP[ SHARP ELECTRIONIC COMPONENTS ]

页数：

11 页

PDF大小：

90 K

下载PDF手册
LZ2463A  
1/4-type Color CCD Area Sensor  
with 470 k Pixels  
LZ2463A  
DESCRIPTION  
PIN CONNECTIONS  
The LZ2463A is a 1/4-type (4.5 mm) solid-state  
image sensor that consists of PN photo-diodes  
and CCDs (charge-coupled devices). With  
approximately 470 000 pixels (795 horizontal x 595  
vertical), the sensor provides a stable high-resolution  
color image.  
14-PIN HALF-PITCH WDIP  
TOP VIEW  
OD  
GND  
OFD  
PW  
1
2
3
4
5
6
7
14 OS  
13 GND  
12 NC  
11 ØV1  
10 ØV2  
FEATURES  
• Number of effective pixels : 752 (H) x 582 (V)  
• Number of optical black pixels  
– Horizontal : 3 front and 40 rear  
– Vertical : 11 front and 2 rear  
• Pixel pitch : 5.0 µm (H) x 4.7 µm (V)  
• Mg, G, Cy, and Ye complementary color filters  
• Low fixed-pattern noise and lag  
• No burn-in and no image distortion  
• Blooming suppression structure  
• Built-in output amplifier  
ØRS  
ØH1  
9
8
ØV3  
ØV4  
ØH2  
(WDIP014-P-0400A)  
PRECAUTIONS  
• Built-in overflow drain voltage circuit  
• Horizontal shift register clock voltage : 3.6 V (TYP.)  
• Variable electronic shutter (1/50 to 1/10 000 s)  
• Compatible with PAL standard  
• Package :  
• The exit pupil position of lens should be more  
than 25 mm from the top surface of the CCD.  
• Refer to "PRECAUTIONS FOR CCD AREA  
SENSORS" for details.  
14-pin half-pitch WDIP [Plastic]  
(WDIP014-P-0400A)  
Row space : 10.16 mm  
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in  
catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.  
1
LZ2463A  
PIN DESCRIPTION  
SYMBOL  
PIN NAME  
Output transistor drain  
OD  
OS  
Output signals  
ØRS  
Reset transistor clock  
Vertical shift register clock  
Horizontal shift register clock  
Overflow drain  
ØV1, ØV2, ØV3, ØV4  
ØH1, ØH2  
OFD  
PW  
P-well  
GND  
NC  
Ground  
No connection  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
Output transistor drain voltage  
Overflow drain voltage  
(TA = +25 ˚C)  
UNIT NOTE  
V
SYMBOL  
VOD  
VOFD  
VØRS  
VØV  
RATING  
0 to +18  
Internal output  
–0.3 to +12  
–11.5 to +17.5  
–0.3 to +12  
–29 to 0  
0 to +15  
–40 to +85  
–20 to +70  
V
V
1
Reset gate clock voltage  
Vertical shift register clock voltage  
Horizontal shift register clock voltage  
Voltage difference between P-well and vertical clock  
Voltage difference between vertical clocks  
Storage temperature  
V
V
V
VØH  
VPW-VØV  
VØV-VØV  
TSTG  
V
2
˚C  
˚C  
Ambient operating temperature  
TOPR  
NOTES :  
1. Do not connect to DC voltage directly. When OFD is connected to GND, connect VOD to GND. Overflow drain clock is  
applied below 27 Vp-p.  
2. When clock width is below 10 µs, and clock duty factor is below 0.1%, voltage difference between vertical clocks will be  
below 28 V.  
2
LZ2463A  
RECOMMENDED OPERATING CONDITIONS  
PARAMETER  
Ambient operating temperature  
Output transistor drain voltage  
Overflow drain clock p-p level  
Ground  
SYMBOL  
MIN.  
TYP. MAX. UNIT NOTE  
TOPR  
VOD  
VØOFD  
25.0  
14.55 15.0 15.45  
22.5  
˚C  
V
24.5  
V
V
V
1
2
GND  
0.0  
P-well voltage  
VPW  
–10.0  
–9.5  
VØVL  
–8.5  
VØV1L, VØV2L  
VØV3L, VØV4L  
VØV1I, VØV2I  
VØV3I, VØV4I  
VØV1H, VØV3H  
VØH1L, VØH2L  
VØH1H, VØH2H  
VØRSL  
LOW level  
–9.0  
0.0  
V
V
Vertical shift  
register clock  
INTERMEDIATE level  
HIGH level  
LOW level  
HIGH level  
LOW level  
HIGH level  
14.55 15.0 15.45  
–0.05  
3.3  
0.0  
VOD – 9.7  
V
V
V
V
V
Horizontal shift  
register clock  
0.0  
3.6  
0.05  
5.5  
OD – 14.2  
10.0  
V
Reset gate clock  
VØRSH  
fØV1, fØV2  
fØV3, fØV4  
fØH1, fØH2  
fØRS  
Vertical shift register clock frequency  
15.63  
kHz  
Horizontal shift register clock frequency  
Reset gate clock frequency  
14.18  
14.18  
MHz  
MHz  
NOTES :  
• Connect NC to GND directly or through a capacitor larger than 0.047 µF.  
1. Use the circuit parameter indicated in "SYSTEM CONFIGURATION EXAMPLE", and do not connect to DC voltage directly.  
2. VPW is set below VØVL that is low level of vertical shift register clock, or is used with the same power supply that is connected  
to VL of V driver IC.  
* To apply power, first connect GND and then turn on VOD. After turning on VOD, turn on PW first and then turn on other powers  
and pulses. Do not connect the device to or disconnect it from the plug socket while power is being applied.  
3
LZ2463A  
CHARACTERISTICS (Drive method : Field accumulation)  
(TA = +25 ˚C, Operating conditions : The typical values specified in "RECOMMENDED OPERATING CONDITIONS".  
Color temperature of light source : 3 200 K, IR cut-off filter (CM-500, 1 mmt) is used.)  
PARAMETER  
Standard output voltage  
SYMBOL  
VO  
MIN.  
TYP. MAX. UNIT NOTE  
150  
mV  
%
2
3
Photo response non-uniformity  
Saturation output voltage  
Dark output voltage  
Dark signal non-uniformity  
Sensitivity  
PRNU  
VSAT  
VDARK  
DSNU  
R
15  
550  
700  
0.5  
0.5  
210  
–80  
mV  
mV  
mV  
mV  
dB  
%
4
3.0  
2.0  
1, 5  
1, 6  
7
8
9
150  
Smear ratio  
Image lag  
SMR  
AI  
–70  
1.0  
Blooming suppression ratio  
Output transistor drain current  
Output impedance  
Vector breakup  
Line crawling  
Luminance flicker  
ABL  
IOD  
RO  
1 000  
10  
4.0  
350  
8.0  
mA  
$
˚, %  
%
7.0  
3.0  
2.0  
11  
12  
13  
%
NOTES :  
• Within the recommended operating conditions of VOD,  
VOFD of the internal output satisfies with ABL larger than  
1 000 times exposure of the standard exposure conditions,  
and VSAT larger than 550 mV.  
8. The sensor is exposed only in the central area of V/10  
square with a lens at F4, where V is the vertical image  
size. SMR is defined by the ratio of the output voltage  
detected during the vertical blanking period to the  
maximum output voltage in the V/10 square.  
1. TA = +60 ˚C  
2. The average output voltage under uniform illumination.  
The standard exposure conditions are defined as when  
Vo is 150 mV.  
9. The sensor is exposed at the exposure level  
corresponding to the standard conditions. AI is defined  
by the ratio of the output voltage measured at the 1st  
field during the non-exposure period to the standard  
output voltage.  
10. The sensor is exposed only in the central area of V/10  
square, where V is the vertical image size. ABL is  
defined by the ratio of the exposure at the standard  
conditions to the exposure at a point where blooming is  
observed.  
11. Observed with a vector scope when the color bar chart  
is imaged under the standard exposure conditions.  
12. The difference between the average output voltage of the  
(Mg + Ye), (G + Cy) line and that of the (Mg + Cy), (G +  
Ye) line under the standard exposure conditions.  
13. The difference between the average output voltage of  
the odd field and that of the even field under the  
standard exposure conditions.  
3. The image area is divided into 10 x 10 segments under  
the standard exposure conditions. Each segment's  
voltage is the average output voltage of all pixels within  
the segment. PRNU is defined by (Vmax – Vmin)/Vo,  
where Vmax and Vmin are the maximum and minimum  
values of each segment's voltage respectively.  
4. The image area is divided into 10 x 10 segments. Each  
segment's voltage is the average output voltage of all  
pixels within the segment. VSAT is the minimum  
segment's voltage under 10 times exposure of the  
standard exposure conditions.  
5. The average output voltage under non-exposure  
conditions.  
6. The image area is divided into 10 x 10 segments under  
non-exposure conditions. DSNU is defined by (Vdmax –  
Vdmin), where Vdmax and Vdmin are the maximum and  
minimum values of each segment's voltage respectively.  
7. The average output voltage when a 1 000 lux light  
source with a 90% reflector is imaged by a lens of F4,  
f50 mm.  
4
LZ2463A  
PIXEL STRUCTURE  
OPTICAL BLACK  
(2 PIXELS)  
OPTICAL BLACK  
(3 PIXELS)  
OPTICAL BLACK  
(40 PIXELS)  
752 (H) x 582 (V)  
1 pin  
OPTICAL BLACK  
(11 PIXELS)  
COLOR FILTER ARRAY  
(1, 582)  
(752, 582)  
Cy Ye Cy Ye Cy  
Ye Cy Ye Cy Ye  
Mg  
G
Mg  
G
Mg  
G
Mg  
G
Mg  
G
Cy Ye Cy Ye Cy  
Ye Cy Ye Cy Ye  
G
Mg  
G
Mg  
G
Mg  
G
Mg  
G
Mg  
Cy Ye Cy Ye Cy  
Ye Cy Ye Cy Ye  
Mg  
G
Mg  
G
Mg  
G
Mg  
G
Mg  
G
Cy Ye Cy Ye Cy  
Ye Cy Ye Cy Ye  
Mg  
G
Mg  
G
Mg  
G
Mg  
G
Mg  
G
Cy Ye Cy Ye Cy  
Ye Cy Ye Cy Ye  
G
Mg  
Cy Ye Cy Ye Cy  
Mg Mg Mg  
G
Mg  
G
Mg  
Ye Cy Ye Cy Ye  
Mg Mg  
G
Mg  
G
Mg  
1st, 3rd  
field  
2nd, 4th  
field  
G
G
G
G
G
(1, 1)  
(752, 1)  
5
LZ2463A  
TIMING CHART  
VERTICAL TRANSFER TIMING  
Shutter speed  
1/2 000 s  
(1st, 3rd FIELD)  
623  
625  
1
6
13  
HD  
VD  
ØV1  
ØV2  
ØV3  
ØV4  
ØOFD  
579 581 OB1  
580 582 OB2  
OB1 OB3 OB5 OB7 OB9OB11  
OB2 OB4 OB6 OB8OB10  
2
3
4
5
6
7
+
+
+
+
+
+
+
+
+
1
+
+
+
OS  
(2nd, 4th FIELD)  
311  
318  
325  
HD  
VD  
ØV1  
ØV2  
ØV3  
ØV4  
ØOFD  
578 580 582 OB2  
579 581 OB1  
OB2 OB4 OB6 OB8OB10  
OB1 OB3 OB5 OB7 OB9OB11  
1
2
3
4
5
6
+
+
+
+
+
+
+
+
+
+
+
OS  
HORIZONTAL TRANSFER TIMING  
908, 1  
91  
HD  
ØH1  
ØH2  
ØRS  
OS  
PRE SCAN (22)  
OB (3)  
OUTPUT (752) 1ππ  
..  
752  
OB (40)  
74  
42  
ØV1  
ØV2  
ØV3  
58  
90  
34  
82  
50  
98  
ØV4  
66  
86  
ØOFD  
6
LZ2463A  
READOUT TIMING  
(1st, 3rd FIELD)  
1
91  
908, 1  
91  
HD  
336  
404  
42 74  
42 74  
ØV1  
ØV2  
ØV3  
58 90  
82  
208  
644  
58 90  
82  
404  
472  
34  
240  
50  
98  
50  
98  
ØV4  
(2nd, 4th FIELD)  
1
91  
908, 1  
91  
HD  
336  
404  
404  
42 74  
ØV1  
58 90  
82  
208  
90  
ØV2  
ØV3  
472  
34  
240  
82  
98  
644  
50  
98  
ØV4  
7
LZ2463A  
SYSTEM CONFIGURATION EXAMPLE  
+
OD  
OS  
GND  
NC  
ØV1  
ØV2  
ØV3  
ØV4  
GND  
OFD  
PW  
ØRS  
ØH1  
ØH2  
POFD  
VMb  
VL  
VOFDH  
VH3BX  
OFDX  
V2X  
+
V2  
V4  
V1X  
NC  
V3B  
V3A  
V1B  
V1A  
VMa  
VH  
VH1AX  
V3X  
VDD  
+
GND  
VH3AX  
V4X  
VH1BX  
+
8
PACKAGES FOR CCD AND CMOS DEVICES  
PACKAGE  
(Unit : mm)  
14 WDIP (WDIP014-P-0400A)  
0.03  
±0.10  
10.00  
Center of effective imaging area  
±0.10  
9.00  
(◊)  
Glass Lid  
and center of package  
14  
8
(◊ : Lid's size)  
CCD  
Package  
0.03  
¬
CCD  
Cross section A-A'  
1
0.50  
7
MAX.  
Rotation error of die : ¬= 1.0˚  
±0.50  
±0.075  
5.00  
A
A'  
±0.10  
0.25  
TYP.  
TYP.  
0.30  
0.46  
+0.5  
–0  
TYP.  
10.16  
P-1.27  
0.25  
M
9
PRECAUTIONS FOR CCD AREA SENSORS  
PRECAUTIONS FOR CCD AREA SENSORS  
(In the case of plastic packages)  
1. Package Breakage  
– The leads of the package are fixed with  
package body (plastic), so stress added to a  
lead could cause a crack in the package  
body (plastic) in the jointed part of the lead.  
In order to prevent the package from being broken,  
observe the following instructions :  
1) The CCD is a precise optical component and  
the package material is ceramic or plastic.  
Therefore,  
Glass cap  
Package  
ø Take care not to drop the device when  
mounting, handling, or transporting.  
Lead  
Fixed  
ø Avoid giving a shock to the package.  
Especially when leads are fixed to the socket  
or the circuit board, small shock could break  
the package more easily than when the  
package isn’t fixed.  
Stand-off  
2) When applying force for mounting the device or  
any other purposes, fix the leads between a  
joint and a stand-off, so that no stress will be  
given to the jointed part of the lead. In addition,  
when applying force, do it at a point below the  
stand-off part.  
3) When mounting the package on the housing,  
be sure that the package is not bent.  
– If a bent package is forced into place  
between a hard plate or the like, the pack-  
age may be broken.  
4) If any damage or breakage occurs on the sur-  
face of the glass cap, its characteristics could  
deteriorate.  
(In the case of ceramic packages)  
– The leads of the package are fixed with low  
melting point glass, so stress added to a  
lead could cause a crack in the low melting  
point glass in the jointed part of the lead.  
Therefore,  
ø Do not hit the glass cap.  
ø Do not give a shock large enough to cause  
distortion.  
ø Do not scrub or scratch the glass surface.  
– Even a soft cloth or applicator, if dry, could  
cause dust to scratch the glass.  
Low melting point glass  
Lead  
2. Electrostatic Damage  
As compared with general MOS-LSI, CCD has  
lower ESD. Therefore, take the following anti-static  
measures when handling the CCD :  
Fixed  
1) Always discharge static electricity by grounding  
the human body and the instrument to be used.  
To ground the human body, provide resistance  
of about 1 M$ between the human body and  
the ground to be on the safe side.  
Stand-off  
2) When directly handling the device with the  
fingers, hold the part without leads and do not  
touch any lead.  
10  
PRECAUTIONS FOR CCD AREA SENSORS  
3) To avoid generating static electricity,  
a. do not scrub the glass surface with cloth or  
plastic.  
ø The contamination on the glass surface  
should be wiped off with a clean applicator  
soaked in Isopropyl alcohol. Wipe slowly and  
gently in one direction only.  
b. do not attach any tape or labels.  
c. do not clean the glass surface with dust-  
cleaning tape.  
– Frequently replace the applicator and do not  
use the same applicator to clean more than  
one device.  
4) When storing or transporting the device, put it in  
a container of conductive material.  
◊ Note : In most cases, dust and contamination  
are unavoidable, even before the device  
is first used. It is, therefore, recommended  
that the above procedures should be  
taken to wipe out dust and contamination  
before using the device.  
3. Dust and Contamination  
Dust or contamination on the glass surface could  
deteriorate the output characteristics or cause a  
scar. In order to minimize dust or contamination on  
the glass surface, take the following precautions :  
1) Handle the CCD in a clean environment such  
as a cleaned booth. (The cleanliness level  
should be, if possible, class 1 000 at least.)  
2) Do not touch the glass surface with the fingers.  
If dust or contamination gets on the glass  
surface, the following cleaning method is  
recommended :  
4. Other  
1) Soldering should be manually performed within  
5 seconds at 350 °C maximum at soldering iron.  
2) Avoid using or storing the CCD at high tem-  
perature or high humidity as it is a precise  
optical component. Do not give a mechanical  
shock to the CCD.  
ø Dust from static electricity should be blown  
off with an ionized air blower. For anti-  
electrostatic measures, however, ground all  
the leads on the device before blowing off  
the dust.  
3) Do not expose the device to strong light. For  
the color device, long exposure to strong light  
will fade the color of the color filters.  
11  
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