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MZ12GW

型号：

MZ12GW

描述：

10千帕未补偿硅压力传感器[ 10 kPa Uncompensated Silicon Pressure Sensors ]

品牌：

FREESCALE[ Freescale ]

页数：

14 页

PDF大小：

236 K

下载PDF手册
MPVZ12  
Rev 0, 09/2006  
Freescale Semiconductor  
Technical Data  
10 kPa Uncompensated  
Silicon Pressure Sensors  
The MPVZ12 series is a silicon piezoresistive pressure sensor providing a  
very accurate and linear voltage output — directly proportional to the applied  
pressure. This standard, low cost, uncompensated sensor permits  
manufacturers to design and add their own external temperature compensating  
and signal conditioning networks. Compensation techniques are simplified  
because of the predictability of Freescale's single element strain gauge design.  
MPVZ12 SERIES  
UNCOMPENSATED PRESSURE  
SENSOR  
0 TO 10 kPA (0–1.45 psi)  
55 mV FULL SCALE SPAN  
(TYPICAL)  
SMALL OUTLINE PACKAGE  
Features  
•
•
•
•
•
•
•
Low Cost  
Patented Silicon Shear Stress Strain Gauge Design  
Ratiometric to Supply Voltage  
Easy to Use Chip Carrier Package Options  
Differential and Gauge Options  
Durable Epoxy Package  
MPVZ12GC6U  
CASE 482A-01  
Increased media compatibility fluorocarbon gel  
Application Examples  
•
•
•
•
•
•
•
•
Air Movement Control  
Environmental Control Systems  
Level Indicators  
Leak Detection  
Medical Instrumentation  
Industrial Controls  
MPVZ12GC7U  
CASE 482C-03  
Pneumatic Control Systems  
Robotics  
ORDERING INFORMATION(1)  
MPVZ12GW6U  
CASE 1735-01  
Device Type  
Ported  
Options  
Gauge  
Case No.  
482A  
Order Number  
MPVZ12GC6U  
MPVZ12GC7U  
MPVZ12GW6U  
MPVZ12GW7U  
Device Marking  
MPVZ12G  
MPVZ12G  
482C  
MZ12GW  
1735  
MZ12GW  
1560  
1. MPVZ12 series pressure sensors are available in differential and gauge configurations.  
Devices are available in the basic element package or with pressure port fittings which  
provide printed circuit board mounting ease and barbed hose pressure connections.  
MPVZ12GW7U  
CASE 1560-02  
PIN NUMBERS  
1
2
3
4
GND  
+Vout  
Vs  
5
6
7
8
N/C  
N/C  
N/C  
N/C  
–Vout  
NOTE: Pin 1 is noted by the notch in the lead.  
© Freescale Semiconductor, Inc., 2006. All rights reserved.  
+VS  
3
2
4
+VOUT  
Sensing  
Element  
–VOUT  
1
GND  
Figure 1. Uncompensated Pressure Sensor Schematic  
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE  
The output voltage of the differential or gauge sensor  
increases with increasing pressure applied to the pressure  
side (P1) relative to the vacuum side (P2). Similarly, output  
voltage increases as increasing vacuum is applied to the  
vacuum side (P2) relative to the pressure side (P1).  
Table 1. Maximum Ratings(1)  
Rating  
Symbol  
PMAX  
PBURST  
TSTG  
Value  
75  
Unit  
kPa  
kPa  
°C  
Maximum Pressure (P1 > P2)  
Burst Pressure (P1 > P2)  
Storage Temperature  
100  
–40 to +125  
–40 to +125  
Operating Temperature  
TA  
°C  
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.  
MPVZ12  
Sensors  
Freescale Semiconductor  
2
Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)  
Characteristic  
Differential Pressure Range(1)  
Symbol  
POP  
VS  
Min  
0
Typ  
—
Max  
10  
Unit  
kPa  
Supply Voltage(2)  
—
3.0  
6.0  
55  
6.0  
—
Vdc  
Supply Current  
Io  
—
mAdc  
mV  
Full Scale Span(3)  
VFSS  
Voff  
45  
70  
Offset(4)  
0
20  
35  
mV  
Sensitivity  
∆V/∆P  
—
—
5.5  
—
—
mV/kPa  
%VFSS  
%VFSS  
%VFSS  
%VFSS/°C  
µV/°C  
%Zin/°C  
W
Linearity(5)  
–0.5  
—
0.5  
—
Pressure Hysteresis6 (0 to 10 kPa)  
Temperature Hysteresis(5) (–40°C to +125°C)  
Temperature Coefficient of Full Scale Span(5)  
Temperature Coefficient of Offset(5)  
Temperature Coefficient of Resistance(5)  
Input Impedance  
—
±0.1  
±0.5  
—
—
—
—
TCVFSS  
TCVoff  
TCR  
Zin  
–0.22  
—
–0.16  
—
±15  
—
0.28  
400  
750  
—
0.34  
550  
1250  
—
—
Output Impedance  
Zout  
tR  
—
W
Response Time(6) (10% to 90%)  
Warm-Up Time(7)  
1.0  
20  
ms  
—
—
—
ms  
Offset Stability(8)  
—
—
±0.5  
—
%VFSS  
1. 1.0 kPa (kiloPascal) equals 0.145 psi.  
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional  
error due to device self-heating.  
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the  
minimum related pressure.  
4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure.  
5. Accuracy (error budget) consists of the following:  
• Linearity:  
Output deviation from a straight line relationship with pressure, using end point method, over the specified  
pressure range.  
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to  
and from the minimum or maximum operating temperature points, with zero differential pressure applied.  
• Pressure Hysteresis:  
Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum  
or maximum rated pressure at 25°C.  
• TcSpan:  
• TcOffset:  
• TCR:  
Output deviation at full rated pressure over the temperature range of 0 to 85°C, relative to 25°C.  
Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85°C, relative to 25°C.  
Z
deviation with minimum rated pressure applied, over the temperature range of -40°C to ±125°C, relative to  
IN  
25°C.  
6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to  
a specified step change in pressure.  
7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized.  
8. Offset stability is the product’s output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.  
MPVZ12  
Sensors  
Freescale Semiconductor  
3
TEMPERATURE COMPENSATION  
LINEARITY  
Figure 2 shows the typical output characteristics of the  
MPVZ12 series over temperature.  
Linearity refers to how well a transducer's output follows  
the equation: Vout = Voff + sensitivity x P over the operating  
pressure range (Figure 3). There are two basic methods for  
calculating nonlinearity: (1) end point straight line fit or (2) a  
least squares best line fit. While a least squares fit gives the  
“best case” linearity error (lower numerical value), the  
calculations required are burdensome.  
Conversely, an end point fit will give the “worst case” error  
(often more desirable in error budget calculations) and the  
calculations are more straightforward for the user.  
Freescale’s specified pressure sensor linearities are based  
on the end point straight line method measured at the  
midrange pressure.  
Because this strain gauge is an integral part of the silicon  
diaphragm, there are no temperature effects due to  
differences in the thermal expansion of the strain gauge and  
the diaphragm, as are often encountered in bonded strain  
gauge pressure sensors. However, the properties of the  
strain gauge itself are temperature dependent, requiring that  
the device be temperature compensated if it is to be used  
over an extensive temperature range.  
Temperature compensation and offset calibration can be  
achieved rather simply with additional resistive components,  
or by designing your system using the MPX2010D series  
sensor.  
Several approaches to external temperature  
compensation over both –40 to +125°C and 0 to +80°C  
ranges are presented in Applications Note AN840.  
80  
+25°C  
VS = 3 VDC  
70  
P1 > P2  
-40°C  
60  
50  
Span  
Range  
(Typ)  
40  
30  
20  
10  
+125°C  
Offset  
(Typ)  
0
PSI  
kPa  
0
0.3  
2.0  
0.6  
4.0  
0.9  
6.0  
1.2  
8.0  
1.5  
10  
Pressure Differential  
Figure 2. Output versus Pressure Differential  
70  
Linearity  
60  
50  
Actual  
40  
Span  
(VFSS)  
30  
20  
10  
0
Theoretical  
Offset  
(Voff)  
0
Max  
POP  
Pressure (kPA)  
Figure 3. Linearity Specification Comparison  
MPVZ12  
Sensors  
4
Freescale Semiconductor  
Stainless  
Steel Cap  
Die  
Gel Die Coat  
P1  
Thermoplastic  
Wire Bond  
Case  
Lead Frame  
P2  
Die Bond  
Differential Sensing  
Element  
Figure 4. Cross-Sectional Diagram (not to scale)  
Figure 4 illustrates the differential or gauge configuration  
Operating characteristics, internal reliability and  
qualification tests are based on use of dry clean air as the  
pressure media. Media other than dry clean air may have  
adverse effects on sensor performance and long term  
reliability. Contact the factory for information regarding media  
compatibility in your application.  
in the basic chip carrier (applicable to cases 482, 1560 and  
1735). A gel isolates the die surface and wire bonds from the  
environment, while allowing the pressure signal to be  
transmitted to the silicon diaphragm.  
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE  
Freescale designates the two sides of the pressure sensor  
as the Pressure (P1) side and the Vacuum (P2) side. The  
Pressure (P1) side is the side containing gel which isolates  
the die from the environment. The Freescale MPVZ12 series  
is designed to operate with positive differential pressure  
applied, P1 > P2.  
Pressure (P1) Side  
Part Number  
Case Type  
Identifier  
MPVZ12GC6U  
Top with Port Attached  
482A  
98ASB17757C  
The Pressure (P1) side may be identified by using the  
following table  
MPVZ12GC7U  
MPVZ12GW6U  
MPVZ12GW7U  
482C  
98ASB17759C  
Top with Port Attached  
Top with Port Attached  
Top with Port Attached  
1735  
98ASA10686D  
1560  
98ASA10611D  
MPVZ12  
Sensors  
Freescale Semiconductor  
5
PACKAGE DIMENSIONS  
–A–  
D 8 PL  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.  
4
M
S
S
0.25 (0.010)  
T
B
A
5
8
N
–B–  
G
INCHES  
MILLIMETERS  
1
DIM  
A
B
C
D
MIN  
MAX  
0.425  
0.425  
0.520  
0.042  
MIN  
10.54  
10.54  
12.70  
0.96  
MAX  
10.79  
10.79  
13.21  
1.07  
0.415  
0.415  
0.500  
0.038  
S
W
G
H
J
K
M
N
S
V
W
0.100 BSC  
2.54 BSC  
0.002  
0.009  
0.061  
0
0.010  
0.011  
0.071  
7
0.05  
0.23  
1.55  
0
0.25  
0.28  
1.80  
7
V
0.444  
0.709  
0.245  
0.115  
0.448  
0.725  
0.255  
0.125  
11.28  
18.01  
6.22  
2.92  
11.38  
18.41  
6.48  
3.17  
C
H
J
–T–  
SEATING  
PLANE  
PIN 1 IDENTIFIER  
M
K
CASE 482A-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
–A–  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4
5
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).  
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.  
6. DIMENSION S TO CENTER OF LEAD WHEN  
FORMED PARALLEL.  
N
–B–  
D 8 PL  
G
M
S
S
INCHES  
MILLIMETERS  
8
0.25 (0.010)  
T
B
A
1
DIM  
A
B
C
D
MIN  
MAX  
0.425  
0.425  
0.520  
0.034  
MIN  
10.54  
10.54  
12.70  
0.66  
MAX  
10.79  
10.79  
13.21  
0.864  
0.415  
0.415  
0.500  
0.026  
DETAIL X  
S
W
G
J
K
M
N
S
0.100 BSC  
2.54 BSC  
0.009  
0.100  
0
0.011  
0.120  
15  
0.23  
2.54  
0
0.28  
3.05  
15  
PIN 1  
IDENTIFIER  
V
0.444  
0.540  
0.245  
0.115  
0.448  
0.560  
0.255  
0.125  
11.28  
13.72  
6.22  
2.92  
11.38  
14.22  
6.48  
3.17  
C
V
W
SEATING  
PLANE  
–T–  
K
M
J
DETAIL X  
CASE 482C-03  
ISSUE B  
SMALL OUTLINE PACKAGE  
MPVZ12  
Sensors  
Freescale Semiconductor  
6
PACKAGE DIMENSIONS  
CASE 1735-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPVZ12  
Sensors  
Freescale Semiconductor  
7
PACKAGE DIMENSIONS  
CASE 1735-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPVZ12  
Sensors  
8
Freescale Semiconductor  
PACKAGE DIMENSIONS  
CASE 1735-01  
ISSUE A  
SMALL OUTLINE PACKAGE  
MPVZ12  
Sensors  
Freescale Semiconductor  
9
PACKAGE DIMENSIONS  
CASE 1560-02  
ISSUE C  
SMALL OUTLINE PACKAGE  
MPVZ12  
Sensors  
10  
Freescale Semiconductor  
PACKAGE DIMENSIONS  
CASE 1560-02  
ISSUE C  
SMALL OUTLINE PACKAGE  
MPVZ12  
Sensors  
Freescale Semiconductor  
11  
PACKAGE DIMENSIONS  
CASE 1560-02  
ISSUE C  
SMALL OUTLINE PACKAGE  
MPVZ12  
Sensors  
12  
Freescale Semiconductor  
NOTES  
MPVZ12  
Sensors  
Freescale Semiconductor  
13  
How to Reach Us:  
Home Page:  
www.freescale.com  
E-mail:  
support@freescale.com  
USA/Europe or Locations Not Listed:  
Freescale Semiconductor  
Technical Information Center, CH370  
1300 N. Alma School Road  
Chandler, Arizona 85224  
+1-800-521-6274 or +1-480-768-2130  
support@freescale.com  
Europe, Middle East, and Africa:  
Freescale Halbleiter Deutschland GmbH  
Technical Information Center  
Schatzbogen 7  
81829 Muenchen, Germany  
+44 1296 380 456 (English)  
+46 8 52200080 (English)  
+49 89 92103 559 (German)  
+33 1 69 35 48 48 (French)  
support@freescale.com  
Information in this document is provided solely to enable system and software  
implementers to use Freescale Semiconductor products. There are no express or  
implied copyright licenses granted hereunder to design or fabricate any integrated  
circuits or integrated circuits based on the information in this document.  
Freescale Semiconductor reserves the right to make changes without further notice to  
any products herein. Freescale Semiconductor makes no warranty, representation or  
guarantee regarding the suitability of its products for any particular purpose, nor does  
Freescale Semiconductor assume any liability arising out of the application or use of any  
product or circuit, and specifically disclaims any and all liability, including without  
limitation consequential or incidental damages. “Typical” parameters that may be  
provided in Freescale Semiconductor data sheets and/or specifications can and do vary  
in different applications and actual performance may vary over time. All operating  
parameters, including “Typicals”, must be validated for each customer application by  
customer’s technical experts. Freescale Semiconductor does not convey any license  
under its patent rights nor the rights of others. Freescale Semiconductor products are  
not designed, intended, or authorized for use as components in systems intended for  
surgical implant into the body, or other applications intended to support or sustain life,  
or for any other application in which the failure of the Freescale Semiconductor product  
could create a situation where personal injury or death may occur. Should Buyer  
purchase or use Freescale Semiconductor products for any such unintended or  
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and  
its officers, employees, subsidiaries, affiliates, and distributors harmless against all  
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,  
directly or indirectly, any claim of personal injury or death associated with such  
unintended or unauthorized use, even if such claim alleges that Freescale  
Japan:  
Freescale Semiconductor Japan Ltd.  
Headquarters  
ARCO Tower 15F  
1-8-1, Shimo-Meguro, Meguro-ku,  
Tokyo 153-0064  
Japan  
0120 191014 or +81 3 5437 9125  
support.japan@freescale.com  
Asia/Pacific:  
Freescale Semiconductor Hong Kong Ltd.  
Technical Information Center  
2 Dai King Street  
Tai Po Industrial Estate  
Tai Po, N.T., Hong Kong  
+800 2666 8080  
support.asia@freescale.com  
For Literature Requests Only:  
Freescale Semiconductor Literature Distribution Center  
P.O. Box 5405  
Semiconductor was negligent regarding the design or manufacture of the part.  
Denver, Colorado 80217  
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.  
All other product or service names are the property of their respective owners.  
1-800-441-2447 or 303-675-2140  
Fax: 303-675-2150  
© Freescale Semiconductor, Inc. 2006. All rights reserved.  
LDCForFreescaleSemiconductor@hibbertgroup.com  
MPVZ12  
Rev. 0  
09/2006  
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