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NE500199

型号:

NE500199

描述:

1 W C波段功率GaAs FET N沟道的GaAs MES FET[ 1 W C-BAND POWER GaAs FET N-CHANNEL GaAs MES FET ]

品牌:

NEC[ NEC ]

页数:

6 页

PDF大小:

43 K

PRELIMINARY DATA SHEET  
GaAs MES FET  
NE85001 SERIES  
1 W C-BAND POWER GaAs FET  
N-CHANNEL GaAs MES FET  
DESCRIPTION  
The NE8500199 Power GaAs FET covers 2 GHz to 10 GHz frequency range for commercial amplifier, oscillator  
applications and so on.  
NE8500100 is the two-cells recessed gate chip used in ‘99’ package.  
The device incorporates Ti-Al gate and silicon dioxide glassivation. To reduce the thermal resistance, the device  
has a PHS. (Plated Heat Sink)  
NEC’s strigent quality assurance and test procedures assure the highest reliability and performance.  
PHYSICAL DIMENSIONS  
146  
FEATURES  
170  
NE8500100 (CHIP) (unit: µm)  
Class A operation  
High power output  
High reliability  
65  
640  
SELECTION CHART  
100  
100  
PERFORMANCE SPECIFIED  
Pout (**)  
GL (**)  
USABLE  
PART NUMBER  
FORM  
chip  
100  
(dBm)  
(dB)  
FREQUENCY  
(GHz)  
780  
NE8500100(*)  
NE8500100-WB  
NE8500100-RG  
28.5 min  
9.0 typ  
9.0 typ  
2.0 to 10  
PACKAGE CODE-99 (unit: mm)  
NE8500199  
package  
28.5 min  
2.0 to 10  
1.0 ±0.1  
4.0 MIN BOTH LEADS  
SOURCE  
*
WB, RG indicate a type of containers for chips.  
WB: black carrier, RG: ring,: gel-pack,  
GATE  
φ
2.2 ±0.3  
2 PLACES  
** Specified at the condition at the last page.  
4.3 ±0.2  
4.0  
DRAIN  
0.6 ±0.1  
5.2 ±0.3  
11.0 ±0.3  
15.0 ±0.3  
0.1  
0.2 MAX.  
5.0 MAX.  
1.7 ±0.15  
6.0 ±0.2  
1.2  
Document No. P10968EJ1V0DS00 (1st edition)  
Date Published June 1996 P  
Printed in Japan  
1996  
©
NE85001 SERIES  
ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C)  
Drain to Source Voltage  
Gate to Drain Voltage  
Gate to Source Voltage  
Total Power Disipation(*)  
Drain Current  
VDSX  
VGDX  
VGSX  
PT  
15  
–18  
V
V
V
–12  
6.0  
W
ID  
1.12  
A
Gate Current  
IG  
6.0  
mA  
Channel Temperature  
Storage Temperature  
Tch  
175  
˚C  
Tstg  
–65 to 175  
˚C  
*TC = 25 ˚C  
RECOMMENDING OPERATION RANDGE  
CHARACTERISTIC  
Drain to Source Voltage  
Channel Temperature  
Input Power  
SYMBOL  
VDS  
MIN.  
TYP.  
MAX.  
10  
UNIT  
V
9
Tch  
130  
3
˚C  
Gcomp  
Rg  
dBcomp  
k  
Gate Resistance  
1
ELECTRICAL CHARACTERISTICS (TA = 25 ˚C)  
CHARACTERISTIC  
Saturated Drain Current  
Pinch-off Voltage  
SYMBOL  
Idss  
VP  
MIN.  
430  
–3.0  
TYP.  
MAX.  
860  
–1.0  
UNIT  
TEST CONDITIONS  
mA  
V
Vds = 2.5 V, Vgs = 0 V  
Vds = 2.5 V, Ids = 4 mA  
Vds = 2.5 V, Ids = Idss  
Transconductance  
gm  
300  
mS  
˚C/W  
Thermal Resistance  
Rth  
30  
PERFORMANCE SPECIFICATIONS (TA = 25 ˚C)  
NE8500100  
NE8500100-WG  
NE8500100-RG  
NE8500199  
PART NUMBER  
PACKAGE CODE  
UNIT  
TEST CONDITIONS  
CHIP  
99  
TYP.  
MIN.  
TYP.  
MAX.  
MIN.  
28.5  
MAX.  
CHARACTERISTIC  
SYMBOL  
f = 7.2 GHz  
28.5  
–2.0  
dBm  
mA  
dB  
Output Power  
PO  
Igs  
GL  
Vds = 10 V  
Ids = 200 mA set  
Rg = 1 kΩ  
Gate to source  
Current  
9
2.0  
–2.0  
9
2.0  
Pin = 21.0 dBm(*)  
Pin 11 dBm (**)  
Linear Gain  
*
Pin for Pout specification.  
** The same conditions as the above except this.  
2
NE85001 SERIES  
TYPICAL CHARACTERISTICS (TA = 25 ˚C)  
NE8500199  
OUTPUT POWER vs. INPUT POWER  
30  
25  
20  
15  
V
I
DS = 10 V  
ds = 200 mA set  
f = 7.2 GHz  
300  
250  
200  
ID (mA)  
10  
15  
20  
P
in - Input Power - dBm  
3
NE85001 SERIES  
S-PARAMETER  
VDS = 10 V, IDS = 200 mA, VGS = –1.260 V, IG = 0.0 mA, RG = 1 k  
FREQUENCY  
GHz  
S11  
S21  
S12  
S22  
MAG  
ANG  
MAG  
ANG  
MAG  
ANG  
MAG  
ANG  
0.100  
0.500  
1.000  
1.500  
2.000  
2.500  
3.000  
3.500  
3.600  
3.700  
3.800  
3.900  
4.000  
4.200  
4.400  
4.500  
4.600  
4.800  
5.000  
5.200  
5.400  
5.500  
5.600  
5.800  
6.000  
6.200  
6.400  
6.500  
6.600  
6.800  
7.000  
7.200  
7.400  
7.500  
7.600  
7.800  
8.000  
8.200  
8.400  
8.500  
8.600  
8.800  
9.000  
9.200  
9.400  
9.500  
9.600  
9.800  
10.000  
0.990  
0.916  
0.869  
0.851  
0.840  
0.831  
0.826  
0.824  
0.825  
0.825  
0.827  
0.829  
0.829  
0.821  
0.808  
0.803  
0.799  
0.790  
0.784  
0.777  
0.771  
0.767  
0.764  
0.758  
0.751  
0.742  
0.731  
0.726  
0.721  
0.707  
0.689  
0.676  
0.657  
0.649  
0.640  
0.621  
0.604  
0.590  
0.584  
0.577  
0.574  
0.570  
0.571  
0.583  
0.599  
0.611  
0.619  
0.631  
0.631  
–22.7  
–91.1  
–132.1  
–152.9  
–166.1  
–175.9  
176.0  
168.8  
167.5  
166.0  
164.4  
162.8  
161.0  
157.2  
153.9  
152.5  
151.0  
147.9  
144.7  
141.4  
137.7  
135.9  
133.9  
130.1  
125.8  
121.3  
116.6  
114.1  
111.6  
106.1  
100.2  
93.9  
87.1  
83.4  
79.9  
71.8  
63.2  
53.4  
42.7  
37.0  
31.2  
18.8  
5.9  
–7.6  
–21.4  
–28.5  
–35.9  
–50.4  
–62.9  
14.418  
10.211  
6.444  
4.610  
3.591  
2.975  
2.601  
2.341  
2.291  
2.253  
2.230  
2.187  
2.127  
2.053  
1.976  
1.963  
1.970  
1.944  
1.929  
1.923  
1.897  
1.916  
1.916  
1.887  
1.928  
1.896  
1.951  
1.951  
1.936  
1.973  
1.957  
2.004  
2.002  
2.013  
2.045  
2.042  
2.067  
165.5  
123.3  
94.8  
76.6  
61.9  
49.1  
37.3  
26.0  
23.4  
20.7  
18.1  
16.1  
13.4  
8.6  
5.6  
3.4  
0.8  
0.007  
0.024  
0.031  
0.034  
0.038  
0.042  
0.047  
0.053  
0.055  
0.056  
0.059  
0.063  
0.066  
0.072  
0.074  
0.075  
0.077  
0.080  
0.084  
0.089  
0.093  
0.097  
0.100  
0.105  
0.113  
0.116  
0.126  
0.130  
0.133  
0.143  
0.149  
0.163  
0.171  
0.177  
0.185  
0.195  
0.206  
0.216  
0.227  
0.232  
0.237  
0.246  
0.253  
0.264  
0.274  
0.277  
0.281  
0.284  
0.280  
70.1  
47.7  
33.6  
29.0  
28.1  
26.7  
25.4  
27.4  
27.0  
26.5  
26.8  
26.5  
25.4  
20.1  
16.8  
15.2  
13.9  
12.6  
9.3  
7.4  
4.5  
3.1  
1.8  
–1.9  
–4.8  
0.065  
0.175  
0.221  
0.241  
0.260  
0.278  
0.296  
0.313  
0.317  
0.323  
0.333  
0.340  
0.345  
0.353  
0.343  
0.337  
0.340  
0.341  
0.340  
0.349  
0.347  
0.358  
0.363  
0.358  
0.381  
0.369  
0.397  
0.396  
0.387  
0.411  
0.402  
0.424  
0.425  
0.431  
0.448  
0.452  
0.465  
0.478  
0.492  
0.500  
0.501  
0.519  
0.534  
0.545  
0.568  
0.577  
0.583  
0.600  
0.587  
–64.6  
–126.4  
–149.1  
–159.2  
–165.6  
–170.8  
–174.6  
–177.8  
–179.2  
179.8  
179.4  
178.7  
176.3  
171.0  
167.3  
166.2  
164.8  
163.2  
159.8  
158.6  
155.6  
154.2  
154.5  
151.6  
149.5  
146.8  
144.2  
144.2  
141.8  
138.6  
137.1  
133.8  
132.3  
129.4  
127.2  
123.8  
117.2  
112.7  
104.8  
102.7  
100.1  
93.0  
–3.1  
–8.6  
–12.8  
–18.5  
–20.7  
–22.7  
–28.5  
–33.5  
–39.1  
–44.8  
–47.2  
–50.6  
–56.8  
–62.4  
–69.1  
–74.9  
–78.8  
–82.4  
–88.6  
–96.6  
–8.0  
–11.6  
–13.2  
–15.9  
–20.4  
–23.9  
–28.9  
–33.3  
–36.8  
–39.6  
–45.0  
–51.8  
–57.8  
–65.4  
–68.0  
–71.2  
–78.3  
–84.7  
–92.3  
–99.3  
–103.2  
–107.4  
–115.9  
–123.6  
2.078 –103.5  
2.088 –112.0  
2.102 –115.5  
2.083 –119.1  
2.088 –127.8  
2.072 –135.7  
2.044 –144.6  
2.040 –153.1  
2.030 –157.9  
2.008 –162.9  
1.943 –173.2  
87.2  
80.1  
73.6  
69.7  
65.8  
56.3  
47.0  
1.812  
177.3  
4
NE85001 SERIES  
CHIP HANDLING  
DIE ATTACHMENT  
Die attach can be accomplished with a Au-Sn (300 ±10 ˚C) performs in a forming gas environment. Epoxy die  
attach is not recommended.  
BONDING  
Gate and drain bonding wires should be minimum length, semi-hard gold wire (3 - 8 % elongation) 30 microns or  
less in diameter.  
Bonding should be performed with a wedge tip that has a taper of approximately 15 %.  
Die attach and bonding time should be kept to a minimum. As a general rule, the bonding operation should be  
kept within a 280 ˚C _ 5 minute curve. If longer periods are required, the temperature should be lowered.  
PRECAUTIONS  
The user must operate in a clean, dry environment.  
The chip channel is glassivated for mechanical protection only and does not preclude the necessity of a clean  
environment.  
The bonding equipment should be periodically checked for sources of surge voltage and should be properly  
grounded at all times. In fact, all test and handling equipment should be grounded to minimize the possibilities of static  
discharge.  
5
NE85001 SERIES  
No part of this document may be copied or reproduced in any form or by any means without the prior written  
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this  
document.  
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual  
property rights of third parties by or arising from use of a device described herein or any other liability arising  
from use of such device. No license, either express, implied or otherwise, is granted under any patents,  
copyrights or other intellectual property rights of NEC Corporation or others.  
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,  
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or  
property arising from a defect in an NEC semiconductor device, customer must incorporate sufficient safety  
measures in its design, such as redundancy, fire-containment, and anti-failure features.  
NEC devices are classified into the following three quality grades:  
“Standard“, “Special, and “Specific“. The Specific quality grade applies only to devices developed based on  
a customer designated “quality assurance program“ for a specific application. The recommended applications  
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each  
device before using it in a particular application.  
Standard: Computers, office equipment, communications equipment, test and measurement equipment,  
audio and visual equipment, home electronic appliances, machine tools, personal electronic  
equipment and industrial robots  
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed  
for life support)  
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems or medical equipment for life support, etc.  
The quality grade of NEC devices in Standard“ unless otherwise specified in NEC's Data Sheets or Data Books.  
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,  
they should contact NEC Sales Representative in advance.  
Anti-radioactive design is not implemented in this product.  
M4 94.11  
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