IXGH 32N170
IXGT 32N170
Symbol
TestConditions
Characteristic Values
(TJ = 25°C, unless otherwise specified)
min. typ. max.
TO-247 AD Outline
gfs
IC = IC90; V = 10 V,
22
30
S
Pulse test, t C≤E 300 µs, duty cycle ≤ 2 %
∅ P
IC(ON)
VGE = 10V, VCE = 10V
120
A
Cies
Coes
Cres
3500
165
40
pF
pF
pF
VCE = 25 V, VGE = 0 V, f = 1 MHz
e
Qg
Qge
Qgc
155
30
51
nC
nC
nC
Dim.
Millimeter
Inches
IC = IC90, VGE = 15 V, VCE = 0.5 VCES
Min.
Max.
Min. Max.
A
4.7
2.2
2.2
1.0
1.65
2.87
5.3
2.54
2.6
1.4
2.13
3.12
.185 .209
.087 .102
.059 .098
.040 .055
.065 .084
.113 .123
.016 .031
.819 .845
.610 .640
A
A12
td(on)
tri
td(off)
tfi
45
38
270
250
11
ns
ns
500 ns
500 ns
20 mJ
b
Inductive load, TJ = 25°C
b
b12
IC = IC90, VGE = 15 V
VCE = 0.6 VCES, RG = Roff = 2.7 Ω
C
D
E
.4
.8
20.80 21.46
15.75 16.26
Eoff
e
5.20
5.72 0.205 0.225
19.81 20.32
4.50
L
.780 .800
.177
.140 .144
L1
td(on)
tri
Eon
td(off)
tfi
48
42
6.0
360
560
ns
ns
mJ
ns
ns
∅P 3.55
Q
R
S
3.65
Inductive load, TJ = 125°C
IC = IC90, VGE = 15 V
VCE = 0.6 VCES, RG = Roff = 2.7 Ω
5.89
4.32
6.15 BSC
6.40 0.232 0.252
5.49
.170 .216
242 BSC
TO-268 Outline
Eoff
14
mJ
RthJC
0.35 K/W
RthCK
(TO-247)
0.25
K/W
Dim.
Millimeter
Inches
Min.
Max.
Min. Max.
Min Recommended Footprint
A
4.9
2.7
.02
5.1
2.9
.25
.193 .201
.106 .114
.001 .010
A1
A2
b
1.15
1.9
.4
1.45
.045 .057
b2
2.1
.75
.83
C
.65
.016 .026
D
E
13.80 14.00
.543 .551
.624 .632
.524 .535
15.85 16.05
E1
13.3
13.6
e
H
L
5.45 BSC
.215 BSC
.736 .752
.094 .106
18.70 19.10
2.40
1.20
2.70
1.40
L1
.047 .055
L2
L3
L4
1.00
1.15
.039 .045
.010 BSC
0.25 BSC
3.80
4.10
.150 .161
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYSMOSFETs andIGBTsarecovered byoneormore
ofthefollowingU.S.patents:
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1
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