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QT411-ISSG

型号:

QT411-ISSG

描述:

QSLIDE触摸滑块IC[ QSLIDE TOUCH SLIDER IC ]

品牌:

QUANTUM[ QUANTUM RESEARCH GROUP ]

页数:

12 页

PDF大小:

255 K

lQ  
QT411-ISSG  
QSLIDE™ TOUCH  
SLIDER IC  
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QT401 QSlide™ enhancement - simplified calibration  
Linear finger-touch capacitive slider control  
Robust Charge-Transfer sensing method  
Extremely simple circuit - no external active components  
SPI slave-mode interface  
VDD  
SDO  
1
2
3
4
5
6
7
14  
13  
12  
11  
10  
9
GND  
DRDY  
DETECT  
SDI  
/SS  
QT411  
Self-calibration and drift compensation  
SCLK  
SNS3B  
SNS3A  
SNS2B  
Spread-spectrum operation for optimal EMC compliance  
2.5 - 5.5V single supply operation; very low power  
Enhanced power supply & thermal drift rejection  
14-pin TSSOP Pb-free package  
Compatible with clear ITO over LCD construction  
Inexpensive, simple 1-sided PCB construction possible  
SNS1A  
SNS1B  
SNS2A  
8
APPLICATIONS  
y Personal electronics  
y Appliance controls  
y Climate controls  
y Automotive controls  
The QT411 QSlide™ IC is a new type of linear capacitive touch ‘slider’ sensor IC based on Quantum’s patented  
charge-transfer (‘QT’) methods. This unique IC allows designers to create speed or volume controls, menu bars, and other  
more exotic forms of human interface on the panel of an appliance or personal electronic device. Generally it can be used to  
replace any form of linear control, through a completely sealed panel.  
The device uses a simple, inexpensive resistive sensing element between four connection points. The sense element can be a  
straight line or curved. The device can report a single rapid touch anywhere along the sense element, or, it can track a finger  
moving along the sensing surface in real time.  
This device uses three channels of synchronous sensing across a resistive element to determine touch position, using  
mathematical analysis. A positional accuracy of 5% (or better) is relatively easy to achieve. The acquisitions are performed in a  
burst mode which uses proprietary spread-spectrum modulation for superior noise immunity and ultra-low RF low emissions.  
The output of the QT411 can also be used to create discrete controls buttons in a line, by interpreting sets of number ranges  
as buttons. For example, the number range 0..19 can be button A, 30..49 button B, 60..79 button C etc. Continuous slider  
action and number-range based discrete control points can be mixed on a single element, or, the element can be reinterpreted  
differently at different times, for example when used adjacent to or on top of an LCD to act as a menu input device that  
dynamically changes function in context. The device is compatible with ITO (Indium Tin Oxide) overlays on top of various  
displays or simply to provide for a backlighting effect.  
The QT411 is significantly more stable with temperature and other environmental influences than the QT401 which it is  
designed to replace. In particular it can tolerate extreme temperature swings without false detection or shifts in reported touch  
position. Also it does not require special calibration of the endpoints of the slider area. However, unlike the QT401 the QT411  
does not have a proximity detection function.  
LQ  
Copyright © 2005 QRG Ltd  
QT411-ISSG R6.01/1005  
Figure 1-1 QT411 Wiring Diagram  
1 Operation  
The QT411 uses a SPI slave mode  
interface for control and data  
communications with a host  
Regulator  
VIN VOUT  
GND  
VIN  
1
VDD  
'RIGHT'  
Rs5 8.2k  
Rs3 4.7k  
C1  
2.2uF  
C2  
5
R1  
SNS3B  
127  
controller. Acquisition timings and  
operating parameters are under host  
control; there are no option jumpers  
and the device cannot operate in a  
stand-alone mode.  
22k  
2.2uF  
Cs3  
100nF  
~400k  
6
8
SNS3A  
SNS2A  
R2  
83  
45  
100k  
Cs2  
13  
DRDY  
SDO  
/SS  
SCLK  
SDI  
~400k  
100nF  
2
3
4
The output data is a 7-bit binary  
number (0...127) indicating angular  
position.  
7
SNS2B  
SNS1A  
R3  
1k  
SPI BUS  
Rs2 4.7k  
10  
Cs1  
~400k  
11  
100nF  
Like all QProx™ devices, the QT411  
operates using bursts of  
1= Detect Output  
12  
9
0
DETECT SNS1B  
C3  
Rs4 8.2k  
Rs1 4.7k  
'LEFT'  
VSS  
14  
1nF  
charge-transfer pulses; burst mode  
permits an unusually high level of  
control over spectral modulation,  
power consumption, and response  
time.  
If power is not an issue the device can run constantly under  
host control, by always raising /SS after 35µs from the last  
rising edge of CLK. Constant burst operation can be used by  
the host to gather more data to filter the position data further  
to suppress noise effects, if required.  
The QT411 modulates its bursts in a spread-spectrum  
fashion in order to heavily suppress the effects of external  
noise, and to suppress RF emissions.  
1.1 Synchronized Mode  
Synchronized mode also allows the host device to control the  
rate of drift compensation, by periodically sending a ‘drift’  
command to the device.  
Refer also to Figure 3-1, page 6.  
Sync mode allows the host device to control the repetition  
rate of the acquisition bursts, which in turn govern response  
time and power consumption.  
In sync mode, the device will wait for the SPI slave select line  
/SS to fall and rise and will then do an acquisition burst;  
actual SPI clocks and data are optional. The /SS pin thus  
becomes a ‘sync’ input in addition to acting as the SPI  
framing control.  
Mains Sync: Sync mode can and should be used to sync to  
mains frequency via the host controller, if mains interference  
is possible (ie, running as a lamp dimmer control). The host  
should issue SPI commands synchronously with the mains  
frequency. This form of operation will heavily suppress  
interference from low frequency sources (e.g. 50/60Hz),  
which are not easily suppressed using spread-spectrum pulse  
modulation.  
Within 35µs of the last rising edge of CLK, the device will  
enter a low power sleep mode. The rising edge of /SS must  
occur after this time; when /SS rises, the device wakes from  
sleep, and shortly thereafter does an acquisition burst. If a  
more substantial sleep time is desired, /SS should be made  
to rise some delay period later.  
By increasing the amount of time spent in sleep mode, the  
host can decrease the average current drain at the expense  
of response time. Since a burst typically requires 31ms (at  
3.3V, reference circuit), and an acceptable response time  
might be ~100ms, the power duty cycle will be 31/100 or 31%  
of peak current.  
Cross-talk suppression: If two or more QT411’s are used in  
close proximity, or there are other QTouch™ type device(s)  
close by, the devices can interfere strongly with one another  
to create position jitter or false triggering. This can be  
suppressed by making sure that the devices do not perform  
acquisition bursts at overlapping times. The host controller  
can make sure that all such devices operate in distinctly  
different timeslots, by using a separate /SS line for each part.  
Figure 1-2 Free-Run Timing Diagram ( /SS = high )  
~31ms  
~31ms  
Acquire Burst  
<4ms  
~30us  
DRDY from QT  
~25ms  
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2
QT411-ISSG R6.01/1005  
Table 1-1 Pin Descriptions  
PIN  
NAME  
TYPE  
DESCRIPTION  
1
VDD  
Power  
Positive power pin (+2.5 .. +5V)  
2
SDO  
/SS  
O
I
I
Serial data output  
3
Slave Select pin. This is an active low input that enables serial communications  
Serial clock input. Clock idles high  
4
SCLK  
SNS3B  
SNS3A  
SNS2B  
SNS2A  
SNS1B  
SNS1A  
SDI  
5
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I
Sense pin (to Cs3, Rs3); connects to both slider ends, each via separate additional 8.2K ohm resistors  
Sense pin (to Cs3)  
6
7
Sense pin (to Cs2, Rs2); connects to 66% point (from left) of slider  
Sense pin (to Cs2)  
8
9
Sense pin (to Cs1, Rs1); connects to 33% point (from left) of slider  
Sense pin (to Cs1)  
10  
11  
12  
13  
14  
Serial data input  
DETECT  
DRDY  
VSS  
O
O
Active high touch detected. May be left unconnected. Note (1)  
Data ready output. Goes high to indicate it is possible to communicate with the QT411. Note (1)  
Negative power pin  
Ground  
Note (1): Pin floats ~400µs after wake from Sleep mode.  
its state during the 400µs float interval when emerging from  
Sleep.  
1.2 Free-Run Mode  
If /SS stays high, the device will acquire on its own repetitively  
after a timeout of about 30ms (Figure 1-2). In this mode, the  
DETECT pin can be used to wake up the host when it goes  
high upon touch.  
Note that in the QT411, detection occurs when one or two of  
the sensing channels becomes imbalanced with respect to  
the other channel(s). A touch at one position will always  
cause such an imbalance. However, a signal change that is  
balanced among all 3 channels will not cause a detection. For  
example, if a book is placed on top of the slider element, the  
channels will all change in the same way and as a result,  
detection will be suppressed. This feature is significantly  
different from the way the QT401 operates.  
In free-run mode, the device does not sleep between bursts.  
In this mode the QT411 performs automatic drift  
compensation at the maximum rate of one count per 1 20  
acquisition burst cycles, or about one count every 7 seconds  
without host intervention. It is not possible to change this  
setting of drift compensation in Free-Run mode. See also  
Section 3.3.3.  
1.5 Position Data  
The position value is internally calculated and can be  
accessed only when the sensor is touched (Detect pin high).  
1.3 Sleep Mode  
After an SPI transmission, the device will enter a low power  
sleep state; see Figure 3-1, page 6, and Section 3.2.4, page  
7 for details. This sleep state can be extended in order to  
lower average power, by simply delaying the rise of /SS.  
Direction convention: ‘Left’ is defined as the side closest to  
the connection made by SNS1, and ‘Right’ is defined as the  
side closest to the SNS2 connection. The ends are both  
connected to SNS3, each via a resistor which allows the chip  
to identify left and right as separate positions. See Figure 1-1.  
The use of the terms ‘left’ and ‘right’ should not be interpreted  
to mean the device can only be used in one orientation. In  
fact the strip can be oriented backwards, vertically, or at any  
angle.  
Coming out of sleep state when /SS is pulsed, the DETECT  
and DRDY pins will float for ~400µs. It is recommended that  
the DRDY pin be pulled to Vss with a resistor and DETECT  
by bypassed with a capacitor to avoid false signalling if they  
are being monitored during this time; see Section 1.4.  
Note: Pin /SS clamps to Vss for 250ns after coming out of  
sleep state as a diagnostic pulse. To prevent a possible pin  
drive conflict, /SS should either be driven by the host as an  
open-drain pull-high drive (e.g. with a 100K pullup resistor), or  
there should be a ~1K resistor placed in series with the /SS  
pin. See Figure 1-1.  
The position on the left end reports as 0, while the position at  
the right reports as 127. The device reports 45 when touched  
at the SNS1 node and 83 at SNS2. The position data is a  
7-bit number (0..127) that is computed in real time and is  
returned via a status command.  
Note that activity on SCLK will also wake the QT411, which  
in turn will then wait for the /SS to rise. For lowest possible  
operation in Sleep mode, do not pulse on SCLK until after  
/SS goes low.  
End stops: The QT411 defines end zones of the slider  
element as saturated ‘end stops’, which consist of fixed  
regions where only a reading of ‘0’ or ‘127’ is returned. This is  
to allow robust position detection of these important locations,  
so that it is easy for a user to select ‘full off’ and ‘full on’. The  
left slider end allocates 10% of the slider’s length to location  
‘0’, and the right end similarly allocates 10% of the slider’s  
length to location ‘127’. Only the center 80% of the slider’s  
length will track changes in touch position in the range of  
1..126.  
1.4 DETECT Output Pin  
This pin drives high when touch is detected and the chip is  
reporting an angular position. This condition is also found as  
bit 7 in the standard response.  
This output will float for ~400µs during wake from Sleep mode  
(see Section 1.3). It is recommended that the DETECT pin (if  
it is used) be shunted to ground with a 1nF capacitor to hold  
The position data will update either with a single rapid touch  
or will track if the finger is moved along the surface of the  
lQ  
3
QT411-ISSG R6.01/1005  
Figure 1-3 Conventional PCB Layout (1-sided)  
Copper side faces away from the panel; the bare side is glued to the inside of the product.  
element. The position data ceases to be reported when touch electrode afterwards, so that the drift compensation  
detection is no longer sensed.  
mechanism does not artificially create a threshold offset  
during the iteration process. Between threshold changes, the  
probe must be removed to at least 100mm from the panel.  
1.6 Calibration  
Calibration is possible via two methods:  
1.8 Drift Compensation  
1) Power up or power cycling (there is no reset input).  
The device features an ability to compensate for slow drift  
due to environmental factors such as temperature changes or  
humidity. Drift compensation is performed under host control  
via a special drift command. See Section 3.3.3 for further  
details.  
2) On command from the host via the SPI port  
(Command 0x01: see Section 3.3.2).  
The calibration period requires 10 burst cycles, which are  
executed automatically without the need for additional SPI  
commands from the host. The spacing between each Cal  
burst is 1ms, and the bursts average about 31ms each, i.e.  
the Cal command requires ~325ms to execute. The power up  
calibration has 6 extra bursts to allow for power supply  
stabilization, and requires a total of ~550ms to begin normal  
operation.  
1.9 Error Status  
An error flag status is provided via a special command. An  
error can only occur when a finger was touching the sensing  
strip during power-on or recalibration, and then removed. In  
this sequence of events, the finger is ‘calibrated away’ and is  
not recognized as a touch. When the finger is removed, the  
signals from the device are inverted and a position is reported  
as though the strip has been touched. However, this position  
report is in error.  
Calibration should be performed when there is no hand  
proximity to the element, or the results may be in error.  
Should this happen, the error flag (bit 1 of the standard  
response, see Section 3.3) will activate when the hand is  
withdrawn. In most cases this condition will self-correct if drift  
compensation is used, and it can thus be ignored. See  
Section 1.9 below.  
After any calibration event (i.e. a power-on cycle or a CAL  
command) the next detection event should be checked to see  
if it is in error by using the special error command. If it an  
error is reported, the device should be immediately calibrated  
again to restore normal function (Section 3.3.2).  
Note: During calibration, the device cannot communicate.  
DRDY will remain low during this interval.  
1.7 Sensitivity Setting  
The sensitivity of the slider area to finger detection is  
dependent on the values of the three Cs capacitors (Section  
2.2) and the threshold setting (Section 3.3.5). Larger values  
of Cs increase sensitivity and also reduce granularity (missing  
codes), at the expense of higher power consumption due to  
longer acquisition bursts.  
2 Wiring & Parts  
The device should be wired according to Figure 1-1. An  
examples of a PCB layout is shown in Figure 1-3.  
2.1 Electrode Construction  
The strip electrode should be a resistive element of between  
200K to 500K ohms (400K nominal target value) between  
each set of connection points, of a suitable length and width.  
Under heavy capacitive loading (for example if the element  
The threshold setting can be used to fine tune the sensitivity  
of the sensing element. When setting the threshold, use the  
smallest finger size for which detection is desired (normally a  
6mm diameter spot), and probe at one of the two center  
connection points where sensitivity is weakest. The linear  
stretches between connection points are generally slightly  
higher in sensitivity due to the collection of charge from two  
channels.  
Table 1-2 Recommended Cs vs. Materials  
Thickness,  
Acrylic  
Borosilicate glass  
A ‘standard finger’ probe can be made by taking a piece of  
metal foil of the required diameter, gluing it on the end of a  
cylinder of sponge rubber, and connecting it to ground with a  
wire. This probe is pressed against the panel centered on one  
of the middle two connection points; the threshold parameter  
is iterated until the sensor just detects. It is important to push  
the probe into the panel quickly and not let it linger near the  
mm  
(
εR =2.8)  
10nF  
22nF  
47nF  
100nF  
-
(
εR =4.8)  
5.6nF  
10nF  
0.4  
0.8  
1.5  
2.5  
3.0  
4.0  
22nF  
39nF  
47nF  
-
100nF  
lQ  
4
QT411-ISSG R6.01/1005  
must be placed immediately over a ground plane within a  
A ceramic 0.1µF bypass capacitor should be placed very  
millimeter), the resistance might need to be lowered. Observe close to the power pins of the IC.  
the sensing pulses for flatness on their tops in the middle of a  
Regulator stability: Most low power LDO regulators have  
segment using a small coin and scope probe to make sure  
the pulses fully settle before the falling edge (see app note  
AN-KD02 Figure 7).  
very poor transient stability, especially when the load  
transitions from zero current to full operating current in a few  
microseconds. With the QT411 this happens when the device  
comes out of sleep mode. The regulator output can suffer  
from hundreds of microseconds of instability at this time,  
which will have a negative effect on acquisition accuracy.  
The electrode can be made of a series chain of discrete  
resistors with copper pads on a PCB, or from ITO (Indium Tin  
Oxide, a clear conductor used in LCD panels and touch  
screens) over a display. Thick-film carbon paste can also be  
used, however linearity might be a problem as these films are  
notoriously difficult to control without laser trimming or  
scribing.  
The linearity of the sensing strip is governed largely by the  
linearity and consistency of the resistive element. Position  
accuracy to within 5% is routinely achievable with good grade  
resistors and a uniform construction method.  
To assist with this problem, the QT411 waits 500µs after the  
400µs taken to come out of sleep mode before acquiring to  
allow power to fully stabilize. This delay is not present before  
an acquisition burst if there is no preceding sleep state.  
Use an oscilloscope to verify that Vdd has stabilized to within  
5mV or better of final settled voltage before a burst begins.  
The QT411 has specially enhanced power supply rejection  
built in. This means that it is often possible to share the  
regulator with other circuits. However, it is always advised to  
be sure that Vdd is free from spikes and transients, and is  
filtered sufficiently to prevent detection problems.  
2.2 Cs Sample Capacitors  
Cs1, Cs2 and Cs3 are the charge sensing sample capacitors;  
normally they are identical in nominal value. They should be  
of type X7R dielectric.  
During development it is wise to first design a regulator onto  
the PCB just for (and next to) the QT411, but allow for it to be  
‘jumpered out’. If in development it is clear that there are no  
problems with false detection or ‘angle noise’ even without a  
separate regulator for the QT411, then the regulator can be  
safely omitted.  
The optimal Cs values depend on the thickness of the panel  
and its dielectric constant. Lower coupling to a finger caused  
by a low dielectric constant and/or thicker panel will cause the  
position result to become granular and more subject to  
position errors. The ideal panel is made of thin glass. The  
worst panel is thick plastic. Granularity due to poor coupling  
can be compensated for by the use of larger values of sample 2.5 PCB Layout and Mounting  
capacitors.  
One form of PCB layout is shown in Figure 1-3. This is a  
1-sided board; the blank side is simply adhered to the inside  
of a 2mm thick (or less) control panel. Thicker panels can be  
tolerated with additional position error due to capacitive ‘hand  
shadow’ effects and will also have poorer EMC performance.  
A table of suggested values for no missing position values is  
shown in Table 1-2. Values of Cs smaller than those shown in  
the table can cause skipping of position codes. Code skipping  
may be acceptable in many applications where fine position  
data is not required. Smaller Cs capacitors have the  
advantage of requiring shorter acquisition bursts and hence  
lower power drain.  
The Figure 1-3 layout uses a series copper pads connected  
with intervening series resistors in a row. The total resistance  
between any two connection points can be in the range of  
100K to 500K, with ~400K being a suitable target value.  
Resistance values at the higher end of this range will  
generate more sensitivity provided there is no ground plane  
close underneath the electrode strip.  
A human finger interpolates between the copper pads (if the  
pads are narrow enough) to make a smooth output with no  
apparent steps. The lateral dimension along the centre of  
each electrode should be no wider than the expected  
smallest diameter of finger touch, to prevent stepping of the  
position response (if it matters).  
Larger values of Cs improve granularity at the expense of  
longer burst lengths and hence more average power.  
Cs1, Cs2 and Cs3 should be X7R type, matched to within  
10% of each other (ie, 5% tolerance) for best accuracy. The  
PCB reference layout (Figure 1-3) is highly recommended. If  
the Cs capacitors are poorly matched, position accuracy will  
be affected and there could also be missing codes.  
2.3 Rs Resistors  
See Figure 1-1. Rs1, Rs2, and Rs3 are low value (typically  
4.7K) resistors used to suppress the effects of ESD and  
assist with EMC compliance. They are optional in most  
cases.  
It is also possible create an interleaved electrode array with  
only 3 resistors between each channel’s connection point on  
the strip. Interleaving eliminates stepping while reducing the  
number of required resistors. Consult Quantum for further  
details.  
Resistive inks (such as ITO, Agfa OrgaconTM etc.) can also be  
used if the resistance between connection points is in the  
recommended range.  
In addition, there are two 8.2K resistors required to split  
channel SNS3B into the two constituent ends. These two  
resistors should be placed close to the ends of the slider  
strip.  
The electrode strip can be made in various lengths up to at  
least 80mm. The electrode width should be about 12mm wide  
or more, as a rule. The strip can also be an arc or other  
irregular shape. For a 360 degree wheel, use the QT511 or  
consult Quantum for other options.  
2.4 Power Supply  
The usual power supply considerations with QT parts applies  
also to the QT411. The power should be very clean and come  
from a separate regulator if possible. This is particularly  
critical with the QT411 which reports continuous position as  
opposed to just an on/off output.  
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QT411-ISSG R6.01/1005  
The SMT components should be oriented perpendicular to  
the direction of bending so that they do not fracture when the  
PCB is flexed during bonding to the panel.  
3 Serial Communications  
The serial interface is a SPI slave-only mode type which is  
compatible with multi-drop operation, i.e. the MISO pin will  
float after a shift operation to allow other SPI devices (master  
or slave) to talk over the same bus. There should be one  
dedicated /SS line for each QT411 from the host controller.  
Additional ground area or a ground plane on the PCB will  
compromise signal strength and is to be avoided. A single  
sided PCB can be made of FR-2 or CEM-1 for low cost.  
‘Handshadow’ effects: With thicker and wider panels an  
effect known as ‘handshadow’ can become noticeable. If the  
capacitive coupling from finger to electrode element is weak,  
for example due to a narrow electrode width or a thick, low  
dielectric constant panel, the remaining portion of the human  
hand can contribute a significant portion of the total  
A DRDY (‘data ready’) line is used to indicate to the host  
controller when it is possible to talk to the QT411.  
3.1 Power-up Timing Delay  
Immediately after power-up, DRDY floats for approximately  
20ms, then goes low. The device requires ~525ms thereafter  
before DRDY goes high again, indicating that the device has  
calibrated and is able to communicate.  
detectable capacitive load. This will induce an offset error,  
which will depend on the proximity and orientation of the hand  
to the remainder of the element. Thinner panels and those  
with a smaller diameter will reduce this effect since the finger  
contact surface will strongly dominate the total signal, and the  
remaining handshadow capacitance will not contribute  
significantly to create an error offset.  
From power up to first communication, allow a total of 550ms  
in startup delay.  
3.2 SPI Timing  
PCB Cleanliness: All capacitive sensors should be treated  
as highly sensitive circuits which can be influenced by stray  
conductive leakage paths. QT devices have a basic  
resolution in the femtofarad range; in this region, there is no  
such thing as ‘no clean flux’. Flux absorbs moisture and  
becomes conductive between solder joints, causing signal  
drift and resultant false detections or temporary loss of  
sensitivity. Conformal coatings will trap in existing amounts of  
moisture which will then become highly temperature  
sensitive.  
The SPI interface is a five-wire slave-only type; timings are  
found in Figure 3-1. The phase clocking is as follows:  
Clock idle: High  
Data out changes on: Falling edge of CLK from host  
Input data read on: Rising edge of CLK from host  
Slave Select /SS: Negative level frame from host  
Data Ready DRDY: Low from QT inhibits host  
Bit length & order: 8 bits, MSB shifts first  
Clock rate: 5kHz min, 40kHz max  
The designer should specify ultrasonic cleaning as part of the  
manufacturing process, and in extreme cases, the use of  
conformal coatings after cleaning.  
The host can shift data to and from the QT on the same cycle  
(with overlapping commands). Due to the nature of SPI, the  
return data from a command or request is always one SPI  
cycle behind.  
An acquisition burst always happens about 920µs after /SS  
goes high after coming out of Sleep mode. SPI clocking  
lasting more than 15ms can cause the chip to self-reset.  
2.6 ESD EMC and Related Issues  
,
Please refer to Quantum app note AN-KD02 for further  
information on ESD and EMC matters.  
Figure 3-1 SPI Timing Diagram  
~31ms  
~31ms  
Acquire Burst  
<1ms  
<1ms  
Sleep Mode  
awake  
low-power sleep  
awake  
400us typ  
sleep  
3-state if left to float  
DRDY from QT  
>13us, <100us  
>12us, <100us  
>12us, <100us  
>20us  
<35us  
>1us, <5us  
/SS from host  
CLK from Host  
sleep until automatic wake (~3s)  
wake up on /SS line  
Data sampled on rising edge  
Data shifts out on falling edge  
data hold >=12us  
after last clock  
Host Data Output  
?
7
6
5
4
3
2
1
0
0
(Slave Input - MOSI)  
command byte  
response byte  
<10us delay  
edge to data  
QT Data Output  
(Slave Out - MISO)  
3-state  
3-state  
?
7
6
5
4
3
2
1
output driven  
<12us after /SS  
goes low  
output floats  
before DRDY  
goes low  
lQ  
6
QT411-ISSG R6.01/1005  
3.2.1 /SS Line  
3.2.4 Sleep Mode  
/SS acts as a framing signal for SPI data clocking under host Please refer to Figure 3-1, page 6.  
control. See Figure 3-1.  
The device always enters low-power sleep mode after an SPI  
After a shift operation /SS must be pulsed high before being  
pulsed low for 1-5 µs. This must be a minimum of 35µs after  
the last clock edge on CLK. The device automatically goes  
transmission (Figure 3-1), at or before about 35µs after the  
last rising edge of CLK. Before entering sleep mode, the  
device will lower DRDY. If another immediate acquisition  
into sleep state during this interval, and wakes again after /SS burst is desired, /SS should be pulsed at least 35µs after the  
rises. If /SS is simply held low after a shift operation, the  
device will remain in sleep state up to the maximum time  
last rising edge of CLK. To prolong the sleep state, it is only  
necessary to pulse /SS after an even longer duration. During  
shown in Figure 3-1. When /SS is pulsed, another acquisition this time, the QT411 will wake up approximately every 3  
burst is triggered.  
seconds and burst before going back to sleep. This allows  
the QT411 to compensate for thermal changes.  
Changes on CLK will also cause the device to wake, however  
If /SS is held high all the time, the device will burst in a  
free-running mode at a ~17Hz rate. In this mode a valid  
position result can be obtained quickly on demand, and/or the the device will not cause an acquire burst to occur if /SS has  
DETECT pin can be used to wake the host. This rate  
depends on the burst length which in turn depends on the  
value of each Cs and load capacitance Cx. Smaller values of  
Cs or higher values of Cx will make this rate faster.  
also gone low and high again.  
In sleep mode, the device consumes only a few microamps of  
current. The average current can be controlled by the host, by  
adjusting the percentage of time that the device spends in  
sleep.  
The delay between the wake signal and the following burst is  
1ms max to allow power to stabilize. The DETECT and DRDY  
lines will float for ~400µs (typical at Vdd = 3.3V) during wake  
from Sleep mode; see Section 1.3 for details.  
Dummy /SS Burst Triggers: In order to force a single burst,  
a dummy ‘command’ can be sent to the device by pulsing /SS  
low for 10µs to 10ms; this will trigger a burst after the rising  
edge of /SS without requiring an actual SPI transmission. In  
order to ensure the sampling capacitors have enough time to  
discharge after a short /SS pulse, DRDY is held high for  
approximately 700µs before the burst occurring.  
After each acquisition burst, DRDY will rise again to indicate  
that the host can do another SPI transmission.  
After the burst completes, DRDY will rise again to indicate  
that the host can get the results.  
3.3 Commands  
Note: Pin /SS clamps to Vss for 250ns after coming out of  
sleep state as a diagnostic pulse. To prevent a possible pin  
drive conflict, /SS should either be driven by the host as an  
open-drain pull-high drive (e.g. with a 100K pullup resistor), or  
there should be a ~1K resistor placed in series with the /SS  
pin.  
Commands are summarized in Table 3-1. Commands can be  
overlapped, i.e. a new command can be used to shift out the  
results from a prior command.  
All commands cause a new acquisition burst to occur when  
/SS is raised again after the command byte is fully clocked.  
Standard Response: All SPI shifts return a ‘standard  
3.2.2 DRDY Line  
response’ byte which depends on the touch detection state:  
The DRDY line acts primarily as a way to inhibit the host from  
clocking to the QT411 when the QT411 is busy. It also acts to  
signal to the host when fresh data is available after a burst.  
The host should not attempt to clock data to the QT411 when  
DRDY is low, or the data will be ignored or cause a framing  
error.  
No touch detection: Bit 7 = 0 (0= not touched)  
Bit 6 = 0 to indicate linear type sensor  
= { 1 to indicate wheel chip }  
Bits 5, 4, 3, 2: unused (report 0)  
Bits 1, 0 reserved (report 0 or 1)  
On power-up, DRDY will first float for about 20ms, then pull  
low for ~525ms until the initial calibration cycle has  
completed, then drive high to indicate completion of  
calibration. The device will be ready to communicate in  
typically under 600ms (with Cs1 = Cs2 = Cs3 =100nF).  
Is touch detection:  
Bit 7 = 1 (1= is touched)  
Bits 0..6: Contains calculated position  
Note that touch detection calculated position is based on the  
results of the prior burst, which is triggered by the prior /SS  
rising edge (usually, from the prior command, or, from a  
dummy /SS trigger).  
While DRDY is a push-pull output; however, this pin floats  
after power-up and after wake from Sleep mode, for ~400µs  
(typical at Vdd = 3.3V). It is desirable to use a pulldown  
resistor on DRDY to prevent false signalling back to the host  
controller; see Figure 1-1 and Section 1.3.  
Bit 6 indicates the type of device: ‘1’ means that the device is  
a wheel (e.g. QT501 or QT511), and ‘0’ means the device is a  
linear type (e.g. QT411, or QT401).  
There are 5 commands as follows.  
3.2.3 MISO / MOSI Data Lines  
MISO and MOSI shift on the falling edge of each CLK pulse.  
The data should be clocked in on the rising edge of CLK. This  
applies to both the host and the QT411. The data path follows  
a circular buffer, with data being mutually transferred from  
host to QT, and QT to host, at the same time. However the  
return data from the QT is always the standard response byte  
regardless of the command.  
3.3.1 0x00 - Null Command  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
The Null command will trigger a new acquisition (if /SS rises),  
otherwise, it does nothing. The response to this command is  
the Standard Response byte, returned on the next SPI shift.  
The setup and hold times should be observed per Figure 3-1.  
lQ  
7
QT411-ISSG R6.01/1005  
TABLE 3-1 - Command Summary  
Hex  
0x00  
Command  
What it does  
Shift out data; cause acquire burst (if /SS rises again)  
Null  
Force recalibration of reference; causes 10 sequential bursts  
0x01  
Calibrate  
Power up default value = calibrated  
0x03  
0x04  
Drift Comp  
Error Status  
Drift compensation request; causes acquire burst. Max drift rate is 1 count per ten 0x03 commands.  
On the following SPI shift, returns the error status of the part; causes acquire burst. See Section 3.3.4.  
Set touch threshold; causes acquire burst. Bottom 6 bits (‘T’) are the touch threshold value. (10TT TTTT)  
0x8T  
Threshold  
Power up default value = 10  
This command is predominant once the device has been  
calibrated and is running normally.  
If the Drift command is issued while the device is in touch  
detection (ie bit 7 of the Standard Response byte =1), the drift  
function is ignored.  
3.3.2 0x01 - Calibrate  
Drift compensation during Free-Run mode is fixed at 6, which  
results in a maximum rate of drift compensation rate of about  
3secs / count; see Section 1.2.  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
1
This command takes ~325ms @ 3.3V to complete.  
The drift compensation rate should be made slow, so that it  
does not interfere with finger detection. A drift compensation  
rate of 3s ~ 5s is suitable for almost all applications. If the  
setting is too fast, the device can become unnecessarily  
desensitized when a hand lingers near the element. Most  
environmental drift rates are of the order of 10's or 100's of  
seconds per count.  
0x01 causes the device to do a basic recalibration. After the  
command is given the device will execute 10 acquisition  
bursts in a row in order to perform the recalibration, without  
the need for /SS to trigger each of the bursts. The host should  
wait for DRDY to rise again after the calibration has  
completed before shifting commands again.  
The response to this command is the Standard Response  
byte, returned on the next SPI shift.  
This command should be given if there is an error  
reported via the 0x04 command.  
On power-up the device calibrates itself automatically and so  
a 0x01 command is not required on startup.  
3.3.4 0x04 - Error Status  
7
0
6
0
5
0
4
0
3
0
2
1
1
0
0
0
The response to this command is the Standard Response  
byte, returned on the next SPI shift. During calibration,  
device communications are suspended.  
This command is used to read the current status of the  
device. In particular it is used to detect if there is a sensing  
error caused by a calibration or power-on at a bad time, ie  
when a finger is on the sensing strip and thereafter removed.  
3.3.3 0x03 - Drift Compensate  
7
0
6
0
5
0
4
0
3
0
2
0
1
1
0
1
The reported bits are as follows:  
Bit 7 = 1 indicates touch;  
0x03 causes the sensor to perform incremental drift  
compensation. This command must be given periodically in  
order to allow the sensor to compensate for drift. The more  
0x03 commands issued as a percentage of all commands,  
the faster the drift compensation will be.  
The 0x03 command must be given 10 times in order for the  
device to do one count of drift compensation in either  
direction. The 0x03 command should be used in substitution  
of the Null command periodically.  
= 0 indicates no touch  
Bit 6 = 0 indicates Linear type (QT401 or QT411)  
= 1 indicates Wheel type (QT510 or QT511)  
Bits 5, 4, 3, 2: unused (0)  
Bit 1 = 1 if calibration error  
Bit 0 reserved (reports 0 or 1)  
All bits except Bit 1 can be safely ignored.  
The status byte should be read the first time there is a  
detection just after a power-on reset or after a 0x01  
calibration. If Bit 1 = 1, there was a calibration error and the  
device should be immediately calibrated again using the 0x01  
command. After the second calibration it should be checked  
yet again (and so on) until there is no error.  
Example: The host causes a burst to occur by sending a  
0x00 Null command every 50ms (20 per second). Every 10th  
command the host sends is a 0x03 (drift) command.  
The maximum drift compensation slew rate in the reference  
level is -  
If there is no error according to the sequence of the above  
paragraph, it is not required to read this byte again.  
50ms x 10 x 10 = 5.0 seconds  
The actual rate of change of the reference level depends on  
whether there is an offset in the signal with respect to the  
reference level, and whether this offset is continuous or not.  
The error byte is returned on the following SPI shift.  
It is possible to modulate the drift compensation rate  
dynamically depending on circumstances, for example a  
significant rate of change in temperature, by varying the mix  
of Drift and Null commands.  
lQ  
8
QT411-ISSG R6.01/1005  
The response to this command is the Standard Response  
byte, returned on the next SPI shift.  
3.3.5 0x8T - Set Touch Threshold  
7
1
6
0
5
4
3
2
1
T1  
0
T0  
T5  
T4  
T3  
T2  
0x8T power-up default setting: 10  
The lower 6 bits of this command (T5..T0) are used to set the  
touch threshold level. Higher numbers are less sensitive (ie  
the signal has to travel further to cross the threshold).  
3.4 SPI - What to Send  
The host should execute the following commands after  
powerup self-cal cycle has completed (assuming a 50ms SPI  
repetition rate):  
Operand ‘T’ can range from 0 to 63. Internally the number is  
multiplied by 4 to achieve a wider range. 0 should never be  
used.  
This number is normally set to 10, more or less depending on  
the desired sensitivity to touch and the panel thickness.  
Touch detection uses a hysteresis value equal to 12.5% of  
the threshold setting.  
1. 0x01 - Basic calibration (optional as this is done  
automatically on power-up)  
2. 0x8T - Set touch threshold (optional)  
3. An endlessly repeating mixture of:  
a. 0x00 (Null) - all commands except:  
b. 0x03 (Drift compensate) - replace every nth Null  
command with 0x03 where typically, n = 10  
c. 0x04 (Error status) - use after any detection just  
after a calibration or power-up to see if there is a  
calibration error.  
Both the touch bit (bit 7) in the standard response and the  
DETECT pin will go high if this threshold is crossed. The  
DETECT pin can be used to indicate to the host that the  
device has detected a finger, without the need for SPI polling.  
However the /SS line must remain high constantly so that the  
device continues to acquire continuously, or /SS has to be at  
least pulsed regularly for this to work.  
Note: the Null can be replaced by an empty /SS pulse if there  
is no need for fast updates.  
lQ  
9
QT411-ISSG R6.01/1005  
4.1 Absolute Maximum Specifications  
Operating temperature range, Ta. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40OC to +85OC  
Storage temperature range, Ts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55OC to +125OC  
V
DD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to +7.0V  
Max continuous pin current, any control or drive pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20mA  
Short circuit duration to ground, any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . infinite  
Short circuit duration to V , any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . infinite  
Voltage forced onto any pDinD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.6V to (Vdd + 0.6) Volts  
4.2 Recommended Operating Conditions  
V
DD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +2.5 to 5.0V  
Supply ripple+noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mV p-p max  
Cs1, Cs2, Cs3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100nF  
Cs1, Cs2, Cs3 relative matching. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5%  
Output load, max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±0.5mA  
4.3 DC Specifications  
Vdd = 5.0V, Cs1 = Cs2 = 100nF, 100ms rep rate, Ta = recommended range, all unless otherwise noted  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Notes  
I
I
I
I
DD  
DD  
DD  
DD  
5
3
5
3
P
P
A
A
Peak supply current  
0.75  
0.45  
180  
110  
1.5  
0.6  
mA  
mA  
µA  
µA  
V/s  
V
@ 5V  
@ 3V  
@ 5V  
@ 3V  
Peak supply current  
Average supply current  
Average supply current  
Supply turn-on slope  
Low input logic level  
High input logic level  
Low output voltage  
V
DDS  
100  
2.2  
Required for proper startup and calibration  
V
IL  
0.8  
0.6  
V
HL  
V
V
V
OL  
4mA sink  
V
I
A
OH  
High output voltage  
Input leakage current  
Acquisition resolution  
Vdd-0.7  
V
µA  
bits  
1mA source  
IL  
±1  
7
R
4.4 AC Specifications  
Vdd = 5.0V, Cs1 = Cs2 = 100nF, Ta = recommended range, unless otherwise noted  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Notes  
TR  
ST  
FQT  
TBS  
TD  
Response time  
-
ms  
pF  
kHz  
ms  
ms  
kHz  
Under host control  
Variable parameter under host control  
Modulated spread-spectrum (chirp)  
Touch Sensitivity  
Sample frequency  
QT Burst spacing  
Power-up delay to operate  
SPI clock rate  
0.6  
92  
1
98  
104  
37  
550  
FSPI  
5
4.5 Signal Processing and Output  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Notes  
DI  
TP  
TT  
HP  
HT  
Detection integrator counts  
Threshold, prox  
Threshold, wheel touch  
Hysteresis, prox sensing  
Hysteresis, touch sensing  
1
counts  
Both prox and touch detection  
Host controlled variable  
Host controlled variable  
% of threshold setting  
1
1
63  
63  
0
12.5  
%
%
% of threshold setting  
DR  
L
Drift compensation rate  
Position linearity  
±10  
%
%
% of bursts; host controlled  
Depends on element linearity, layout  
±3  
lQ  
10  
QT411-ISSG R6.01/1005  
4.6 TSSOP Package  
E
E1  
D
2
1
n
a
B
A
c
A1  
L
Units  
Dimension Limits  
INCHES  
NOM  
14  
MILLIMETERS  
MIN  
MAX  
MIN  
NOM  
14  
MAX  
Number of Pins  
Pitch  
n
p
0.026  
0.65  
Overall Height  
A
0.043  
0.006  
0.256  
0.177  
0.201  
0.028  
8
1.10  
0.15  
6.50  
4.50  
5.10  
0.70  
8
Standoff  
A1  
E
0.002  
0.246  
0.169  
0.193  
0.020  
0
0.004  
0.251  
0.173  
0.197  
0.024  
4
0.05  
6.25  
4.30  
4.90  
0.50  
0
0.10  
6.38  
4.40  
5.00  
0.60  
4
Overall Width  
Moulded Package Width  
Moulded Package Length  
Foot Length  
E1  
D
L
Foot Angle  
Lead Thickness  
Lead Width  
c
B
a
0.004  
0.007  
0
0.006  
0.010  
5
0.008  
0.012  
10  
0.09  
0.19  
0
0.15  
0.25  
5
0.20  
0.30  
10  
Mould Draft Angle Top  
Mould Draft Angle Bottom  
0
5
10  
0
5
10  
4.7 Ordering Information  
PART NO.  
QT411-ISSG  
PACKAGE  
TSSOP-14  
TEMP RANGE  
MARKING  
-400C ~ +850C  
QT411  
lQ  
11  
QT411-ISSG R6.01/1005  
lQ  
Copyright © 2004-2005 QRG Ltd. All rights reserved.  
Patented and patents pending  
Corporate Headquarters  
1 Mitchell Point  
Ensign Way, Hamble SO31 4RF  
Great Britain  
Tel: +44 (0)23 8056 5600 Fax: +44 (0)23 80565600  
www.qprox.com  
North America  
651 Holiday Drive Bldg. 5 / 300  
Pittsburgh, PA 15220 USA  
Tel: 412-391-7367 Fax: 412-291-1015  
This device covered under one or more of the following United States and corresponding international patents: 5,730,165, 6,288,707,  
6,377,009, 6,452,514, 6,457,355, 6,466,036, 6,535,200. Numerous further patents are pending which may apply to this device or the  
applications thereof.  
The specifications set out in this document are subject to change without notice. All products sold and services supplied by QRG are subject  
to our Terms and Conditions of sale and supply of services which are available online at www.qprox.com and are supplied with every order  
acknowledgment. QProx, QTouch, QMatrix, QLevel, QWheel, QView, QScreen, and QSlide are trademarks of QRG. QRG products are not  
suitable for medical (including lifesaving equipment), safety or mission critical applications or other similar purposes. Except as expressly set  
out in QRG's Terms and Conditions, no licenses to patents or other intellectual property of QRG (express or implied) are granted by QRG in  
connection with the sale of QRG products or provision of QRG services. QRG will not be liable for customer product design and customers  
are entirely responsible for their products and applications which incorporate QRG's products.  
Development Team: Martin Simmons, Matthew Trend  
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