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QT510

型号:

QT510

描述:

QWHEEL触摸滑块IC[ QWHEEL TOUCH SLIDER IC ]

品牌:

QUANTUM[ QUANTUM RESEARCH GROUP ]

页数:

14 页

PDF大小:

322 K

lQ  
QT510  
QWHEEL™ TOUCH  
S
LIDER IC  
z
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Rotary finger-touch ‘wheel’ slider control  
Extremely simple circuit - no external active components  
Completely passive sensing element: no moving parts  
Compatible with clear ITO over LCD construction  
SPI slave-mode interface  
Self-calibration and drift compensation modes  
Proximity sensing for wake up function  
Spread-spectrum operation for optimal EMC compliance  
2.5 - 5.5V single supply operation; very low power  
14-pin SOIC and TSSOP Pb-free packages  
Inexpensive, simple 1-sided PCB construction possible  
E510 reference design board available  
VDD  
SDO  
1
2
3
4
5
6
7
14  
13  
GND  
DRDY  
PROX  
SDI  
/SS  
QT510 12  
SCLK  
SNS3B  
SNS3A  
SNS2B  
11  
10  
9
SNS1A  
SNS1B  
SNS2A  
8
APPLICATIONS  
y Personal electronics  
y Appliance controls  
y Shaft encoders  
y Automotive controls  
The QT510 QSlide™ IC is a new type of rotary capacitive touch ‘slider’ sensor IC based on Quantum’s patented  
charge-transfer methods. This unique IC allows designers to create speed or volume controls, menu bars, and other more  
exotic forms of human interface on the panel of an appliance. Generally it can be used to replace any form of rotary knob,  
through a completely sealed panel.  
The device uses a simple, inexpensive resistive sensing element between three connection points. The sense element can be  
circular or any polygon shape. The sense element can also be used as a proximity sensor out to several centimeters, to wake  
up an appliance or display from a sleep mode in a dramatic fashion.  
The QT510 can report a single rapid touch anywhere along the sense element, or, it can track a finger moving along the wheel  
surface in real time. The device self-calibrates under command from a host controller.  
This device uses three channels of simultaneous sensing across a resistive element to determine finger position, using  
mathematical analysis. A positional accuracy of 5% (or better) is relatively easy to achieve.  
The acquisitions are performed in a burst mode which uses proprietary spread-spectrum modulation for superior noise  
immunity and low emissions.  
The output of the QT510 can also be used to create discrete controls in a circle, by interpreting sets of number ranges as  
buttons. For example, the number range 0..19 can be button A, 30..49 button B, 60..79 button C etc. Continuous wheel action  
and discrete controls can be mixed on a single element, or, the element can be reinterpreted differently at different times, for  
example when used below or on top of an LCD to act as a menu input device that dynamically changes function in context. The  
device is compatible with ITO (Indium Tin Oxide) overlays on top of various displays or simply to provide for a backlighting  
effect.  
AVAILABLE OPTIONS  
TA  
SO-14  
TSSOP-14  
-400C ~ +850C  
QT510-ISG  
QT510-ISSG  
LQ  
Copyright © 2004 QRG Ltd  
QT510 R6.04/0505  
Figure 1-1 QT510 Wiring Diagram  
1 Operation  
The QT510 uses a SPI slave mode  
interface for control and data  
communications with a host  
Regulator  
VIN VOUT  
GND  
VIN  
1
U1 QT510  
5
VDD  
Rs3 4k7  
C1  
2.2uF  
C2  
2.2uF  
R1  
SNS3B  
controller. Acquisition timings and  
operating parameters are under host  
control; there are no option jumpers  
and the device cannot operate in a  
stand-alone mode.  
22k  
Cs3  
100nF  
127 0  
6
8
SNS3A  
R2  
Slider element  
~270K total  
resistance  
100k  
SNS2A  
Cs2  
13  
2
DRDY  
SDO  
/SS  
SCLK  
SDI  
100nF  
The positional output data is a 7-bit  
binary number (0...127) indicating  
angular position.  
85  
43  
7
SNS2B  
SNS1A  
R3  
1K  
3
4
SPI BUS  
Rs2 4k7  
10  
Cs1  
11  
100nF  
Like all QProx™ devices, the QT510  
operates using bursts of  
Proximity Output  
12  
9
PROX  
SNS1B  
VSS  
14  
C3  
Rs1 4k7  
charge-transfer pulses; burst mode  
permits an unusually high level of  
control over spectral modulation,  
power consumption, and response  
time.  
1nF  
If power is not an issue the device can run constantly under  
host control, by always raising /SS after 35µs from the last  
rising edge of CLK. Constant burst operation can be used by  
the host to gather more data to filter the position data further  
to suppress noise effects, if required.  
The QT510 modulates its bursts in a spread-spectrum  
fashion in order to heavily suppress the effects of external  
noise, and to suppress RF emissions.  
1.1 Synchronized Mode  
Synchronized mode also allows the host device to control the  
rate of drift compensation, by periodically sending a ‘drift’  
command to the device.  
Refer also to Figure 3-1, page 6.  
Sync mode allows the host device to control the repetition  
rate of the acquisition bursts, which in turn govern response  
Mains Sync: Sync mode can and should be used to sync to  
time and power consumption. The maximum spacing from the mains frequency via the host controller, if mains interference  
end of one burst to the start of the next in this mode is 1 sec.  
is possible (ie, running as a lamp dimmer control). The host  
should issue SPI commands synchronously with the mains  
frequency. This form of operation will heavily suppress  
interference from low frequency sources (e.g. 50/60Hz),  
which are not easily suppressed using spread-spectrum  
pulse modulation.  
In sync mode, the device will wait for the SPI slave select line  
/SS to fall and rise and will then do an acquisition burst;  
actual SPI clocks and data are optional. The /SS pin thus  
becomes a ‘sync’ input in addition to acting as the SPI  
framing control.  
Cross-talk suppression: If two or more QT510’s are used in  
close proximity, or there are other QTouch™ type device(s)  
close by, the devices can interfere strongly with one another  
to create position jitter or false triggering. This can be  
suppressed by making sure that the devices do not perform  
acquisition bursts at overlapping times. The host controller  
can make sure that all such devices operate in distinctly  
different timeslots, by using a separate /SS line for each part.  
Within 35µs of the last rising edge of CLK, the device will  
enter a low power sleep mode. The rising edge of /SS must  
occur after this time; when /SS rises, the device wakes from  
sleep, and shortly thereafter does an acquisition burst. If a  
more substantial sleep time is desired, /SS should be made  
to rise some delay period later.  
By increasing the amount of time spent in sleep mode, the  
host can decrease the average current drain at the expense  
of response time. Since a burst typically requires 31ms (at  
3.3V, reference circuit), and an acceptable response time  
might be ~100ms, the power duty cycle will be 31/100 or 31%  
of peak current.  
1.2 Free-Run Mode  
If /SS stays high, the device will acquire on its own  
repetitively approximately every 60ms (Figure 1-2). This  
mode can be used to allow the part to function as a prox  
Figure 1-2 Free-Run Timing Diagram ( /SS = high )  
~31ms  
~31ms  
Acquire Bur  
DRDY from QT  
~3.8ms  
~30us  
~25ms  
lQ  
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QT510 R6.04/0505  
Table 1-1 Pin Descriptions  
PIN  
NAME  
TYPE  
DESCRIPTION  
1
VDD  
Power  
Positive power pin (+2.5 .. +5V)  
2
SDO  
/SS  
O
I
I
Serial data output  
3
Slave Select pin. This is an active low input that enables serial communications  
Serial clock input. Clock idles high  
4
SCLK  
SNS3B  
SNS3A  
SNS2B  
SNS2A  
SNS1B  
SNS1A  
SDI  
5
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I
Sense pin (to Cs3, Rs3); connects to 127/0 position (12:00) of wheel  
Sense pin (to Cs3)  
6
7
Sense pin (to Cs2, Rs2); connects to 85 position (8:00) of wheel  
Sense pin (to Cs2)  
8
9
Sense pin (to Cs1, Rs1); connects to 43 position (4:00) of wheel  
Sense pin (to Cs1)  
10  
11  
12  
13  
14  
Serial data input  
PROX  
DRDY  
VSS  
O
O
Active high when hand approaches and during touch. May be left unconnected. Note (1)  
Data ready output. Goes high to indicate it is possible to communicate with the QT510. Note (1)  
Negative power pin  
Ground  
Note (1): Pin floats ~400µs after wake from Sleep mode.  
detector first, perhaps to wake a host controller. The PROX  
pin can be used to wake up the host when it goes high.  
1.5 Position Data  
The position value is internally calculated and can be  
accessed only when the sensor is touched (Detect pin high).  
In free-run mode, the device does not sleep between bursts.  
In this mode the QT510 performs automatic drift  
compensation at the maximum rate of one count per 180  
acquisition burst cycles, or about one count every 3 seconds  
without host intervention. It is not possible to change this  
setting of drift compensation in Free-Run mode. See also  
Section 3.3.3.  
The position data is a 7-bit number (0..127) that is computed  
in real time; the position number returned is 0 or 127 with  
position at SNS3, 43 when at SNS1 and 85 at SNS2. The  
position data will update either with a single rapid touch or will  
track if the finger is moved along the surface of the element.  
The position data ceases to be reported when touch detection  
is no longer sensed.  
1.3 Sleep Mode  
After an SPI transmission, the device will enter a low power  
sleep state; see Figure 3-1, page 6, and Section 3.2.4, page  
7 for details. This sleep state can be extended in order to  
lower average power, by simply delaying the rise of /SS.  
1.6 Calibration  
Calibration is possible via two methods:  
1) Power up or power cycling (there is no reset input).  
2) On command from host via SPI (Command 0x01: see  
Section 3.3.2).  
Coming out of sleep state when /SS rises, the PROX and  
DRDY pins will float for ~400µs; it is recommended that these  
pins be pulled low to Vss to avoid false signalling if they being  
monitored during this time.  
The calibration period requires 10 burst cycles, which are  
executed automatically without the need for additional SPI  
commands from the host. The spacing between each Cal  
burst is 1.5ms, and the bursts average about 31ms each, i.e.  
the Cal command requires ~325ms to execute.  
Calibration should be performed when there is no hand  
proximity to the element, or the results may be in error.  
Should this happen, the error flag (bit 1 of the standard  
response, see Section 3.3) will activate when the hand is  
withdrawn. In most cases this condition will self-correct if drift  
compensation is used, and it can thus be ignored. See  
Section 1.8 below.  
Note: Pin /SS clamps to Vss for 250ns after coming out of  
sleep state as a diagnostic pulse. To prevent a possible pin  
drive conflict, /SS should either be driven by the host as an  
open-drain pull-high drive (e.g. with a 100K pullup resistor), or  
there should be a ~1K resistor placed in series with the /SS  
pin. See Figure 1-1.  
N.B Activity on the clock line will wake the QT510, which in  
turn will then wait for the SS to rise.  
1.4 PROX Output  
Note: During calibration, the device cannot communicate.  
DRDY will remain low during this interval.  
There is an active-high output pin for the detection of hand  
proximity.  
PROX output: This pin goes high when a hand is detected  
in free space near the slider. This condition is also found  
as bit 0 in the standard response when there is no touch  
detection (Section 3.3).  
1.7 Drift Compensation  
The device features an ability to compensate for slow drift  
due to environmental factors such as temperature changes or  
humidity. Drift compensation is performed completely under  
host control via a special drift command. See Section 3.3.3  
for further details.  
The sensitivity of this function can be set using serial  
commands (Sections 3.3.4 and 3.3.5).  
This output will float for ~400µs after wake from Sleep mode  
(see Section 1.3). It is recommended that PROX (if used) be  
shunted to ground with 1nF capacitors to hold its state during  
the 400µs float interval when emerging from Sleep.  
1.8 Error Flag  
An error flag bit is provided in the standard response byte but  
only when there is no touch detection present (Section 3.3); if  
lQ  
3
QT510 R6.04/0505  
The optimal Cs values depend on the  
thickness of the panel and its dielectric  
constant. Lower coupling to a finger caused  
by a low dielectric constant and/or thicker  
panel will cause the position result to  
become granular and more subject to  
position errors. The ideal panel is made of  
thin glass. The worst panel is thick plastic.  
Granularity due to poor coupling can be  
compensated for by the use of larger values  
of sample capacitors.  
Figure 1-3 E510 PCB Layout  
A table of suggested values for no missing  
position values is shown in Table 1-2.  
Values of Cs smaller than those shown in  
the table can cause skipping of position  
codes. Code skipping may be acceptable in  
many applications where fine position data  
is not required. Smaller Cs capacitors have  
the advantage of requiring shorter  
acquisition bursts and hence lower power  
drain.  
Larger values of Cs improve granularity at  
the expense of longer burst lengths and  
the Error bit is high, it means the signal has fallen significantly  
below the calibration level when not touched. If this happens  
the device could report slightly inaccurate position values  
when touched.  
hence more average power.  
Cs1, Cs2 and Cs3 should be X7R type, matched to within  
10% of each other (ie, 5% tolerance) for best accuracy. The  
E510 reference layout (Figure 1-3) is highly recommended. If  
the Cs capacitors are poorly matched, the wheel accuracy will  
be affected and there could also be missing codes.  
This condition can self-correct via the drift compensation  
process after some time under host control (Section 3.3.3).  
Alternatively, the host controller can cause the device to  
recalibrate immediately by issuing a calibration command  
(Section 3.3.2).  
2.3 Rs Resistors  
Rs1, Rs2, and Rs3 are low value (typically 4.7K) resistors  
used to suppress the effects of ESD and assist with EMC  
compliance.  
2 Wiring & Parts  
2.4 Power Supply  
The device should be wired according to Figure 1-1. An  
example PCB layout (of the E510 eval board) is shown in  
Figure 1-3.  
The usual power supply considerations with QT parts applies  
also to the QT510. The power should be very clean and come  
from a separate regulator if possible. This is particularly  
critical with the QT510 which reports continuous position as  
opposed to just an on/off output.  
2.1 Electrode Construction  
The wheel electrode should be a resistive element of about  
100K ohms +/-50% between each set of connection points, of  
a suitable diameter and width. There are no known diameter  
restrictions other than those governed by human factors.  
A ceramic 0.1µF bypass capacitor should be placed very  
close to the power pins of the IC.  
Regulator stability: Most low power LDO regulators have  
very poor transient stability, especially when the load  
transitions from zero current to full operating current in a few  
microseconds. With the QT510 this happens when the device  
comes out of sleep mode. The regulator output can suffer  
from hundreds of microseconds of instability at this time,  
which will have a negative effect on acquisition accuracy.  
The electrode can be made of a series chain of discrete  
resistors with copper pads on a PCB, or from ITO (Indium Tin  
Oxide, a clear conductor used in LCD panels and touch  
screens) over a display. Thick-film carbon paste can also be  
used, however linearity might be a problem as these films are  
notoriously difficult to control without laser trimming or  
scribing.  
The linearity of the wheel is governed largely by the linearity  
and consistency of the resistive element. Positional accuracy  
to within 5% is routinely achievable with good grade resistors  
and a uniform construction method.  
Table 1-2 Recommended Cs vs. Materials  
Thickness,  
Acrylic  
Borosilicate glass  
mm  
(
εR =2.8)  
10nF  
22nF  
47nF  
100nF  
-
(
εR =4.8)  
5.6nF  
10nF  
0.4  
0.8  
1.5  
2.5  
3.0  
4.0  
2.2 Cs Sample Capacitors  
Cs1, Cs2 and Cs3 are the charge sensing sample capacitors;  
normally they are identical in nominal value. They should be  
of type X7R dielectric.  
22nF  
39nF  
47nF  
100nF  
-
lQ  
4
QT510 R6.04/0505  
To assist with this problem, the QT510 waits 500µs after  
coming out of sleep mode before acquiring to allow power to  
fully stabilize. This delay is not present before an acquisition  
burst if there is no preceding sleep state.  
2.6 ESD Protection  
Since the electrode is always placed behind a dielectric  
panel, the IC will be protected from direct static discharge.  
However even with a panel transients can still flow into the  
electrode via induction, or in extreme cases via dielectric  
breakdown. Porous materials may allow a spark to tunnel  
right through the material. Testing is required to reveal any  
problems. The device has diode protection on its terminals  
which will absorb and protect the device from most ESD  
events; the usefulness of the internal clamping will depending  
on the panel's dielectric properties and thickness.  
Use an oscilloscope to verify that Vdd has stabilized to within  
5mV or better of final settled voltage before a burst begins.  
2.5 PCB Layout and Mounting  
The E510 PCB layout (Figure 1-3) should be followed if  
possible. This is a 1-sided board; the blank side is simply  
adhered to the inside of a 2mm thick (or less) control panel.  
Thicker panels can be tolerated with additional position error  
due to capacitive ‘hand shadow’ effects and will also have  
poorer EMC performance.  
One method to enhance ESD suppression is to insert  
resistors Rs1, Rs2 and Rs3 in series with the element as  
shown in Figure 1-1; these are typically 4.7K but can be as  
high as 10K ohms.  
Diodes or semiconductor transient protection devices or  
MOV's on the electrode traces are not advised; these devices  
have extremely large amounts of nonlinear parasitic  
capacitance which will swamp the capacitance of the  
electrode and cause false detections and other forms of  
instability. Diodes also act as RF detectors and will cause  
serious RF immunity problems.  
This layout uses 18 copper pads connected with intervening  
series resistors in a circle. The finger interpolates between  
the copper pads (if the pads are narrow enough) to make a  
smooth, 0..127 step output with no apparent stair-casing. The  
lateral dimension along the centre of each electrode should  
be no wider than the expected smallest diameter of finger  
touch, to prevent stair-casing of the position response (if that  
matters).  
See also next section.  
Other geometries are possible, for example triangles and  
squares. The wheel can be made in various diameters up to  
at least 80mm. The electrode width should be about 12mm  
wide or more, as a rule.  
2.7 EMC and Related Noise Issues  
External AC fields (EMI) due to RF transmitters or electrical  
noise sources can cause false detections or unexplained  
shifts in sensitivity.  
The influence of external fields on the sensor can be reduced  
by means of the Rs series resistors described in Section 2.6.  
The Cs capacitor and the Rs resistors (Figure 1-1) form a  
natural low-pass filter for incoming RF signals; the roll-off  
frequency of this network is defined by -  
The SMT components should be oriented perpendicular to  
the direction of bending so that they do not fracture when the  
PCB is flexed during bonding to the panel.  
Additional ground area or a ground plane on the PCB will  
compromise signal strength and is to be avoided. A single  
sided PCB can be made of FR-2 or CEM-1 for low cost.  
‘Handshadow’ effects: With thicker and wider panels an  
effect known as ‘handshadow’ can become noticeable. If the  
capacitive coupling from finger to electrode element is weak,  
for example due to a narrow electrode width or a thick, low  
dielectric constant panel, the remaining portion of the human  
hand can contribute a significant portion of the total  
1
FR =  
2RSCS  
If for example Cs = 47nF, and Rs = 4.7K, the EMI rolloff  
frequency is ~720 Hz, which is much lower than most noise  
sources (except for mains frequencies i.e. 50 / 60 Hz). The  
resistance from the sensing element itself is actually much  
higher on average, since the element is typically 50K ~ 100K  
ohms between connection points.  
detectable capacitive load. This will induce an offset error,  
which will depend on the proximity and orientation of the hand  
to the remainder of the element. Thinner panels and those  
with a smaller diameter will reduce this effect since the finger  
contact surface will strongly dominate the total signal, and the  
remaining handshadow capacitance will not contribute  
significantly to create an error offset.  
Rs and Cs must both be placed very close to the body of the  
IC so that the lead lengths between them and the IC do not  
form an unfiltered antenna at very high frequencies.  
PCB layout, grounding, and the structure of the input circuitry  
have a great bearing on the success of a design to withstand  
electromagnetic fields and be relatively noise-free.  
These design rules should be adhered to for best ESD and  
EMC results:  
PCB Cleanliness: All capacitive sensors should be treated  
as highly sensitive circuits which can be influenced by stray  
conductive leakage paths. QT devices have a basic  
resolution in the femtofarad range; in this region, there is no  
such thing as ‘no clean flux’. Flux absorbs moisture and  
becomes conductive between solder joints, causing signal  
drift and resultant false detections or temporary loss of  
sensitivity. Conformal coatings will trap in existing amounts of  
moisture which will then become highly temperature  
sensitive.  
1. Use only SMT components.  
2. Keep all Cs, Rs, and the Vdd bypass cap close to the IC.  
3. Do not place the electrode or its connecting trace near  
other traces, or near a ground plane.  
The designer should specify ultrasonic cleaning as part of the  
manufacturing process, and in extreme cases, the use of  
conformal coatings after cleaning.  
4. Do use a ground plane under and around the QT510  
itself, back to the regulator and power connector (but not  
beyond the Cs capacitor).  
5. Do not place an electrode (or its wiring) of one QT510  
device near the electrode or wiring of another device, to  
lQ  
5
QT510 R6.04/0505  
prevent cross interference, unless they are  
synchronized.  
3 Serial Communications  
The serial interface is a SPI slave-only mode type which is  
compatible with multi-drop operation, ie the MISO pin will float  
after a shift operation to allow other SPI devices (master or  
slave) to talk over the same bus. There should be one  
dedicated /SS line for each QT510 from the host controller.  
6. Keep the electrode (and its wiring) away from other  
traces carrying AC or switched signals.  
7. If there are LEDs or LED wiring near the electrode or its  
wiring (ie for backlighting of the key), bypass the LED  
wiring to ground on both the anode and cathode.  
A DRDY (‘data ready’) line is used to indicate to the host  
controller when it is possible to talk to the QT510.  
8. Use a voltage regulator just for the QT510 to eliminate  
noise coupling from other switching sources via Vdd.  
Make sure the regulator’s transient load stability provides  
for a stable voltage just before each burst commences.  
3.1 Power-up Timing Delay  
Immediately after power-up, DRDY floats for approximately  
20ms, then goes low. The device requires ~520ms thereafter  
before DRDY goes high again, indicating that the device has  
calibrated and is able to communicate.  
9. If Mains noise (50/60 Hz noise) is present, use the Sync  
feature to suppress it (see Section 1.1).  
For further tips on construction, PCB design, and EMC issues  
browse the application notes and faq at www.qprox.com  
3.2 SPI Timing  
The SPI interface is a five-wire slave-only type; timings are  
found in Figure 3-1. The phase clocking is as follows:  
Clock idle: High  
Data out changes on: Falling edge of CLK from host  
Input data read on: Rising edge of CLK from host  
Slave Select /SS: Negative level frame from host  
Data Ready DRDY: Low from QT inhibits host  
Bit length & order: 8 bits, MSB shifts first  
Clock rate: 5kHz min, 40kHz max  
The host can shift data to and from the QT on the same cycle  
(with overlapping commands). Due to the nature of SPI, the  
Figure 3-1 SPI Timing Diagram  
~31ms  
Acquire Burst  
<1ms, ~920us typ  
Sleep Mode  
awake  
low-power sleep; 1s max  
400us typ  
3-state if left to float  
DRDY from QT  
>13uS, <100uS  
>12us, <100us  
>12us, <100us  
<30uS  
/SS from host  
CLK from Host  
>35uS  
Data sampled on rising edge  
Data shifts out on falling edge  
data hold >=12us  
after last clock  
Host Data Output  
?
7
6
5
4
3
2
1
0
0
(Slave Input - MOSI)  
command byte  
response byte  
<9us delay  
edge to data  
QT Data Output  
(Slave Out - MISO)  
3-state  
3-state  
?
7
6
5
4
3
2
1
output driven  
<11us after /SS  
goes low  
output floats  
before DRDY  
goes low  
lQ  
6
QT510 R6.04/0505  
return data from a command or action is always one SPI  
cycle behind.  
host to QT, and QT to host, at the same time. However the  
return data from the QT is always the standard response byte  
regardless of the command.  
An acquisition burst always happens about 920µs after /SS  
goes high after coming out of Sleep mode. SPI clocking  
lasting more than 15ms can cause the chip to self-reset.  
The setup and hold times should be observed per Figure 3-1.  
3.2.4 Sleep Mode  
3.2.1 /SS Line  
Please refer to Figure 3-1, page 6.  
/SS acts as a framing signal for SPI data clocking under host  
control. See Figure 3-1.  
The device always enters low-power sleep mode after an SPI  
transmission (Figure 3-1), at or before about 35µs after the  
last rising edge of CLK. Coincident with the sleep mode, the  
device will lower DRDY. If another immediate acquisition  
burst is desired, /SS should be raised again at least 35 µs  
after the last rising edge of CLK. To prolong the sleep state, it  
is only necessary to raise /SS after an even longer duration.  
After a shift operation /SS must go high again, a minimum of  
35µs after the last clock edge on CLK. The device  
automatically goes into sleep state during this interval, and  
wakes again after /SS rises. If /SS is simply held low after a  
shift operation, the device will remain in sleep state up to the  
maximum time shown in Figure 3-1. When /SS is raised,  
another acquisition burst is triggered.  
Changes on CLK will also cause the device to wake, however  
the device will not cause an acquire burst to occur if /SS has  
also gone low and high again.  
In sleep mode, the device consumes only a few microamps of  
current. The average current can be controlled by the host, by  
adjusting the percentage of time that the device spends in  
sleep.  
If /SS is held high all the time, the device will burst in a  
free-running mode at a ~17Hz rate. In this mode a valid  
position result can be obtained quickly on demand, and/or  
one of the two OUT pins can be used to wake the host. This  
rate depends on the burst length which in turn depends on  
the value of each Cs and load capacitance Cx. Smaller  
values of Cs or higher values of Cx will make this rate faster.  
The delay between the wake signal and the following burst is  
1ms max to allow power to stabilize. If the maximum spec on  
/SS low (1s) is exceeded, the device will eventually come out  
of sleep and calibrate again on its own.  
The Detect and DRDY lines will float for ~400µs (typical at  
Vdd = 3.3V) after wake from Sleep mode; see Section 1.3 for  
details.  
Dummy /SS Burst Triggers: In order to force a single burst,  
a dummy ‘command’ can be sent to the device by pulsing /SS  
low for 10µs to 10ms; this will trigger a burst on the rising  
edge of /SS without requiring an actual SPI transmission.  
DRDY will fall within 56µs of /SS rising again, and then a  
burst will occur 1mS later (while DRDY stays low).  
After each acquisition burst, DRDY will rise again to indicate  
that the host can do another SPI transmission.  
After the burst completes, DRDY will rise again to indicate  
that the host can get the results.  
Note: Pin /SS clamps to Vss for 250ns after coming out of  
sleep state as a diagnostic pulse. To prevent a possible pin  
drive conflict, /SS should either be driven by the host as an  
open-drain pull-high drive (e.g. with a 100K pullup resistor), or  
there should be a ~1K resistor placed in series with the /SS  
pin.  
3.3 Commands  
Commands are summarized in Table 3-1. Commands can be  
overlapped, i.e. a new command can be used to shift out the  
results from a prior command.  
All commands cause a new acquisition burst to occur when  
/SS is raised again after the command byte is fully clocked.  
3.2.2 DRDY Line  
Standard Response: All SPI shifts return a ‘standard  
The DRDY line acts primarily as a way to inhibit the host from  
clocking to the QT510 when the QT510 is busy. It also acts to  
signal to the host when fresh data is available after a burst.  
The host should not attempt to clock data to the QT510 when  
DRDY is low, or the data will be ignored or cause a framing  
error.  
response’ byte which depends on the touch detection state:  
No touch detection: Bit 7 = 0 (0= not touched)  
Bit 6 = 1 to indicate QWheel type  
= 0 to indicate Linear slider type  
Bits 5, 4, 3, 2: unused (0)  
Bit 1 = 1 if signal polarity error  
On power-up, DRDY will first float for about 20ms, then pull  
low for ~525ms until the initial calibration cycle has  
completed, then drive high to indicate completion of  
calibration. The device will be ready to communicate in  
typically under 600ms (with Cs1 = Cs2 = 100nF).  
While DRDY is a push-pull output; however, this pin floats  
after power-up and after wake from Sleep mode, for ~400µs  
(typical at Vdd = 3.3V). It is desirable to use a pulldown  
resistor on DRDY to prevent false signalling back to the host  
controller; see Figure 1-1 and Section 1.3.  
Bit 0 = 1 if prox detection only  
Is touch detection:  
Bit 7 = 1 (1= is touched)  
Bits 0..6: Contain calculated position  
Note that touch detection calculated position is based on the  
results of the prior burst, which is triggered by the prior /SS  
rising edge (usually, from the prior command, or, from a  
dummy /SS trigger - see Section ).  
Bit 6 indicates the type of device: ‘1’ means that the device is  
a wheel (e.g. QT510), and ‘0’ means the device is a linear  
type (e.g. QT401).  
3.2.3 MISO / MOSI Data Lines  
MISO and MOSI shift on the falling edge of each CLK pulse.  
The data should be clocked in on the rising edge of CLK. This  
applies to both the host and the QT510. The data path follows  
a circular buffer, with data being mutually transferred from  
There are 5 commands as follows.  
lQ  
7
QT510 R6.04/0505  
The actual rate of change of the reference level depends on  
whether there is an offset in the signal with respect to the  
reference level, and whether this offset is continuous or not.  
3.3.1 0x00 - Null Command  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
0
It is possible to modulate the drift compensation rate  
dynamically depending on circumstances, for example a  
significant rate of change in temperature, by varying the mix  
of Drift and Null commands.  
If the Drift command is issued while the device is in touch  
detection (ie bit 7 of the Standard Response byte =1), the drift  
function is ignored.  
The Null command will trigger a new acquisition (if /SS rises),  
otherwise, it does nothing. The response to this command is  
the Standard Response byte.  
This command is predominant once the device has been  
calibrated and is running normally.  
3.3.2 0x01 - Calibrate  
7
0
6
0
5
0
4
0
3
0
2
0
1
0
0
1
Drift compensation during Free-Run mode is fixed at 6, which  
results in a maximum rate of drift compensation rate of about  
3secs / count; see Section 1.2.  
This command takes ~525ms @ 3.3V to complete.  
The drift compensation rate should be made slow, so that it  
does not interfere with finger detection. A drift compensation  
rate of 3s ~ 5s is suitable for almost all applications. If the  
setting is too fast, the device can become unnecessarily  
desensitized when a hand lingers near the element. Most  
environmental drift rates are of the order of 10's or 100's of  
seconds per count.  
0x01 causes the sensor to do a basic recalibration. After the  
command is given the device will execute 10 acquisition  
bursts in a row in order to perform the recalibration, without  
the need for /SS to trigger each of the bursts. The host should  
wait for DRDY to rise again after the calibration has  
completed before shifting commands again.  
This command should be given if there is an error flag (bit 1  
of the response byte when no touch detection in progress).  
On power-up the device calibrates itself automatically and so  
a 0x01 command is not required on startup.  
3.3.4 0x4P - Set Proximity Threshold  
7
0
6
1
5
P5  
4
P4  
3
P3  
2
P2  
1
0
P1  
P0  
This command is optional, but if it is not given, the proximity  
detection function will work at a default setting of 10.  
The response to this command is the Standard Response  
byte. During calibration, device communications are  
suspended.  
The lower 6 bits of this command (P5..P0) are used to set the  
proximity threshold level. Higher numbers are less sensitive  
(ie the signal has to travel further to cross the threshold).  
Operand ‘P’ can range in value from 0 to 63. Zero (0) should  
never be used. Very low settings can cause excessive flicker  
in the proximity result due to low level noise and drift.  
3.3.3 0x03 - Drift Compensate  
7
0
6
0
5
0
4
0
3
0
2
0
1
1
0
1
0x03 causes the sensor to perform incremental drift  
compensation. This command must be given periodically in  
order to allow the sensor to compensate for drift. The more  
0x03 commands issued as a percentage of all commands,  
the faster the drift compensation will be.  
The 0x03 command must be given 10 times in order for the  
device to do one count of drift compensation in either  
direction. The 0x03 command should be used in substitution  
of the Null command periodically.  
P is normally in the range from 6 to 10. The prox threshold  
has no hysteresis and should only be used for non-critical  
applications where occasional detection bounce is not a  
problem, like power activation (i.e. to turn on an appliance or  
a display).  
The prox bit in the standard response and the PROX pin will  
both go high if the signal exceeds this threshold.  
0x4P power-up default setting: 10  
Example: The host causes a burst to occur by sending a  
0x00 Null command every 50ms (20 per second). Every 6th  
command the host sends is a 0x03 (drift) command.  
The maximum drift compensation slew rate in the reference  
level is -  
50ms x 6 x 10 = 3.0 seconds  
TABLE 3-1 - Command Summary  
Hex  
0x00  
Command  
What it does  
Shift out data; cause acquire burst (if /SS rises again)  
Null  
Force recalibration of reference; causes 10 sequential bursts  
0x01  
0x03  
0x4P  
Calibrate  
Drift Comp  
Prox Thresh  
Power up default value = calibrated  
Drift compensation request; causes acquire burst. Max drift rate is 1 count per ten 0x03’s.  
Set prox threshold; causes acquire burst. Bottom 6 bits (‘P’) are the prox threshold value. (01PP PPPP)  
Power up default value = 10  
Set touch threshold; causes acquire burst. Bottom 6 bits (‘T’) are the touch threshold value. (10TT TTTT)  
Power up default value = 10  
0x8T  
Touch Thresh  
lQ  
8
QT510 R6.04/0505  
3.3.5 0x8T - Set Touch Threshold  
3.4 SPI - What to Send  
7
1
6
0
5
4
3
2
1
T1  
0
T0  
The host should execute the following commands after  
powerup self-cal cycle has completed: (assuming a 50ms SPI  
repetition rate):  
T5  
T4  
T3  
T2  
The lower 6 bits of this command (T5..T0) are used to set the  
touch threshold level. Higher numbers are less sensitive (ie  
the signal has to travel further to cross the threshold).  
1. 0x01 - Basic calibration (optional as this is done  
automatically on power-up)  
Operand ‘T’ can range from 0 to 63. Internally the number is  
multiplied by 4 to achieve a wider range. 0 should never be  
used.  
This number is normally set to 10, more or less depending on  
the desired sensitivity to touch and the panel thickness.  
Touch detection uses a hysteresis equal to 12.5% of the  
threshold setting.  
2. 0x4P - Set prox threshold (optional)  
3. 0x8T - Set touch threshold (optional)  
4. An endlessly repeating mixture of:  
a. 0x00 (Null) - all commands except:  
b. 0x03 (Drift compensate) - replace every nth Null  
command where typically, n = 6  
c. If there is ever an error bit set, send a 0x01.  
Both the touch bit (bit 7) in the standard response and the  
PROX pin will go high if this threshold is crossed. The PROX  
pin can be used to indicate to the host that the device has  
detected a finger, without the need for SPI polling. However  
the /SS line must remain high constantly so that the device  
continues to acquire continuously, or /SS has to be at least  
pulsed regularly (see Section ) for this to work.  
If the error occurs frequently, then perhaps the ratio of drift  
compensation to Nulls should be increased.  
Note: the Null can be replaced by an empty /SS pulse if there  
is no need for fast updates.  
0x8T power-up default setting: 10  
lQ  
9
QT510 R6.04/0505  
4.1 Absolute Maximum Specifications  
Operating temperature range, Ta. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40OC to +85OC  
Storage temperature range, Ts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55OC to +125OC  
V
DD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to +7.0V  
Max continuous pin current, any control or drive pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20mA  
Short circuit duration to ground, any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . infinite  
Short circuit duration to V , any pin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . infinite  
Voltage forced onto any pDinD. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.6V to (Vdd + 0.6) Volts  
4.2 Recommended Operating Conditions  
V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +2.5 to 5.0V  
SuDDpply ripple+noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mV p-p max  
Cs1, Cs2, Cs3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100nF  
Cs1, Cs2, Cs3 relative matching. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±5%  
Output load, max. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±0.5mA  
4.3 DC Specifications  
Vdd = 5.0V, Cs1 = Cs2 = 100nF, 100ms rep rate, Ta = recommended range, all unless otherwise noted  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Notes  
I
I
I
I
DD  
DD  
DD  
DD  
5
3
5
3
P
P
A
A
Peak supply current  
0.75  
0.45  
180  
110  
1.5  
0.6  
mA  
mA  
µA  
µA  
V/s  
V
@ 5V  
@ 3V  
@ 5V  
@ 3V  
Peak supply current  
Average supply current  
Average supply current  
Supply turn-on slope  
Low input logic level  
High input logic level  
Low output voltage  
V
DDS  
100  
2.2  
Required for proper startup and calibration  
V
IL  
0.8  
0.6  
V
HL  
V
V
V
OL  
4mA sink  
V
I
A
OH  
High output voltage  
Input leakage current  
Acquisition resolution  
Vdd-0.7  
V
µA  
bits  
1mA source  
IL  
±1  
7
R
4.4 AC Specifications  
Vdd = 5.0V, Cs1 = Cs2 = 100nF, Ta = recommended range, unless otherwise noted  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Notes  
TR  
SP  
ST  
FQT  
TBS  
TD  
Response time  
Prox Sensitivity  
-
ms  
pF  
pF  
kHz  
µs  
ms  
kHz  
Under host control  
0.15  
0.6  
92  
Variable parameter under host control  
Variable parameter under host control  
Modulated spread-spectrum (chirp)  
Touch Sensitivity  
Sample frequency  
QT Burst spacing  
Power-up delay to operate  
SPI clock rate  
98  
104  
37  
500  
500  
FSPI  
5
4.5 Signal Processing and Output  
Parameter  
Description  
Min  
Typ  
Max  
Units  
Notes  
DI  
TP  
TT  
HP  
HT  
Detection integrator counts  
Threshold, prox  
Threshold, wheel touch  
Hysteresis, prox sensing  
Hysteresis, touch sensing  
1
counts  
Both prox and touch detection  
Host controlled variable  
Host controlled variable  
% of threshold setting  
1
1
63  
63  
0
12.5  
%
%
% of threshold setting  
DR  
L
Drift compensation rate  
Position linearity  
±10  
%
%
% of bursts; host controlled  
Depends on element linearity, layout  
±3  
lQ  
10  
QT510 R6.04/0505  
4.6 Small Outline (SO) Package  
D
L
ß×45º  
e
2a  
W
ø
E
M
Base level  
Seating level  
h H  
Package Type: 14 Pin SOIC  
Millimeters  
Inches  
Max  
SYMBOL  
Min  
Max  
Notes  
Min  
Notes  
M
W
2a  
H
h
8.56  
5.79  
3.81  
1.35  
0.10  
1.27  
0.36  
0.41  
0.20  
0.25  
0
8.81  
6.20  
3.99  
1.75  
0.25  
1.27  
0.51  
1.27  
0.25  
0.51  
8
0.337  
0.228  
0.150  
0.31  
0.347  
0.244  
0.157  
0.33  
0.004  
0.050  
0.014  
0.016  
0.008  
0.014  
0
0.010  
0.050  
0.020  
0.050  
0.010  
0.020  
8
D
L
BSC  
BSC  
E
e
B
o
4.7 TSSOP Package  
E
E1  
D
2
1
n
a
B
A
c
A1  
L
Units  
Dimension Limits  
Number of Pins  
Pitch  
INCHES  
MILLIMETERS  
MIN  
NOM  
14  
MAX  
MIN  
NOM  
14  
MAX  
n
p
0.026  
0.65  
Overall Height  
A
0.043  
0.006  
0.256  
0.177  
0.201  
0.028  
8
1.10  
0.15  
6.50  
4.50  
5.10  
0.70  
8
Standoff  
A1  
E
0.002  
0.246  
0.169  
0.193  
0.020  
0
0.004  
0.251  
0.173  
0.197  
0.024  
4
0.05  
6.25  
4.30  
4.90  
0.50  
0
0.10  
6.38  
4.40  
5.00  
0.60  
4
Overall Width  
Moulded Package Width  
Moulded Package Length  
Foot Length  
E1  
D
L
Foot Angle  
Lead Thickness  
Lead Width  
c
B
a
0.004  
0.007  
0
0.006  
0.010  
5
0.008  
0.012  
10  
0.09  
0.19  
0
0.15  
0.25  
5
0.20  
0.30  
10  
Mould Draft Angle Top  
Mould Draft Angle Bottom  
0
5
10  
0
5
10  
lQ  
11  
QT510 R6.04/0505  
4.8 Ordering Information  
PART NO.  
TEMP RANGE  
PACKAGE  
MARKING  
QT510-ISG  
-400C ~ +850C  
-400C ~ +850C  
SO-14  
QT510  
QT510  
QT510-ISSG  
TSSOP-14  
lQ  
12  
QT510 R6.04/0505  
5 E510 QWheelBoard Pictures  
Figure 5.1 - E510 Eval Board (front, back)  
lQ  
13  
QT510 R6.04/0505  
lQ  
Copyright © 2004-2005 QRG Ltd. All rights reserved.  
Patented and patents pending  
Corporate Headquarters  
1 Mitchell Point  
Ensign Way, Hamble SO31 4RF  
Great Britain  
Tel: +44 (0)23 8056 5600 Fax: +44 (0)23 80565600  
www.qprox.com  
North America  
651 Holiday Drive Bldg. 5 / 300  
Pittsburgh, PA 15220 USA  
Tel: 412-391-7367 Fax: 412-291-1015  
This device covered under one or more of the following United States and international patents: 5,730,165, 6,288,707, 6,377,009, 6,452,514,  
6,457,355, 6,466,036, 6,535,200. Numerous further patents are pending which may apply to this device or the applications thereof.  
The specifications set out in this document are subject to change without notice. All products sold and services supplied by QRG are subject  
to our Terms and Conditions of sale and supply of services which are available online at www.qprox.com and are supplied with every order  
acknowledgment. QProx, QTouch, QMatrix, QLevel, QWheel, QView, QScreen, and QSlide are trademarks of QRG. QRG products are not  
suitable for medical (including lifesaving equipment), safety or mission critical applications or other similar purposes. Except as expressly set  
out in QRG's Terms and Conditions, no licenses to patents or other intellectual property of QRG (express or implied) are granted by QRG in  
connection with the sale of QRG products or provision of QRG services. QRG will not be liable for customer product design and customers  
are entirely responsible for their products and applications which incorporate QRG's products.  
Development Team: Martin Simmons, Samuel Brunet, Luben Hristov  
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