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VV245

型号：

VV245

描述：

八路总线收发器与3态输出[ OCTAL BUS TRANSCEIVER WITH 3-STATE OUTPUTS ]

品牌：

TI[ TEXAS INSTRUMENTS ]

页数：

19 页

PDF大小：

472 K

下载PDF手册
SN74LV245AT  
OCTAL BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCLS605B–DECEMBER 2004–REVISED AUGUST 2005  
FEATURES  
•
•
•
•
Inputs Are TTL-Voltage Compatible  
4.5-V to 5.5-V VCC Operation  
Typical tpd of 3.5 ns at 5 V  
•
•
•
Ioff Supports Partial-Power-Down Mode  
Operation  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
Typical VOLP (Output Ground Bounce) <0.8 V  
at VCC = 5 V, TA = 25°C  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
•
•
Typical VOHV (Output VOH Undershoot) >2.3 V  
at VCC = 5 V, TA = 25°C  
– 1000-V Charged-Device Model (C101)  
xxxxxxx  
Supports Mixed-Mode Voltage Operation on  
All Ports  
DB, DGV, DW, NS, OR PW PACKAGE  
(TOP VIEW)  
RGY PACKAGE  
(TOP VIEW)  
1
2
3
4
5
6
7
8
9
10  
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
DIR  
A1  
A2  
V
CC  
OE  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
B8  
1
20  
19  
18  
17  
16  
15  
14  
13  
12  
2
3
4
5
6
7
8
9
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
OE  
B1  
B2  
B3  
B4  
B5  
B6  
B7  
A3  
A4  
A5  
A6  
A7  
A8  
GND  
10  
11  
DESCRIPTION/ORDERING INFORMATION  
This octal bus transceiver is designed for asynchronous two-way communication between data buses. The  
control-function implementation minimizes external timing requirements.  
The SN74LV245AT allows data transmission from the A bus to the B bus or from the B bus to the A bus,  
depending on the logic level at the direction-control (DIR) input. The output-enable (OE) input can be used to  
disable the device so that the buses are effectively isolated.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER  
SN74LV245ATRGYR  
SN74LV245ATDW  
TOP-SIDE MARKING  
VV245  
QFN – RGY  
SOIC – DW  
Tape and reel  
Tube  
LV245A  
Tape and reel  
Tape and reel  
Tape and reel  
Tape and reel  
Tape and reel  
SN74LV245ATDWR  
SN74LV245ATNSR  
–40°C to 85°C  
SOP – NS  
74LV245A  
LV245A  
SSOP – DB  
TSSOP – PW  
TVSOP – DGV  
SN74LV245ATDBR  
SN74LV245ATPWR  
SN74LV245ATGVR  
LV245AT  
LV245A  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2004–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
SN74LV245AT  
OCTAL BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCLS605B–DECEMBER 2004–REVISED AUGUST 2005  
DESCRIPTION/ORDERING INFORMATION (CONTINUED)  
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
FUNCTION TABLE  
(EACH TRANSCEIVER)  
INPUTS  
OPERATION  
OE  
L
DIR  
L
B data to A bus  
A data to B bus  
Isolation  
L
H
H
X
LOGIC DIAGRAM (POSITIVE LOGIC)  
1
2
DIR  
A1  
19  
OE  
B1  
18  
To Seven Other Channels  
2
SN74LV245AT  
OCTAL BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCLS605B–DECEMBER 2004–REVISED AUGUST 2005  
Absolute Maximum Ratings(1)  
over operating free-air temperature range (unless otherwise noted)  
MIN  
–0.5  
–0.5  
–0.5  
MAX  
UNIT  
V
VCC  
VI  
Supply voltage range  
Input voltage range(2)  
Voltage range applied to any output in the high-impedance or power-off state(2)  
Output voltage range applied in the high or low state(2)(3)  
7
7
7
V
VO  
VO  
IIK  
V
–0.5 VCC + 0.5  
V
Input clamp current  
VI < 0  
–20  
±50  
±35  
±70  
70  
mA  
mA  
mA  
mA  
IOK  
IO  
Output clamp current  
VO < 0 or VO > VCC  
VO = 0 to VCC  
Continuous output current  
Continuous current through VCC or GND  
DB package(4)  
DGV package(4)  
DW package(4)  
NS package(4)  
PW package(4)  
RGY package(5)  
92  
58  
θJA  
Package thermal impedance  
Storage temperature range  
°C/W  
°C  
60  
83  
37  
Tstg  
–65  
150  
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating  
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
(2) The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
(3) This value is limited to 5.5 V maximum.  
(4) The package thermal impedance is calculated in accordance with JESD 51-7.  
(5) The package thermal impedance is calculated in accordance with JESD 51-5.  
Recommended Operating Conditions(1)  
MIN  
4.5  
2
MAX UNIT  
VCC  
VIH  
VIL  
VI  
Supply voltage  
5.5  
V
V
V
V
High-level input voltage  
Low-level input voltage  
Input voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
0.8  
5.5  
VCC  
5.5  
–16  
16  
0
0
0
High or low state  
3-state  
VO  
Output voltage  
V
IOH  
IOL  
High-level output current  
Low-level output current  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
mA  
mA  
ns/V  
°C  
∆t/∆v Input transition rise or fall rate  
TA Operating free-air temperature  
20  
–40  
85  
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
3
SN74LV245AT  
OCTAL BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCLS605B–DECEMBER 2004–REVISED AUGUST 2005  
Electrical Characteristics  
over recommended operating free-air temperature range (unless otherwise noted)  
TA = –40°C  
to 85°C  
TA = 25°C  
MIN TYP  
PARAMETER  
TEST CONDITIONS  
VCC  
UNIT  
MAX MIN MAX  
IOH = –50 µA  
IOH = –16 mA  
IOL = 50 µA  
IOL = 16 mA  
4.5 V  
4.5 V  
4.5 V  
4.5 V  
0 to 5.5 V  
5.5 V  
5.5 V  
5.5 V  
0
4.4  
3.8  
4.5  
4.4  
3.8  
VOH  
V
V
0
0.1  
0.55  
±0.1  
±0.25  
2
0.1  
0.55  
±1  
VOL  
II  
VI = 5.5 V or GND  
µA  
µA  
µA  
mA  
µA  
pF  
pF  
IOZ  
ICC  
∆ICC  
Ioff  
Ci  
VO = VCC or GND  
±2.5  
20  
VI = VCC or GND, IO = 0  
One input at 3.4 V, Other inputs at VCC or GND  
VI or VO = 0 to 5.5 V  
(1)  
1.35  
0.5  
1.5  
5
Control inputs  
A or B port  
VI = VCC or GND  
5 V  
3
7
Cio  
VO = VCC or GND  
5 V  
(1) This is the increase in supply current for each input at one of the specified TTL voltage levels, rather than 0 V or VCC  
.
Switching Characteristics  
over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)  
TA = 25°C  
TYP  
4.9  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
MIN MAX  
UNIT  
MIN  
3.1  
2.3  
3.5  
3.7  
3.5  
2.6  
4.6  
4.7  
4.9  
5.3  
4.5  
4.1  
MAX  
7.7  
tPLH  
tPHL  
tPZH  
tPZL  
tPHz  
tPLZ  
tPLH  
tPHL  
tPZH  
tPZL  
tPHZ  
tPLZ  
tsk(o)  
1
1
1
1
1
1
1
1
1
1
1
1
8.5  
A or B  
OE  
B or A  
A or B  
A or B  
B or A  
A or B  
A or B  
CL = 15 pF  
CL = 15 pF  
CL = 15 pF  
CL = 50 pF  
CL = 50 pF  
ns  
ns  
ns  
ns  
ns  
4.9  
7.7  
8.5  
15  
9.4  
13.8  
13.8  
7.5  
9.4  
15  
3.9  
8
OE  
3.9  
7.5  
8
5.4  
8.7  
9.5  
9.5  
16  
A or B  
OE  
5.4  
8.7  
9.9  
14.8  
14.8  
15.4  
15.4  
1
9.9  
16  
10.1  
10.1  
16.5  
16.5  
1
OE  
CL = 50 pF  
CL = 50 pF  
ns  
ns  
4
SN74LV245AT  
OCTAL BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCLS605B–DECEMBER 2004–REVISED AUGUST 2005  
Noise Characteristics(1)  
VCC = 5 V, CL = 50 pF  
TA = 25°C  
UNIT  
PARAMETER  
Quiet output, maximum dynamic VOL  
Quiet output, minimum dynamic VOL  
MIN  
TYP  
1.1  
–1.1  
4
MAX  
1.5  
VOL(P)  
VOL(V)  
VOH(V)  
VIH(D)  
VIL(D)  
V
V
V
V
V
–1.5  
Quiet output, minimum dynamic VOH  
High-level dymanic input voltage  
Low-level dynamic input voltage  
2
0.8  
(1) Characteristics are for surface-mount packages only.  
Operating Characteristics  
VCC = 5 V, TA = 25°C  
PARAMETER  
TEST CONDITIONS  
TYP  
19  
UNIT  
Cpd  
Power dissipation capacitance  
Outputs enabled  
CL = 50 pF,  
f = 10 MHz  
pF  
5
SN74LV245AT  
OCTAL BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCLS605B–DECEMBER 2004–REVISED AUGUST 2005  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
S1  
Open  
GND  
R
L
= 1 kΩ  
TEST  
/t  
S1  
From Output  
Under Test  
Test  
Point  
From Output  
Under Test  
t
t
Open  
PLH PHL  
C
L
C
L
t
/t  
V
CC  
PLZ PZL  
(see Note A)  
(see Note A)  
/t  
GND  
PHZ PZH  
Open Drain  
V
CC  
LOAD CIRCUIT FOR  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
3-STATE AND OPEN-DRAIN OUTPUTS  
3 V  
0 V  
1.5 V  
Timing Input  
t
w
t
h
3 V  
t
su  
3 V  
0 V  
1.5 V  
1.5 V  
Input  
Input  
1.5 V  
1.5 V  
Data Input  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
3 V  
0 V  
3 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
0 V  
t
t
PZL  
PLZ  
t
t
t
PHL  
PLH  
Output  
Waveform 1  
≈V  
V
CC  
OH  
In-Phase  
Output  
50% V  
50% V  
50% V  
CC  
50% V  
CC  
CC  
V
S1 at V  
CC  
V
V
+ 0.3 V  
OL  
V
OL  
OL  
(see Note B)  
t
t
t
PZH  
PHZ  
PHL  
PLH  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
OH  
Out-of-Phase  
Output  
− 0.3 V  
OH  
50% V  
50% V  
CC  
CC  
CC  
V
≈0 V  
(see Note B)  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t ≤ 3 ns, t ≤ 3 ns.  
O
r
f
D. The outputs are measured one at a time, with one input transition per measurement.  
E.  
F.  
G.  
t
t
t
and t  
and t  
and t  
are the same as t  
.
dis  
.
PLZ  
PZL  
PHL  
PHZ  
are the same as t  
PZH  
en  
are the same as t .  
PLH pd  
H. All parameters and waveforms are not applicable to all devices.  
Figure 1. Load Circuits and Voltage Waveforms  
6
SN74LV245AT  
OCTAL BUS TRANSCEIVER  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCLS605B–DECEMBER 2004–REVISED AUGUST 2005  
MECHANICAL DATA  
7
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
PACKAGING INFORMATION  
Orderable Device  
SN74LV245ATDBR  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SSOP  
DB  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
20  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV245ATDBRE4  
SN74LV245ATDBRG4  
SN74LV245ATDGVR  
SN74LV245ATDGVRE4  
SN74LV245ATDGVRG4  
SN74LV245ATDW  
SSOP  
SSOP  
TVSOP  
TVSOP  
TVSOP  
SOIC  
DB  
DB  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DGV  
DGV  
DGV  
DW  
DW  
DW  
DW  
DW  
DW  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV245ATDWE4  
SN74LV245ATDWG4  
SN74LV245ATDWR  
SN74LV245ATDWRE4  
SN74LV245ATDWRG4  
SN74LV245ATNSR  
SOIC  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV245ATNSRE4  
SN74LV245ATNSRG4  
SN74LV245ATPW  
SO  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
QFN  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
PW  
RGY  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74LV245ATPWE4  
SN74LV245ATPWG4  
SN74LV245ATPWR  
SN74LV245ATPWRE4  
SN74LV245ATPWRG4  
SN74LV245ATPWT  
SN74LV245ATPWTE4  
SN74LV245ATPWTG4  
SN74LV245ATRGYR  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
70 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SN74LV245ATRGYRG4  
ACTIVE  
QFN  
RGY  
20  
1000 Green (RoHS & CU NIPDAU Level-2-260C-1 YEAR  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-May-2007  
TAPE AND REEL INFORMATION  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-May-2007  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
330  
330  
330  
330  
330  
180  
(mm)  
16  
SN74LV245ATDBR  
SN74LV245ATDGVR  
SN74LV245ATDWR  
SN74LV245ATNSR  
SN74LV245ATPWR  
SN74LV245ATRGYR  
DB  
DGV  
DW  
NS  
20  
20  
20  
20  
20  
20  
MLA  
MLA  
MLA  
MLA  
MLA  
MLA  
8.2  
7.0  
7.5  
5.6  
2.5  
1.6  
2.7  
2.5  
1.6  
1.6  
12  
8
16  
12  
24  
24  
16  
12  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
12  
24  
10.8  
8.2  
13.0  
13.0  
7.1  
12  
12  
8
24  
PW  
16  
6.95  
3.8  
RGY  
12  
4.8  
8
TAPE AND REEL BOX INFORMATION  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
SN74LV245ATDBR  
SN74LV245ATDGVR  
SN74LV245ATDWR  
SN74LV245ATNSR  
SN74LV245ATPWR  
SN74LV245ATRGYR  
DB  
DGV  
DW  
NS  
20  
20  
20  
20  
20  
20  
MLA  
MLA  
MLA  
MLA  
MLA  
MLA  
342.9  
338.1  
333.2  
333.2  
342.9  
190.0  
336.6  
340.5  
333.2  
333.2  
336.6  
212.7  
28.58  
20.64  
31.75  
31.75  
28.58  
31.75  
PW  
RGY  
Pack Materials-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-May-2007  
Pack Materials-Page 3  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°–ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°–ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°–8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this  
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily  
performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
applications using TI components. To minimize the risks associated with customer products and applications, customers should  
provide adequate design and operating safeguards.  
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask  
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services  
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such  
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under  
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.  
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is  
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an  
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties  
may be subject to additional restrictions.  
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service  
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business  
practice. TI is not responsible or liable for any such statements.  
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would  
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement  
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications  
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related  
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any  
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its  
representatives against any damages arising out of the use of TI products in such safety-critical applications.  
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are  
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military  
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is  
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in  
connection with such use.  
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products  
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any  
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.  
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:  
Products  
Amplifiers  
Data Converters  
DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
dsp.ti.com  
www.ti.com/audio  
Automotive  
Broadband  
Digital Control  
Military  
www.ti.com/automotive  
www.ti.com/broadband  
www.ti.com/digitalcontrol  
www.ti.com/military  
Interface  
interface.ti.com  
logic.ti.com  
Logic  
Power Mgmt  
Microcontrollers  
RFID  
power.ti.com  
Optical Networking  
Security  
www.ti.com/opticalnetwork  
www.ti.com/security  
www.ti.com/telephony  
www.ti.com/video  
microcontroller.ti.com  
www.ti-rfid.com  
www.ti.com/lpw  
Telephony  
Low Power  
Wireless  
Video & Imaging  
Wireless  
www.ti.com/wireless  
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265  
Copyright © 2007, Texas Instruments Incorporated  
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