HiPerFETTM Power MOSFETs
VDSS IDSS RDS(on)
trr
900 V 26 A 0.30 W 250 ns
900 V 25 A 0.33 W 250 ns
IXFK/IXFX26N90
IXFK/IXFX25N90
Single MOSFET Die
Preliminary data sheet
Symbol
TestConditions
MaximumRatings
PLUS 247TM (IXFX)
VDSS
VDGR
TJ = 25°C to 150°C
TJ = 25°C to 150°C; RGS = 1 MW
900
900
V
V
VGS
VGSM
Continuous
Transient
±20
±30
V
V
(TAB)
G
D
S
ID25
IDM
IAR
TC = 25°C
26N90
25N90
26N90
25N90
26N90
25N90
26
25
104
100
26
A
A
A
TO-264 AA (IXFK)
TC = 25°C, pulse width limited by TJM
TC = 25°C
25
G
(TAB)
D
S
EAR
EAS
TC = 25°C
TC = 25°C
64
3
mJ
J
G = Gate
D = Drain
S = Source
TAB = Drain
dv/dt
IS £ IDM, di/dt £ 100 A/ms, VDD £ VDSS
TJ £ 150°C, RG = 2 W
5
V/ns
Features
PD
TJ
TC = 25°C
560
W
• Internationalstandardpackages
• Low RDS (on) HDMOSTM process
• Ruggedpolysilicongatecellstructure
• UnclampedInductiveSwitching(UIS)
rated
-55 ... +150
°C
TJM
Tstg
150
-55 ... +150
°C
°C
• Lowpackageinductance
- easy to drive and to protect
• Fastintrinsicrectifier
TL
1.6 mm (0.063 in.) from case for 10 s
300
°C
Md
Mountingtorque
TO-264
0.4/6
Nm/lb.in.
Weight
PLUS 247
TO-264
6
10
g
g
Applications
• DC-DC converters
• Batterychargers
• Switched-modeandresonant-mode
powersupplies
• DC choppers
Symbol
TestConditions
CharacteristicValues
(TJ = 25°C, unless otherwise specified)
min. typ. max.
VDSS
VGS = 0 V, ID = 3mA
900
3.0
V
V
• ACmotorcontrol
• Temperatureandlightingcontrols
VGS(th)
IGSS
VDS = VGS, ID = 8mA
5.0
VGS = ±20 V, VDS = 0
±200 nA
100 mA
Advantages
• PLUS 247TM package for clip or spring
mounting
IDSS
VDS = 0.8 •VDSS
VGS = 0 V
TJ = 25°C
TJ = 125°C
2
mA
• Space savings
• Highpowerdensity
RDS(on)
VGS = 10 V, ID = 0.5 • ID25
Note 1
26N90
25N90
0.3
0.33
W
W
IXYS reserves the right to change limits, test conditions, and dimensions.
© 2000 IXYS All rights reserved
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