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5SMX12N4507

型号:

5SMX12N4507

描述:

IGBT -模具[ IGBT-Die ]

品牌:

ABB[ THE ABB GROUP ]

页数:

5 页

PDF大小:

74 K

VCE  
IC  
=
=
4500 V  
40 A  
IGBT-Die  
5SMX 12N4507  
x
Die size: 14.3 14.3 mm  
Doc. No. 5SYA1626-03 July 06  
· Low loss, rugged SPT technology  
· Smooth switching for good EMC  
· Emitter metallisation optimized for press-pack packaging  
· Passivation: SIPOS and Silicon Nitride plus Polyimide  
1)  
Maximum rated values  
Parameter  
Symbol Conditions  
min max Unit  
Collector-emitter voltage  
DC collector current  
Peak collector current  
Gate-emitter voltage  
VCES  
IC  
VGE = 0 V  
4500  
40  
V
A
A
V
ICM  
Limited by Tvjmax  
80  
VGES  
-20  
-40  
20  
VCC = 3400 V, VCEM £ 4500 V  
IGBT short circuit SOA  
Junction temperature  
tpsc  
Tvj  
10  
µs  
°C  
VGE £ 15 V, Tvj £ 125 °C  
125  
1)  
Maximum rated values indicate limits beyond which damage to the device may occur per IEC 60747 - 9  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
5SMX 12N4507  
2)  
IGBT characteristic values  
Parameter  
Symbol Conditions  
min typ max Unit  
Collector (-emitter)  
breakdown voltage  
V(BR)CES VGE = 0 V, IC = 1 mA, Tvj = 25 °C  
4500  
V
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
3.0  
4.0  
V
V
Collector-emitter  
saturation voltage  
VCE sat  
IC = 40 A, VGE = 15 V  
100  
µA  
µA  
nA  
V
Collector cut-off current  
ICES  
VCE = 4500 V, VGE = 0 V  
2500  
Gate leakage current  
Gate-emitter threshold voltage  
Gate charge  
IGES  
VGE(TO)  
Qge  
-500  
5.5  
500  
7.5  
VCE = 0 V, VGE = ±20 V, Tvj = 125 °C  
IC = 10 mA, VCE = VGE, Tvj = 25 °C  
IC = 40 A, VCE = 2800 V, VGE = -15 ..15 V  
500  
7.45  
0.28  
0.07  
5
nC  
Input capacitance  
Cies  
VCE = 25 V, VGE = 0 V, f = 1 MHz,  
Tvj = 25 °C  
nF  
Output capacitance  
Coes  
Cres  
Reverse transfer capacitance  
Internal gate resistance  
RGint  
W
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
Tvj = 25 °C  
Tvj = 125 °C  
160  
155  
100  
105  
630  
715  
425  
455  
VCC = 2800 V, IC = 40 A,  
RG = 33 W, VGE = ±15 V,  
Ls = 6000 nH,  
Turn-on delay time  
Rise time  
td(on)  
ns  
tr  
ns  
ns  
ns  
inductive load  
VCC = 2800 V, IC = 40 A,  
RG = 33 W, VGE = ±15 V,  
Ls = 6000 nH,  
Turn-off delay time  
Fall time  
td(off)  
tf  
inductive load  
VCC = 2800 V, IC = 40 A,  
VGE = ±15 V, RG = 33 W,  
Ls = 6000 nH,  
Tvj = 25 °C  
Tvj = 125 °C  
55  
85  
Turn-on switching energy  
Turn-off switching energy  
Eon  
mJ  
inductive load,  
FWD: ½ 5SLX12N4506  
VCC = 2800 V, IC = 40 A,  
VGE = ±15 V, RG = 33 W,  
Ls = 6000 nH,  
Tvj = 25 °C  
Tvj = 125 °C  
165  
205  
200  
Eoff  
mJ  
A
inductive load  
tpsc 10 μs, VGE = 15 V, Tvj = 125 °C,  
Short circuit current  
ISC  
VCC = 3400 V, VCEM 4500 V  
2)  
Characteristic values according to IEC 60747 - 9  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
Doc. No. 5SYA1626-03 July 06  
page 2 of 5  
5SMX 12N4507  
Unit  
Mechanical properties  
Parameter  
x
x
L W  
14.3 14.3  
Overall die  
mm  
mm  
mm  
exposed  
front metal  
x
x
L W (except gate pad)  
9.0 9.0  
Dimensions  
x
x
L W  
1.51 1.48  
gate pad  
thickness  
front (E)  
back (C)  
530 ± 20  
4 + 8  
µm  
µm  
µm  
AlSi1 + Al  
3)  
Metallization  
AlSi1 + TiNiAg  
1.8 + 1.2  
3)  
For assembly instructions refer to : IGBT and Diode chips from ABB Switzerland Ltd, Semiconductors, Doc. No. 5SYA 2033.  
Outline drawing  
Note: all dimensions are shown in mm  
This is an electrostatic sensitive device, please observe the international standard IEC 60747-1, Chap. IX.  
This product has been designed and qualified for Industrial Level.  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
Doc. No. 5SYA1626-03 July 06  
page 3 of 5  
5SMX 12N4507  
80  
70  
60  
50  
40  
30  
20  
10  
0
80  
70  
60  
50  
40  
30  
20  
10  
0
VCE = 20 V  
25 °C  
125 °C  
125 °C  
25 °C  
VGE = 15 V  
6
0
1
2
3
4
5
7
0
1
2
3
4
5
6
7
8
9
10 11 12 13  
VCE [V]  
VGE [V]  
Fig. 1  
Typical onstate characteristics  
Fig. 2  
Typical transfer characteristics  
0.3  
0.4  
VCC = 2800 V  
RG = 33 ohm  
VGE = ±15 V  
Tvj = 125 °C  
Ls = 6 µH  
0.35  
0.3  
0.25  
0.2  
0.15  
0.1  
0.05  
0
Eoff  
0.25  
0.2  
Eoff  
Eon  
0.15  
0.1  
Eon  
VCC = 2800 V  
IC = 40 A  
VGE = ±15 V  
Tvj = 125 °C  
Ls = 6 µH  
0.05  
0
0
20  
40  
60  
80  
100  
0
50  
100  
150  
200  
250  
IC [A]  
RG [ohm]  
Typical switching characteristics vs  
collector current  
Typical switching characteristics vs  
gate resistor  
Fig. 3  
Fig. 4  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
Doc. No. 5SYA1626-03 July 06  
page 4 of 5  
5SMX 12N4507  
10  
20  
Cies  
VGE = 0 V  
VCC = 2800 V  
fOSC = 1 MHz  
VOSC = 50 mV  
15  
1
VCC = 3400 V  
Coes  
10  
Cres  
0.1  
5
0
IC = 40 A  
Tvj = 25 °C  
0.01  
0.0  
0.1  
0.2  
0.3  
0.4  
0.5  
0
5
10  
15  
20  
25  
30  
35  
VCE [V]  
Qg [µC]  
Fig. 5  
Typical gate charge characteristics  
Fig. 6  
Typical capacitances vs  
collector-emitter voltage  
ABB Switzerland Ltd, Semiconductors reserves the right to change specifications without notice.  
ABB Switzerland Ltd  
Semiconductors  
Doc. No. 5SYA1626-03 July 06  
Fabrikstrasse 3  
CH-5600 Lenzburg, Switzerland  
Telephone +41 (0)58 586 1419  
Fax  
+41 (0)58 586 1306  
Email  
Internet  
abbsem@ch.abb.com  
www.abb.com/semiconductors  
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