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QVE00033

型号:

QVE00033

描述:

光电晶体管光表面贴装断路器开关[ PHOTOTRANSISTOR OPTICAL SURFACE MOUNT INTERRUPTER SWITCH ]

品牌:

FAIRCHILD[ FAIRCHILD SEMICONDUCTOR ]

页数:

6 页

PDF大小:

489 K

PHOTOTRANSISTOR OPTICAL  
SURFACE MOUNT INTERRUPTER SWITCH  
QVE00033  
PACKAGE DIMENSIONS  
0.016 (0.40)  
center of light path  
0.049 (1.25)  
0.079 (2.00)  
0.159 (4.05)  
0.165 (4.2)  
SECTION "A-A"  
0.276 (7.00)  
0.240 (6.10)  
"A"  
0.146 (3.70)  
0.213 (5.40)  
SCHEMATIC  
DIMPLE  
0.010 (0.25)  
(4X)  
"A"  
1
4
RIGHT VIEW  
0.295 (7.50)  
ANODE  
COLLECTOR  
0.099 (2.50)  
EMITTER  
0.020 (0.50) (4X)  
CATHODE  
BOTTOM VIEW  
NOTES:  
2
3
1. Dimensions for all drawings are in inches (millimeters).  
DESCRIPTION  
The QVE00033 is a miniature slotted optical switch designed for surface mount applications. It consists of a GaAs LED and a sili-  
con phototransistor facing each other across a 2mm gap, and packaged in a temperature resistant black plastic housing.  
FEATURES  
• No contact switching  
Transistor Output  
• Compact surface mount package  
• Opaque black plastic housing  
• 2mm wide slot  
• 0.4 mm aperture width  
Tape and reel  
• Reflow conditions:  
Preheat = 160°C for 120 seconds  
Reflow = 200°C for 60 seconds (peak = 240°C)  
• HL-94V-0 housing  
© 2003 Fairchild Semiconductor Corporation  
Page 1 of 6  
3/19/03  
PHOTOTRANSISTOR OPTICAL  
SURFACE MOUNT INTERRUPTER SWITCH  
QVE00033  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise specified)  
A
Parameter  
Symbol  
Rating  
Units  
T
Operating Temperature  
-55 to +100  
-55 to +100  
240 for 5 sec  
260 for 10 sec  
100  
°C  
°C  
OPR  
T
Storage Temperature  
STG  
T
Soldering Temperature (Iron)(2,3,4)  
Soldering Temperature (Flow)(2,3)  
Total Power Dissipation  
°C  
SOL-I  
T
°C  
SOL-F  
P
mW  
TOT  
EMITTER  
I
Continuous Forward Current  
50  
6
mA  
V
F
V
Reverse Voltage  
R
P
Power Dissipation(1)  
75  
mW  
D
SENSOR  
V
Collector-Emitter Voltage  
30  
4.5  
20  
75  
V
V
CEO  
V
Emitter-Collector Voltage  
Collector Current  
ECO  
I
mA  
mW  
C
P
Power Dissipation(1)  
D
ELECTRICAL/OPTICAL CHARACTERISTICS (T = 25°C unless otherwise specified)  
A
PARAMETER  
TEST CONDITIONS  
SYMBOL  
MIN  
TYP  
MAX  
UNITS  
EMITTER  
I = 20 mA  
V
Forward Voltage  
1.2  
1.4  
10  
V
F
F
V = 4 V  
I
Reverse Current  
µA  
nm  
R
R
I = 20 mA  
l
Peak Emission Wavelength  
940  
F
PE  
SENSOR  
V
= 20 V, I = 0 mA  
I
Dark Current  
100  
nA  
CE  
F
CEO  
COUPLED  
I = 5 mA, V = 5 V  
I
Collector Current  
Collector Emitter  
100  
7
600  
0.4  
µA  
V
F
CE  
C(ON)  
I = 10 mA, I = 40 µA  
V
F
C
CE (SAT)  
V
= 5 V, R = 1000 Ω  
t
Rise Time  
Fall Time  
150  
150  
µs  
µs  
CC  
L
r
I = 100 µA  
t
7
C
f
NOTES  
1. Derate power dissipation linearly 1.67 mW/°C above 25°C.  
2. RMA flux is recommended.  
3. Methanol or isopropyl alcohols are recommended as cleaning agents.  
4. Soldering iron tip 1/16" (1.6mm) from housing.  
© 2003 Fairchild Semiconductor Corporation  
Page 2 of 6  
3/19/03  
PHOTOTRANSISTOR OPTICAL  
SURFACE MOUNT INTERRUPTER SWITCH  
QVE00033  
TA=25°C  
IF=5mA  
TA=25°C  
IF=5mA  
1.0  
1.0  
.8  
Normalized to  
value with shield  
removed  
V
CE=5V  
V
CE=5V  
Normalized to  
value with shield  
removed  
.8  
.6  
.6  
Black Shield  
.4  
.4  
Black Shield  
+
E
D
+
d2  
0
d1  
0
.2  
.2  
0.0  
0.0  
0
1
2
3
4
0
1
2
3
4
d1-Shield Distance (mm)  
d2-Shield Distance (mm)  
Figure 2. Normalized Collector Current Vs. Shield Distance  
Figure 1. Normalized Collector Current Vs. Shield Distance  
18  
16  
14  
12  
10  
1.4  
T =25°C  
A
IF=20mA  
1.2  
1.0  
.8  
T =25°C  
A
V
8
6
4
2
0
.6  
=5V  
CE  
Normalized to  
I =5mA  
IF=10mA  
.4  
F
IF=5mA  
.2  
IF=1mA  
0.0  
0
2
4
6
8
10  
12  
0
10  
20  
IF-Forward Current (mA)  
Figure 4. Normalized Collector Current Vs. Forward Current  
30  
40  
50  
VCE (V)  
Figure 3. Collector Current Vs. Collector-Emitter Voltage  
8
T =25°C  
A
1.0  
.8  
PW=300µs  
PRR=100µs  
VCC=5V  
T(on)  
6
T(off)  
Normalized  
to RL=1k  
T =25°C  
A
4
2
0
PW=300µs  
PRR=100µs  
VCC=5V  
.6  
.4  
.2  
Normalized  
to RL=1k  
0
2
4
6
8
10  
0
2
4
6
8
10  
RL (k)  
Figure 5. Rise Time vs. Load Resistance  
RL (k)  
Figure 6. Fall Time vs. Load Resistance  
© 2003 Fairchild Semiconductor Corporation  
Page 3 of 6  
3/19/03  
PHOTOTRANSISTOR OPTICAL  
SURFACE MOUNT INTERRUPTER SWITCH  
QVE00033  
RECOMMENDED PRINTED CIRCUIT BOARD PATTERN (For Reference Only)  
6mm  
2.5mm  
R=.1mm  
.5mm  
Typ  
1.9mm  
Typ  
© 2003 Fairchild Semiconductor Corporation  
Page 4 of 6  
3/19/03  
PHOTOTRANSISTOR OPTICAL  
SURFACE MOUNT INTERRUPTER SWITCH  
QVE00033  
TAPE AND REEL DIMENSIONS  
0.65 [16.5]  
R0.24 [R6.0]  
0.24 [6.00]  
R6.5 [R165.0]  
R6.3 [R160.0]  
B
R0.31 [R8.0]  
3.94 [100.0]  
Ø3.54 [Ø90.0]  
R1.97 [R50.0]  
R2.17 [R55.0]  
R5.16 [R131.0]  
0.83 [21.10]  
0.09 [2.3]  
R0.27 0.047 [R6.75 1.20]  
0.43 [10.75]  
VIEW B  
0.256 [6.50] Max  
A
0.059 [1.50]  
0.30 [7.60]  
0 [0] min  
0.157 [4.00]  
Ø0.059 MIN  
0.069 [1.75]  
0.232 [5.90]  
0.014 [0.35]  
0.295 [7.50]  
0.476 [12.10]  
Max  
0.630 [16.00]  
0.005  
[0.127] max  
0.185  
[4.70]  
0.079 [2.00]  
DIMPLE  
0.472 [12.00]  
0.378 [9.60] Max  
ANODE (PIN1)  
FACING SPROCKET HOLE  
0.213  
[5.40]  
COVER TAPE  
USER DIRECTION  
EMBOSSMENT  
Quantitiy of units per reel is 800.  
QVE00033 ASSEMBLY  
VIEW A  
SCALE: 2:1  
UNIT IN CAVITY  
© 2003 Fairchild Semiconductor Corporation  
Page 5 of 6  
3/19/03  
PHOTOTRANSISTOR OPTICAL  
SURFACE MOUNT INTERRUPTER SWITCH  
QVE00033  
DISCLAIMER  
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO  
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME  
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;  
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.  
LIFE SUPPORT POLICY  
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES  
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and (c) whose failure to perform  
when properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to  
result in a significant injury of the user.  
2. A critical component in any component of a life support  
device or system whose failure to perform can be  
reasonably expected to cause the failure of the life support  
device or system, or to affect its safety or effectiveness.  
© 2003 Fairchild Semiconductor Corporation  
Page 6 of 6  
3/19/03  
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