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QTS-025-01-H-D-EM2

型号:

QTS-025-01-H-D-EM2

品牌:

SAMTEC[ SAMTEC ]

页数:

1 页

PDF大小:

154 K

REVISION M  
QTS-XXX-01-XXX-D-EMX-XX  
No OF POSITIONS  
OPTION  
-025, -050, -075,  
**-100, **-125  
(PER ROW)  
-TY: TRAY PACKAGING  
DO NOT  
SCALE FROM  
THIS PRINT  
**SEE NOTE 12  
EDGE MOUNT THICKNESS  
* = SEE NOTE 11  
-EM2: .064[1.63] +/-.004 PCB  
(USE QTS-25-01-D-EM2-XX &  
T-1S42-01-XXX)  
LEAD STYLE  
-01: .1680[4.267]  
-EM3:  
((NO OF POS / 25) x .7875 [20.003]) + .390 [9.91] REF  
(USE QTS-25-01-D-EM3-XX &  
T-1S42-02-XXX)  
PLATING SPECIFICATION  
-F: FLASH SELECTIVE GOLD WITH MATTE TIN TAILS  
(USE T-1S42-XX-F & T-1G1-01-F)  
SEE NOTE 11  
C5  
[SEE NOTE 7]  
-L: LIGHT SELECTIVE GOLD WITH MATTE TIN TAILS  
(USE T-1S42-XX-L & T-1G1-01-L)  
(No OF POSITIONS / 25) x .7875[20.003] REF  
ROW SPECIFICATION  
-D: DOUBLE  
(USE QTS-25-XX-D-EMX-XX)  
-H: HEAVY GOLD  
(USE T-1S42-XX-H & T-1G1-01-G)  
-FTL: FLASH SELECTIVE GOLD,  
TIN/LEAD TAIL (USE T-1S42-XX-FTL & T-1G1-01-FTL)  
-STL: SELECTIVE GOLD,  
.7875 20.003 REF  
01  
No OF BANKS  
TIN/LEAD TAIL (USE T-1S42-XX-STL & T-1G1-01-STL)  
.2350 5.969  
.1550 3.94 REF  
REF  
02  
QTS-25-01-D-EMX-XX  
.6440 16.36 REF  
.0325 0.826 REF  
24 EQ SPACES  
@ .0250 [.635]  
C3  
T-1S42-XX-XXX  
T-1G1-01-XXX  
"A"  
.7450 18.92 REF  
.1680 4.267  
(SEE NOTE 5)  
.1600 4.06 REF  
.1290 3.277  
C2  
.2782 7.07  
REF  
.1750 4.45  
SEE TABLE 2  
C4  
C1  
.118 3.00  
.152 3.86 REF  
REF  
"A"  
.0080 0.203  
REF  
"B"±.0030 1.626±0.076  
"A" REF  
(INSIDE TO INSIDE OF PIN)  
.1288 3.270  
2
MAX SWAY  
(TYP)  
.1400 3.56 REF  
.015 0.38 REF  
"C" REF  
.0400 1.02 REF  
SECTION "A"-"A"  
NOTES:  
C
1.  
REPRESENTS A CRITICAL DIMENSION.  
2. BURR ALLOWANCE: .0015 [.038]MAX.  
3. MINIMUM PUSHOUT FORCE: 6 OZ.  
4. MINIMUM GROUND PLANE RETENTION: 1 LB.  
5. MAXIMUM VARIANCE: .002 [.05].  
UNLESS OTHERWISE SPECIFIED,  
PROPRIETARY NOTE  
DIMENSIONS ARE IN INCHES.  
TOLERANCES ARE:  
THIS DOCUMENT CONTAINS INFORMATION  
CONFIDENTIAL AND PROPRIETARY TO  
6. PARTS TO BE MOLDED TO POSITION.  
SAMTEC, INC. AND SHALL NOT BE REPRODUCED  
OR TRANSFERRED TO OTHER DOCUMENTS OR  
DISCLOSED TO OTHERS OR USED FOR ANY  
PURPOSE OTHER THAN THAT WHICH IT WAS  
OBTAINED WITHOUT THE EXPRESSED WRITTEN  
CONSENT OF SAMTEC, INC.  
7. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING (TERMINAL).  
8. NOTE DELETED.  
DECIMALS  
ANGLES  
2
.XX: .01[.3]  
.XXX: .005[.13]  
.XXXX: .0020[.051]  
520 PARK EAST BLVD, NEW ALBANY, IN 47150  
PHONE: 812-944-6733 FAX: 812-948-5047  
e-Mail: info@SAMTEC.com code: 55322  
9. BOARD THICKNESS TO BE MEASURED FROM SOLDER PAD TO SOLDER PAD.  
10. SEE www.samtec.com/processing/edgemt_tectalk/index.htm FOR  
PROCESSING EDGE MOUNT PARTS TO BOARD.  
SHEET SCALE: 1.5:1  
MATERIAL:  
DO NOT SCALE DRAWING  
DESCRIPTION:  
11. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY. PLEASE CONTACT SAMTEC  
INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES  
.635mm EDGE MOUNT HS TERMINAL ASSEMBLY  
INSULATOR: LCP, COLOR: BLACK  
TERMINAL: PHOS BRONZE  
GROUND PLANE: PHOS BRONZE  
DWG. NO.  
12. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT SAMTEC  
INTERCONNECT PROCESSING GROUP.  
QTS-XXX-01-XXX-D-EMX-XX  
P
13. PARTS WITHOUT -TY OPTION SHALL BE PACKAGED IN TRAYS.  
BY:  
DEAN P  
4/24/2000  
SHEET 1 OF 1  
F:\DWG\MISC\MKTG\QTS-XXX-01-XXX-D-EMX-XX-MKT.SLDDRW  
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