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IXD1233H221MR-G

型号：

IXD1233H221MR-G

品牌：

IXYS[ IXYS CORPORATION ]

页数：

23 页

PDF大小：

2830 K

下载PDF手册
IXD1233  
High Speed LDO Regulator with Inrush Current Prevention  
FEATURES  
o
o
Operating Voltage Range 1.7 V – 5.5 V  
DESCRIPTION  
Output Voltage Range from 1.2 V to 3.6 V with  
0.05 V increments  
The IXD1233 are a 200 mA highly precise, high  
speed, low dropout voltage regulators with 75 dB @  
1 kHz ripple rejection. They consist of a voltage  
reference, an error amplifier, a current limiter with  
inrush current prevention, a phase compensation  
circuit, and a driver transistor.  
o
o
o
o
o
o
o
o
o
o
o
o
Output Voltage Accuracy ±1%  
Output Current up to 200 mA  
Dropout Voltage 240 mV @ 200 mA  
Low Power Consumption at 45 µA typical  
Standby Current less than 0.1 µA typical  
Ripple Rejection 75 dB at 1 kHz  
Output voltage is selectable in 0.05V increments  
within a range of 1.2 V ~ 3.6 V with ± 1% accuracy.  
Load Capacitor Auto Discharge  
The IXD1233 are compatible with low ESR ceramic  
capacitors, and due excellent transient response,  
they maintain stability even during significant load  
fluctuations. The current limiter's foldback circuit  
operates also as a short circuit protection.  
Current Limit and Short Circuit Protection  
Low ESR Ceramic Capacitor compatible  
Operating Ambient Temperature - 40 + 850C  
Packages : SOT-25, SSOT-24, and USP-4  
EU RoHS Compliant, Pb Free  
The chip enable (CE) function allows disable IC,  
greatly  
reducing  
power  
consumption  
and  
APPLICATIONS  
simultaneously discharge load capacitor to prevent  
load malfunction.  
o
o
o
o
Mobile phones  
Regulator is available in SOT-25, SSOT-24, and  
USP-4 packages.  
Cameras, VCRs  
Various portable equipment  
Reference voltage source  
TYPICAL APPLICATION CIRCUIT  
TYPICAL PERFORMANCE CHARACTERISTIC  
Inrush Current Limit  
CIN = CL = 1.0 µF (ceramic), VIN = 2.8 V, VOUT = 1.8 V, VCE = 0 V → 2.8 V, tr = 5 µs,  
Ta = 250C  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
1
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
Input Voltage  
SYMBOL  
RATINGS  
– 0.3 ~ +6.0  
UNITS  
VIN  
IOUT  
VOUT  
VCE  
V
mA  
V
Output Current  
Output Voltage  
CE Input Voltage  
2751)  
– 0.3 ~ VIN + 0.3 or +6.0 V2)  
– 0.3 ~ +6.0  
V
SOT-25  
SSOT-24  
USP-4  
600 (PCB mounted)  
500 (PCB mounted)  
1000 (PCB mounted)  
– 40 ~ + 85  
Power Dissipation2)  
PD  
mW  
Operating Temperature Range  
Storage Temperature Range  
TOPR  
TSTG  
0C  
0C  
– 55 ~ +125  
All voltages are in respect to VSS  
1)  
IOUT ≤ Pd/ (VIN-VOUT)  
2) The lowest value between VIN + 0.3 and 6.0 V  
3) This is a reference data taken by using the test board. Please refer to page 18 to 20 for details  
ELECTRICAL OPERATING CHARACTERISTICS  
Ta = 25 0C  
PARAMETER  
SYMBOL  
CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
CIRCUIT  
VOUT(T)  
0.99  
VOUT(T)  
0.02  
x
VOUT(T)  
1.01  
x
*
*
VOUT(T) ≥ 2 V3)  
VOUT(T)  
Output Voltage 1)  
VOUT(E)  
V
Å
-
VOUT(T)  
0.02  
+
VOUT(T) < 2 V3)  
VOUT(T)  
Maximum Output Current  
Load Regulation  
IOUT_MAX  
∆VOUT  
VDIF1  
200  
mA  
mV  
mV  
µA  
Å
Å
Å
Ç
Ç
0.1 mA ≤ IOUT ≤ 200 mA  
IOUT = 200 mA  
IOUT = 0 mA  
25  
E-14)  
45  
45  
Dropout Voltage2)  
Supply Current  
ISS  
87  
Standby Current  
ISTB  
VCE = 0 V  
0.01  
0.10  
µA  
∆ꢀꢁꢂꢃ  
IOUT = 30 mA, VOUT(T) + 0.5 V ≤ VIN ≤ 5.5 V,  
if VOUT(T) ≥ 2 V, or 2.5 V ≤ VIN ≤ 5.5 V  
Line Regulation  
0.02  
0.10  
5.5  
%/V  
Å
Å
Å
ꢀꢁꢂꢃ ꢄ ∆ꢀ  
VIN  
∆ꢀꢁꢂꢃ  
ꢅꢆ  
Input Voltage  
1.7  
V
Output Voltage Temperature  
Characteristics  
IOUT = 30 mA  
± 80  
75  
ppm/0C  
- 40 0C ≤ TOPR ≤ 85 0C  
ꢀꢁꢂꢃ ꢄ ∆ꢇꢁꢈꢉ  
VIN = (VOUT(T) + 1.0 V) + 1 Vp-pAC;, when  
V
OUT(T) < 2.5 V, VIN = 3.0 V + 0.5 Vp-pAC  
VCE = VOUT(T) + 1.0 V, IOUT = 30 mA,  
f = 1 kHz  
,
Power Supply Rejection Ratio  
PSRR  
dB  
É
Current Limit  
Short Current  
ILIM  
ISHORT  
VCEH  
VCEL  
ICEH  
200  
60  
255  
mA  
mA  
V
Å
Å
Å
Å
Å
Å
Å
Ñ
VOUT = VSS  
CE “H” Level Voltage  
CE “L” Level Voltage  
CE “H” Level Current  
CE “L” Level Current  
CL Discharge Resistance  
Inrush Current  
0.9  
VIN  
0.3  
9.5  
0.1  
V
VCE = VIN = 5.5 V  
VCE = VSS  
2.5  
6.0  
µA  
µA  
Ω
ICEL  
-0.1  
RDCH  
IR  
VIN = 5.5 V, VCE = 0 V, VOUT = 2 V  
VIN = 5.5 V, VCE = 0 V → 5.5 V  
270  
95  
mA  
NOTE:  
Unless otherwise stated, VIN = VCE = VOUT (T) +1.0 V. IOUT = 1 mA  
1) VOUT (T) is Nominal output voltage and VOUT (E) is Effective output voltage, (I.e. the output voltage when "VOUT (T) +1.0V" is provided at the  
VIN pin, while maintaining a certain IOUT value).  
2) VDIF = {VIN-VOUT}, where VIN1 is the input voltage when VOUT = 0.98 VOUT(T) appears, while input voltage gradually decreases  
3) Refer to the Table “Voltage Chart. Output Voltage”  
4) Refer to the Table “Voltage Chart, Dropout Voltage”  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
2
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
ELECTRICAL OPERATING CHARACTERISTICS (CONTINUED)  
Voltage Chart  
E-0  
E-1  
E-0  
E-1  
NOMINAL  
OUTPUT  
VOLTAGE  
VOUT(T), V  
1.20  
NOMINAL  
OUTPUT  
VOLTAGE  
VOUT(T), V  
2.50  
Output Voltage  
VOUT(E), V  
Dropout Voltage  
VDIF, V  
Output Voltage  
VOUT(E), V  
Dropout Voltage  
VDIF, V  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
1.1800  
1.2300  
1.2800  
1.3300  
1.3800  
1.4300  
1.4800  
1.5300  
1.5800  
1.6300  
1.6800  
1.7300  
1.7800  
1.8300  
1.8800  
1.9300  
1.9800  
2.0295  
2.0790  
2.1285  
2.1780  
2.2275  
2.2770  
2.3265  
2.3760  
2.4255  
1.2200  
1.2700  
1.3200  
1.3700  
1.4200  
1.4700  
1.5200  
1.5700  
1.6200  
1.6700  
1.7200  
1.7700  
1.8200  
1.8700  
1.9200  
1.9700  
2.0200  
2.0705  
2.1210  
2.1715  
2.2220  
2.2725  
2.3230  
2.3735  
2.4240  
2.4745  
2.4750  
2.5245  
2.5740  
2.6235  
2.6730  
2.7225  
2.7720  
2.8215  
2.8710  
2.9205  
2.9700  
3.0195  
3.0690  
3.1185  
3.1680  
3.2175  
3.2670  
3.3165  
3.3660  
3.4155  
3.4650  
3.5145  
3.5640  
2.5250  
2.5755  
2.6260  
2.6765  
2.7270  
2.7775  
2.8280  
2.8785  
2.9290  
2.9795  
3.0300  
3.0805  
3.1310  
3.1815  
3.2320  
3.2825  
3.3330  
3.3835  
3.4340  
3.4845  
3.5350  
3.5855  
3.6360  
680  
950  
1.25  
1.30  
1.35  
1.40  
1.45  
1.50  
1.55  
1.60  
1.65  
1.70  
1.75  
1.80  
1.85  
1.90  
1.95  
2.00  
2.05  
2.10  
2.15  
2.20  
2.25  
2.30  
2.35  
2.40  
2.55  
2.60  
2.65  
2.70  
2.75  
2.80  
2.85  
2.90  
2.95  
3.00  
3.05  
3.10  
3.15  
3.20  
3.25  
3.30  
640  
600  
800  
695  
310  
420  
510  
400  
630  
600  
240  
380  
3.35  
3.40  
3.45  
3.50  
3.55  
3.60  
375  
520  
2.45  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
3
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
PIN CONFIGURATION  
*The dissipation pad for the USP-3  
package should be solder-plated in  
recommended mounting pattern and  
metal masking to enhance mounting  
strength and heat release.  
If the pad needs to be connected to  
other pins, it should be connected to the  
V
SS (No.2) pin.  
SOT-25 (TOP VIEW)  
SSOT-24 (TOP VIEW)  
USP-4 (BOTTOM VIEW)  
PIN ASSIGNMENT  
PIN NUMBER  
SSOT-24  
PIN NAME  
FUNCTIONS  
USP-4  
SOT-25  
1
2
3
4
5
4
2
1
-
4
2
3
-
VIN  
VSS  
CE  
NC  
VOUT  
Power Input  
Ground  
ON/OFF Control LOW or OPEN – Standby mode, HIGH - Active  
No Connection  
Output Voltage  
3
1
BLOCK DIAGRAM  
IXD1233H  
Diodes inside the circuits are ESD protection diodes and parasitic diodes.  
BASIC OPERATION  
The Error Amplifier of the IXD1233 series monitors output voltage divided by internal resistors R1 & R2 and  
compares it with the internal Reference Voltage (see Block Diagram above). The output signal from error amplifier  
drives gate of the P-channel MOSFET, which is connected to the VOUT pin and operates as a series voltage  
regulator.  
The Current Limit and Short Protection circuits monitor level of the output current. The CE pin allows shutdown  
internal circuitry to minimize power consumption.  
Low ESR Capacitors  
An internal phase compensation circuit guarantees stable IXD1233 operation even if output capacitors with low  
ESR are used. However, connect the output capacitor CL as close to the VOUT and the VSS pins as possible to  
prevent effectiveness of the phase compensation from degrade. The CL capacitance value should be at least 1µF.  
In case the capacitor depends on the bias and temperature, make sure that actual capacitance is maintained at  
operating voltage and temperature range. In addition, an input capacitor CIN ≥ 0.1µF between the VIN and VSS pins  
should be used to ensure a stable input power.  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
4
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
Current Limiter, Short-Circuit Protection  
The IXD1233 series include a combination of a fixed current limiter circuit & a foldback circuit, which aid the  
operations of the current limiter and circuit protection. When the load current reaches the current limit level, the  
fixed current limiter circuit activates and output voltage drops. Because of this drop, the foldback circuit activates  
too, and output voltage drops further decreasing output current. When the output pin is shorted, a current of about  
60 mA flows.  
CE Pin  
The CE pin allows shutdown internal circuitry to minimize power consumption. In shutdown mode, output at the  
VOUT pin is pulled down to the VSS level via RDCH resistor and N-channel switch.  
Note that the IXD1233 CE input is active HIGH with pull down resistor. IC will be in shutdown mode, if CE pin is  
open.  
CL High-speed Discharge Function  
The N-channel transistor located between VOUT and VSS pins quickly discharge the output capacitor (CL), when the  
CE pin does low. The discharge time of the output capacitor (CL) is set by the CL auto-discharge resistance RDCH  
=
270 Ω (TYP.) and the output capacitance (CL).  
Time constant τ = CL x RDCH determines the output voltage after discharge as  
V = VOUT (E) × e-t/τ  
where: V OUT (E) - Output voltage, and t - Discharge time  
Discharge time can be calculated also by the next formula:  
t =τ x ln (VOUT (E)/V)  
Inrush Current Prevention  
The IXD1233 has a build-in inrush current prevention circuit. When the IC starts to operate, the circuit limits inrush  
current at 95 mA (TYP.) to charge CL capacitor. However, the device cannot provide output current above this value  
for approximately 100 µs because of function of this limiter.  
TYPICAL APPLICATION CIRCUIT  
The output capacitor CL ≥ 1 µF should be connected between the output pin (VOUT) and the VSS pin for stable regulator’s operation.  
Ceramic capacitors with low ESR are recommended.  
LAYOUT AND USE CONSIDERATIONS  
1. Mount external component as close to the IC as possible and use thick, short connecting traces to  
reduce the circuit impedance.  
2. The IC may malfunction if absolute maximum ratings are exceeded.  
3. If power source of this regulator is a high impedance device with impedance of 10 Ω or more, an input  
capacitor CIN ≥ 1µF should be used to prevent oscillations.  
4. In case of high output current, increasing the input capacitor value can stabilize operations.  
5. Oscillations may occur also, if the input capacitor value is not enough to reduce the input impedance  
and the output capacitor CL is large. In such case, operations can be stabilized by either increasing the  
input capacitor or reducing the output capacitor.  
6. During start-up, IC provides constant current until VOUT = VOUT (T)  
.
7. Please ensure that output current IOUT is less than PD / (VIN - VOUT), where PD is a rated power  
dissipation value of the package shown at ABSOLUTE MAXIMUM RATING table to not exceed it.  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
5
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
TEST CIRCUITS  
Circuit Å  
Circuit Ç  
Circuit É  
Circuit Ñ  
VIN  
=
VOUT + 1.0 VDC + 0.5 Vp-pAC, if  
VOUT ≤ 2.5 V, VIN =  
3.0 VDC + 0.5 Vp-pAC  
TYPICAL PERFORMANCE CHARACTERISTICS  
(1) Output Voltage vs. Output Current  
CIN = CL = 1 µF (ceramic), VIN = 2.2 V, VOUT = 1.2 V  
CIN = CL = 1 µF (ceramic), VIN = 2.2 V, VOUT = 1.2 V, Ta = 250C  
CIN = CL = 1 µF (ceramic), VIN = 2.8 V, VOUT = 1.8 V  
CIN = CL = 1 µF (ceramic), VIN = 2.8 V, VOUT = 1.8 V, , Ta = 250C  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
6
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(1) Output Voltage vs Output Current (Continue)  
Topr = 25 0C  
CIN = CL = 1 µF (ceramic), VIN = 3.5 V, VOUT = 2.5 V  
CIN = CL = 1 µF (ceramic), VIN = 3.5 V, VOUT = 2.5 V, , Ta = 250C  
CIN = CL = 1 µF (ceramic), VIN = 4.3 V, VOUT = 3.3 V  
CIN = CL = 1 µF (ceramic), VIN = 4.3 V, VOUT = 3.3 V, , Ta = 250C  
(2) Output Voltage vs. Input Voltage  
CIN = CL = 1 µF (ceramic), VOUT = 1.2 V, Ta = 250C  
CIN = CL = 1 µF (ceramic), VOUT = 1.2 V, Ta = 250C  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
7
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(2) Output Voltage vs. Input Voltage (Continue)  
Topr = 25 0C  
CIN = CL = 1 µF (ceramic), VIN = 2.8 V, VOUT = 1.8 V  
CIN = CL = 1 µF (ceramic), VIN = 3.5 V, VOUT = 2.5 V  
CIN = CL = 1 µF (ceramic), VIN = 4.3 V, VOUT = 3.3 V  
CIN = CL = 1 µF (ceramic), VIN = 2.8 V, VOUT = 1.8 V, , Ta = 250C  
CIN = CL = 1 µF (ceramic), VIN = 3.5 V, VOUT = 2.5 V, , Ta = 250C  
CIN = CL = 1 µF (ceramic), VIN = 4.3 V, VOUT = 3.3 V, , Ta = 250C  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
8
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(3) Dropout Voltage vs. Output Current  
Topr = 25 0C  
CIN = CL = 1 µF (ceramic), VOUT = 1.2 V, Ta = 250C  
CIN = CL = 1 µF (ceramic), VIN = 2.8 V, VOUT = 1.8 V, , Ta = 250C  
CIN = CL = 1 µF (ceramic), VIN = 3.5 V, VOUT = 2.5 V, , Ta = 250C  
CIN = CL = 1 µF (ceramic), VIN = 4.3 V, VOUT = 3.3 V, , Ta = 250C  
(4) Supply Current vs. Input Voltage  
CIN = CL = 1 µF (ceramic), VOUT = 1.2 V  
CIN = CL = 1 µF (ceramic), VIN = 2.8 V, VOUT = 1.8 V  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
9
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(4) Supply Current vs. Input Voltage (Continue)  
CIN = CL = 1 µF (ceramic), VIN = 3.5 V, VOUT = 2.5 V  
CIN = CL = 1 µF (ceramic), VIN = 4.3 V, VOUT = 3.3 V,  
(5) Output Voltage vs. Ambient temperature  
CIN = CL = 1 µF (ceramic), VOUT = 1.2 V  
CIN = CL = 1 µF (ceramic), VIN = 2.8 V, VOUT = 1.8 V  
CIN = CL = 1 µF (ceramic), VIN = 3.5 V, VOUT = 2.5 V  
CIN = CL = 1 µF (ceramic), VIN = 4.3 V, VOUT = 3.3 V,  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
10  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(6) Supply Current vs. Ambient Temperature  
(7) CE Threshold Voltage vs. Ambient Temperature  
CIN = CL = 1 µF (ceramic), VIN = VOUT +1.0 V  
CIN = CL = 1 µF (ceramic)  
(8) Input Voltage Rising Response Time  
CIN = CL = 1 µF (ceramic), tR = 5 µs, Ta = 250C, VOUT = 1.2 V, VIN = VCE = 0 → 2.2 V  
CIN = CL = 1 µF (ceramic), tR = 5 µs, Ta = 250C, VOUT = 1.8 V, VIN = VCE = 0 → 2.8 V  
CIN = CL = 1 µF (ceramic), tR = 5 µs, Ta = 250C, VOUT = 2.5 V, VIN = VCE = 0 → 3.5 V  
CIN = CL = 1 µF (ceramic), tR = 5 µs, Ta = 250C, VOUT = 3.3 V, VIN = VCE = 0 → 4.3 V  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
11  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(9) Input Voltage Transient Response  
CIN = CL = 1 µF (ceramic), tR = tF = 5 µs, Ta = 250C, VOUT = 1.2 V, VIN = 2.2 V ↔ 3.2 V  
CIN = CL = 1 µF (ceramic), tR = tF = 5 µs, Ta = 250C, VOUT = 2.5 V, VIN = 3.5 V ↔ 4.5 V  
(10) Load Transient Response  
CIN = CL = 1 µF (ceramic), tR = tF = 5 µs, Ta = 250C, VOUT = 1.8 V, VIN = 2.8 V ↔ 3.8 V  
CIN = CL = 1 µF (ceramic), tR = tF = 5 µs, Ta = 250C, VOUT = 3.3 V, VIN = 4.3 V ↔ 5.3 V  
CIN = CL = 1 µF (ceramic), tR = tF = 0.5 µs, Ta = 250C, VOUT = 1.2 V, VIN = 2.2 V,  
IOUT = 50 mA ↔ 100 mA  
CIN = CL = 1 µF (ceramic), tR = tF = 0.5 µs, Ta = 250C, VOUT = 1.2 V, VIN = 2.2 V,  
IOUT = 0.1 mA ↔ 200 mA  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
12  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
TYPICAL PERFORMANCE CHARACTERISTICS (Continued)  
(10) Load Transient Response (Continued)  
CIN = CL = 1 µF (ceramic), tR = tF = 0.5 µs, Ta = 250C, VOUT = 1.8 V, VIN = 2.8 V,  
CIN = CL = 1 µF (ceramic), tR = tF = 0.5 µs, Ta = 250C, VOUT = 1.8 V, VIN = 2.8 V,  
IOUT = 50 mA ↔ 100 mA  
IOUT = 0.1 mA ↔ 200 mA  
CIN = CL = 1 µF (ceramic), tR = tF = 0.5 µs, Ta = 250C, VOUT = 2.5 V, VIN = 3.5 V,  
IOUT = 50 mA ↔ 100 mA  
CIN = CL = 1 µF (ceramic), tR = tF = 0.5 µs, Ta = 250C, VOUT = 2.5 V, VIN = 3.5 V,  
IOUT = 0.1 mA ↔ 200 mA  
CIN = CL = 1 µF (ceramic), tR = tF = 0.5 µs, Ta = 250C, VOUT = 3.3 V, VIN = 4.3 V,  
IOUT = 0.1 mA ↔ 200 mA  
CIN = CL = 1 µF (ceramic), tR = tF = 0.5 µs, Ta = 250C, VOUT = 3.3 V, VIN = 4.3 V,  
IOUT = 0.1 mA ↔ 200 mA  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
13  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
(11) CE Voltage Rising Response Time  
CIN = CL = 1 µF (ceramic), tR = 5 µs, Ta = 250C, VOUT = 1.2 V, VIN = 2.2 V, VCE = 0 → 2.2 V  
CIN = CL = 1 µF (ceramic), tR = 5 µs, Ta = 250C, VOUT = 1.8 V, VIN = 2.8 V, VCE = 0 → 2.8 V  
CIN = CL = 1 µF (ceramic), tR = 5 µs, Ta = 250C, VOUT = 2,5 V, VIN = 3.5 V, VCE = 0 → 3.5 V  
CIN = CL = 1 µF (ceramic), tR = 5 µs, Ta = 250C, VOUT = 3.3 V, VIN = 4.3 V, VCE = 0 → 4.3 V  
(12) Power Supply Rejection Ratio  
CIN = CL = 1 µF (ceramic), Ta = 250C, VOUT = 1.2 V, VIN = 3.0 V + 0.5 Vp-pAC  
CIN = CL = 1 µF (ceramic), Ta = 250C, VOUT = 1.8 V, VIN = 3.0 V + 0.5 Vp-pAC  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
14  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
(12) Power Supply Rejection Ratio (Continue)  
CIN = CL = 1 µF (ceramic), Ta = 250C, VOUT = 2.5 V, VIN = 3.5 V + 0.5 Vp-pAC  
CIN = CL = 1 µF (ceramic), Ta = 250C, VOUT = 3.3 V, VIN = 4.3 V + 0.5 Vp-pAC  
(13) Inrush Current Response  
CIN = CL = 1 µF (ceramic), tR = 5 µs, Ta = 250C, VOUT = 1.2 V, VIN = 2.2 V, VCE = 0 → 2.2 V  
CIN = CL = 1 µF (ceramic), tR = 5 µs, Ta = 250C, VOUT = 1.8 V, VIN = 2.8 V, VCE = 0 → 2.8 V  
CIN = CL = 1 µF (ceramic), tR = 5 µs, Ta = 250C, VOUT = 2.5 V, VIN = 3.5 V, VCE = 0 → 3.5 V  
CIN = CL = 1 µF (ceramic), tR = 5 µs, Ta = 250C, VOUT = 3.3 V, VIN = 4.3 V, VCE = 0 → 4.3 V  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
15  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
(14) Output Noise Density  
CIN = CL = 1 µF (ceramic), Ta = 250C, VOUT = 1.2 V, VIN = 2.2 V  
CIN = CL = 1 µF (ceramic), Ta = 250C, VOUT = 1.8 V, VIN = 2.8 V  
CIN = CL = 1 µF (ceramic), Ta = 250C, VOUT = 2.5 V, VIN = 3.5 V  
CIN = CL = 1 µF (ceramic), Ta = 250C, VOUT = 3.3 V, VIN = 4.3 V  
ORDERING INFORMATION  
IXD1233ÅÇÉÑÖÜ-á  
DESIGNATOR  
DESCRIPTION  
Type of Regulator  
Output Voltage1)  
SYMBOL  
H
DESCRIPTION  
Å
CE Pull-down, Current Limiter, CL Auto Discharge, Inrush Current Prevention  
Output Voltage Range: 0.9 V～6.0 V, e.g. 2.6 V - Ç = 2, É = 6  
ÇÉ  
12 - 36  
0.10 V increments, Accuracy: ±1%, (VOUT ≥ 2 V) or ± 0.02 V (VOUT < 2 V),  
e.g. 2.60 V - Ç = 2, É = 6, Ñ = 1  
1
Ñ
Output Voltage Accuracy  
0.05 V increments, Accuracy: ±1%, (VOUT ≥ 2.05 V) or ± 0.02 V (VOUT  
2.05 V), e.g. 2.65 V - Ç = 2, É = 6, Ñ = B  
<
B
MR-G  
NR-G  
GR-G  
SOT-25 (3000/Reel)  
SSOT-24 (3000/Reel)  
USP-4 (3000/Reel)  
Packages  
(Order Limit)  
ÖÜ-á(*4)  
NOTE:  
The “-G” suffix denotes Halogen and Antimony free as well as being fully RoHS compliant.  
1) Standard output voltages are shown in the table below. Other output voltages as well as other combinations of IC functions available  
by request. Contact IXYS Sales representative for more information.  
STANDARD VOLTAGES  
PACKAGE  
VOUT, V  
USP-4  
SSOT-24  
SOT-25  
1.20  
1.50  
1.80  
2.80  
3.30  
IXD1233H121GR-G  
IXD1233H151GR-G  
IXD1233H181GR-G  
IXD1233H281GR-G  
IXD1233H331GR-G  
IXD1233H121NR-G  
IXD1233H151NR-G  
IXD1233H181NR-G  
IXD1233H281NR-G  
IXD1233H331NR-G  
IXD1233H121MR-G  
IXD1233H151MR-G  
IXD1233H181MR-G  
IXD1233H281MR-G  
IXD1233H331MR-G  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
16  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
PACKAGE DRAWING AND DIMENSIONS  
SOT-25, Units: mm  
SSOT-24 Units: mm  
USP-4, Units: mm  
USP-4 Reference Pattern Layout, Units: mm  
USP-4 Reference Metal Mask Design, Units: mm  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
17  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
PACKAGE POWER DISSIPATION  
SOT-25 Power Dissipation  
The power dissipation varies with the mount board conditions.  
Please use this data as a reference only.  
1. Measurement Conditions:  
Condition:  
Ambient:  
Soldering:  
Board:  
Mount on a board  
Natural convection  
Lead (Pb) free  
Dimensions 40×40 mm (1600 mm2 in one side)  
Copper (Cu) traces occupy 50% of the board area  
on top and bottom layers  
Package heat sink tied to the copper traces.  
(Board of SOT-26 is used)  
Glass Epoxy (FR-4)  
Material:  
Thickness:  
Through-hole:  
1.6 mm  
4 x 0.8 Diameter  
2. Power Dissipation vs. Ambient Temperature  
Board Mount (Tjmax = 125 0C)  
Ambient  
Power Dissipation  
Pd, mW  
Thermal Resistance,  
0C/W  
Temperature, 0C  
25  
85  
600  
240  
166.67  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
18  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
PACKAGE POWER DISSIPATION (CONTINUED)  
SSOT-24 Power Dissipation  
The power dissipation varies with the mount board conditions.  
Please use this data as a reference only.  
1. Measurement Conditions:  
Condition:  
Ambient:  
Soldering:  
Board:  
Mount on a board  
Natural convection  
Lead (Pb) free  
Dimensions 40×40 mm (1600 mm2 in one side)  
Copper (Cu) traces occupy 50% of the board area  
on top and bottom layers  
Package heat sink tied to the copper traces.  
(Board of SOT-26 is used)  
Glass Epoxy (FR-4)  
Material:  
Thickness:  
Through-hole:  
1.6 mm  
4 x 0.8 Diameter  
2. Power Dissipation vs. Ambient Temperature  
Board Mount (Tjmax = 125 0C)  
Ambient  
Power Dissipation  
Pd, mW  
Thermal Resistance,  
0C/W  
Temperature, 0C  
25  
85  
500  
200  
200.00  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
19  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
PACKAGE POWER DISSIPATION (CONTINUED)  
USP-4 Power Dissipation  
The power dissipation varies with the mount board conditions.  
Please use this data as a reference only.  
1. Measurement Conditions:  
Condition:  
Ambient:  
Soldering:  
Board:  
Mount on a board  
Natural convection  
Lead (Pb) free  
Dimensions 40×40 mm (1600 mm2 in one side)  
Copper (Cu) traces occupy 50% of the board area  
on top and bottom layers  
Package heat sink tied to the copper traces.  
(Board of SOT-26 is used)  
Glass Epoxy (FR-4)  
Material:  
Thickness:  
Through-hole:  
1.6 mm  
4 x 0.8 Diameter  
2. Power Dissipation vs. Ambient Temperature  
Board Mount (Tjmax = 125 0C)  
Ambient  
Power Dissipation  
Pd, mW  
Thermal Resistance,  
0C/W  
Temperature, 0C  
25  
85  
1000  
400  
100.00  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
20  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
MARKING  
SOT-25  
USP-4  
SOT-25 with the under-dot marking  
Å - represents product series  
MARK  
1
PRODUCT SERIES  
IXD1233xxxxx-G  
Ç - represents type of regulator  
MARK  
PRODUCT SERIES  
VOUT INCREMENTS  
0.1 V  
0.05 V  
K
M
IXD1233Hxxxx-G  
É - represents output voltage  
MARK  
OUTPUT  
VOLTAGE, V  
OUTPUT  
VOLTAGE, V  
MARK  
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
1.2  
1.25  
1.35  
1.45  
1.55  
1.65  
1.75  
1.85  
1.95  
2.05  
2.15  
2.25  
2.35  
2.45  
2.55  
2.65  
F
H
K
L
M
N
P
R
S
T
U
V
X
Y
Z
2.7  
2.8  
2.9  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
2.75  
2.85  
2.95  
3.05  
3.15  
3.25  
3.35  
3.45  
3.55  
1.3  
1.4  
1.5  
1.6  
1.7  
1.8  
1.9  
2.0  
2.1  
2.2  
2.3  
2.4  
2.5  
2.6  
ÑÖ - represents production lot number  
01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order, (G, I, J, O, Q, W excluded)  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
21  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
MARKING (Continue)  
SSOT-24 (With an orientation bar at the top)  
Å - represents product series and output voltage  
MARK  
OUTPUT VOLTAGE, V  
1.2 – 2.0  
PRODUCT SERIES  
A
B
C
D
E
F
IXD1233H121xx-G - IXD1233H201xx-G  
IXD1233H211xx-G - IXD1233H291xx-G  
IXD1233H301xx-G - IXD1233H361xx-G  
IXD1233H12Bxx-G - IXD1233H20Bxx-G  
IXD1233H21Bxx-G - IXD1233H29Bxx-G  
IXD1233H30Bxx-G - IXD1233H35Bxx-G  
2.1 – 2.9  
3.0 – 3.6  
1.25 – 2.05  
2.15 – 2.95  
3.05 – 3.55  
Ç - represents output voltage  
MARK  
OUTPUT VOLTAGE, V  
1
2
3
4
5
6
7
8
9
1.2  
1.3  
1.4  
1.5  
1.6  
1.7  
1.8  
1.9  
2.0  
2.1  
2.2  
2.3  
2.4  
2.5  
2.6  
2.7  
2.8  
2.9  
3.0  
3.1  
3.2  
3.3  
3.4  
3.5  
3.6  
1.25  
1.35  
1.45  
1.55  
1.65  
1.75  
1.85  
2.85  
2.95  
1.95  
3.05  
3.15  
3.25  
3.35  
3.45  
3.55  
2.05  
2.15  
2.25  
2.35  
2.45  
2.55  
2.65  
2.75  
ÉÑ - represents production lot number  
01～09, 0A～0Z, 11～9Z, A1～A9, AA～AZ, B1～ZZ in order. (G, I, J, O, Q, W excluded)  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
22  
Doc. No. IXD1233_DS, Rev. N0  
IXD1233  
Warranty and Use  
IXYS CORP. MAKES NO WARRANTY, REPRESENTATION OR GUARANTEE, EXPRESS OR IMPLIED, REGARDING THE SUITABILITY OF ITS PRODUCTS FOR ANY  
PARTICULAR PURPOSE, NOR THAT THE USE OF ITS PRODUCTS WILL NOT INFRINGE ITS INTELLECTUAL PROPERTY RIGHTS OR THE RIGHTS OF THIRD  
PARTIES WITH RESPECT TO ANY PARTICULAR USE OR APPLICATION AND SPECIFICALLY DISCLAIMS ANY AND ALL LIABILITY ARISING OUT OF ANY SUCH  
USE OR APPLICATION, INCLUDING BUT NOT LIMITED TO, CONSEQUENTIAL OR INCIDENTAL DAMAGES.  
IXYS Corp. products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended  
to support or sustain life, or for any other application in which the failure of the IXYS Corp. product could create a situation where personal injury or death may occur.  
IXYS Corp. reserves the right to make changes to or discontinue any product or service described herein without notice. Products with data sheets labeled "Advance  
Information" or "Preliminary" and other products described herein may not be in production or offered for sale.  
IXYS Corp. advises customers to obtain the current version of the relevant product information before placing orders. Circuit diagrams illustrate typical semiconductor  
applications and may not be complete.  
IXYS Corp.  
1590 Buckeye Dr.  
Milpitas, CA 95035-7418  
Phone: 408. 457.9000  
Fax: 408. 496.0222  
Document No:IXD1233_DS  
Revision:  
N0  
http://www.ixys.com  
Issue date:  
2/12/2014  
© 2014 IXYS Corp.  
Characteristics subject to change without notice  
23  
Doc. No. IXD1233_DS, Rev. N0  
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