ꢀ Ab so lu te Ma xim u m Ra tin gs
(Ta=25°C)
Red
Yellow-Green
Green
Units
Item
Symbol
BR
57.5
25
PY
70
25
60
4
PG
70
25
60
4
mW
mA
mA
V
Pd
Power Dissipation
Forward Current
F
I
60
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
FM
I
4
R
V
°C
-30 to +85
-40 to +100
Topr
Tstg
°C
mA/°C
0.36 (DC) 0.86 (Pulse)
F
∆I
FM
* Ta=25°C, I applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.
ꢀ Ta p in g Sp ecifica tio n s
(0.2)
4+0.1
(1.1)
ꢀ Op er a tio n Cu r r en t Der a tin g Ch a r t (DC)
φ 1.5+0.1
0
Center Hole
Quantity on tape:
4000 pieces
per reel
2+0.05
(φ 0.6)
Center Hole
(0.8)
2+0.5
φ
21+0.8
4+0.1
Direction to pull
φ
13+0.2
BR, PY, PG,
9+0.3
+
180
0
11.4+1
φ
3
ꢀ Pr eca u tio n s
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
°C
Operation Heating
240
ꢀ Sp a tia l Distr ib u tio n
Temperature
Cooling:
150
120
rise: 5°C/sec.
—5°C/sec.
Pre-heating
0
60 to 120 sec.
5 sec. max
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PG__1113F-0301
Sta n ley Electr ic Sa les o f Am er ica , In c.
2660 Ba rra nc a Pa rkwa y, Irvine , CA 92606 • Te l: 800-LED-LCD1 (533-5231) • Fa x: 949-222-0555
We b site : www.sta nle y-e le c tric .c om
