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IXFT12N100

型号:

IXFT12N100

描述:

N沟道增强型高dv / dt ,低反向恢复时间trr , HDMOSTM家庭[ N-Channel Enhancement Mode High dv/dt, Low trr, HDMOSTM Family ]

品牌:

IXYS[ IXYS CORPORATION ]

页数:

4 页

PDF大小:

557 K

HiPerFETTM  
VDSS  
ID25  
RDS(on)  
IXFT 10 N100 1000 V 10 A 1.20 Ω  
Power MOSFETs  
IXFT12 N100 1000 V 12 A 1.05 Ω  
N-ChannelEnhancementMode  
Highdv/dt, Lowtrr, HDMOSTM Family  
trr 250 ns  
Preliminary data sheet  
TO-268 Case Style  
Symbol  
TestConditions  
Maximum Ratings  
VDSS  
VDGR  
T
= 25°C to 150°C  
1000  
1000  
V
V
TJJ = 25°C to 150°C; RGS = 1 MΩ  
G
S
(TAB)  
VGS  
Continuous  
Transient  
20  
30  
V
V
VGSM  
ID25  
IDM  
IAR  
TC = 25°C  
10N100  
12N100  
10N100  
12N100  
10N100  
12N100  
10  
12  
40  
48  
10  
12  
A
A
A
A
A
A
TC = 25°C, pulse width limited by TJM  
TC = 25°C  
G = Gate,  
TAB = Drain  
S = Source,  
EAR  
TC = 25°C  
30  
mJ  
5
dv/dt  
IS IDM, di/dt 100 A/µs, VDD VDSS  
TJ 150°C, RG = 2 Ω  
,
V/ns  
Features  
z
International standard package  
PD  
TJ  
TC = 25°C  
300  
W
z
Low RDS (on) HDMOSTM process  
-55 ... +150  
°C  
°C  
°C  
z
Rugged polysilicon gate cell  
structure  
Unclamped Inductive Switching (UIS)  
rated  
Low package inductance  
- easy to drive and to protect  
Fast intrinsic Rectifier  
TJM  
150  
z
Tstg  
-55 ... +150  
TL  
1.6 mm (0.062 in.) from case for 10 s  
Mounting torque  
300  
°C  
z
z
Md  
1.13/10 Nm/lb.in.  
TO-268 = 6 g  
Weight  
Applications  
z
DC-DC converters  
z
Synchronous rectification  
Symbol  
TestConditions  
Characteristic Values  
z
Battery chargers  
(TJ = 25°C, unless otherwise specified)  
z
min. typ. max.  
Switched-mode and resonant-mode  
power supplies  
z
VDSS  
VGS(th)  
VGS = 0 V, ID = 3 mA  
VDS = VGS, ID = 4 mA  
1000  
2.0  
V
V
DC choppers  
z
4.5  
AC motor control  
z
Temperature and lighting controls  
IGSS  
IDSS  
VGS = 20 VDC, VDS = 0  
100 nA  
z
Low voltage relays  
VDS = 0.8 • VDSS  
VGS = 0 V  
T = 25°C  
TJJ = 125°C  
250 µA  
Advantages  
1
mA  
z
Surface mountable, high power  
RDS(on)  
VGS = 10 V, ID = 0.5 • ID25  
10N100  
12N100  
1.20  
1.05  
package  
z
Space savings  
High power density  
Pulse test, t 300 µs, duty cycle d 2 %  
z
© 2004 IXYS All rights reserved  
DS98509A(01/04)  
IXFT 10N100 IXFT 12N100  
Symbol  
gfs  
TestConditions  
Characteristic Values  
TO-268 Outline  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
VDS = 10 V; ID = 0.5 • ID25, pulse test  
VGS = 0 V, VDS = 25 V, f = 1 MHz  
6
10  
S
Ciss  
Coss  
Crss  
4000  
310  
70  
pF  
pF  
pF  
td(on)  
tr  
td(off)  
tf  
21  
33  
62 100  
32 50  
50  
50  
ns  
ns  
ns  
ns  
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25  
RG = 2 (External),  
Qg(on)  
Qgs  
Qgd  
122 155  
nC  
nC  
nC  
VGS = 10 V, VDS = 0.5 • VDSS, ID = 0.5 • ID25  
30  
50  
45  
80  
RthJC  
0.42 K/W  
Source-DrainDiode  
Characteristic Values  
(TJ = 25°C, unless otherwise specified)  
min. typ. max.  
Symbol  
IS  
TestConditions  
VGS = 0 V  
10N100  
12N100  
10  
12  
A
A
ISM  
Repetitive;  
10N100  
12N100  
40  
48  
A
A
pulse width limited by TJM  
VSD  
IF = I , VGS = 0 V,  
1.5  
V
PulsSe test, t 300 µs, duty cycle d 2 %  
trr  
T = 25°C  
250 ns  
400 ns  
TJJ = 125°C  
I = IS  
-Fdi/dt = 100 A/µs,  
QRM  
IRM  
T = 25°C  
1
2
µC  
µC  
TJJ = 125°C  
VR = 100 V  
T = 25°C  
TJJ = 125°C  
10  
15  
A
A
Min Recommended Footprint  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered byoneormore  
ofthefollowingU.S.patents:  
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1  
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343 6,583,505  
IXFT 10N100 IXFT 12N100  
Fig. 1. OutputCharacteristics  
Fig. 2. Input Admittance  
20  
18  
16  
14  
12  
10  
8
20  
TJ = 25°C  
V
GS = 10V  
18  
16  
14  
12  
10  
8
7V  
6V  
5V  
TJ = 25°C  
6
6
4
4
2
2
0
0
0
5
10  
15  
20  
0
1
2
3
4
5
6
7
8
9
10  
VDS - Volts  
VGS - Volts  
Fig. 3. RDS(on) vs. DrainCurrent  
Fig.4.TemperatureDependence  
of Drain to Source Resistance  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
2.50  
2.25  
2.00  
1.75  
1.50  
1.25  
1.00  
0.75  
0.50  
TJ = 25°C  
VGS = 10V  
I
D = 6A  
V
GS = 15V  
0
5
10  
15  
20  
25  
-50 -25  
0
25 50 75 100 125 150  
TJ - Degrees C  
ID - Amperes  
Fig. 5. Drain vs. Case Temperature  
Fig.6.TemperatureDependenceof  
BreakdownandThresholdVoltage  
20  
18  
16  
14  
12  
10  
8
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
VGS(th)  
BVDSS  
12N100  
10N100  
6
4
2
0
-50 -25  
0
25 50 75 100 125 150  
TC - Degrees C  
-50 -25  
0
25 50 75 100 125 150  
TJ - Degrees C  
© 2004 IXYS All rights reserved  
IXFT 10N100 IXFT 12N100  
Fig. 7. GateChargeCharacteristicCurve  
10  
9
8
7
6
5
4
3
2
1
0
VDS = 500V  
ID = 6A  
IG = 10mA  
0
25  
50  
75  
100  
125  
150  
Gate Charge - nCoulombs  
Fig. 8. CapacitanceCurves  
Fig. 9. Source Current vs. Source  
to Drain Voltage  
4500  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
20  
18  
16  
14  
12  
10  
8
Ciss  
f = 1MHz  
VDS = 25V  
TJ = 125°C  
6
TJ = 25°C  
4
Coss  
Crss  
2
0
0
0
5
10  
15  
20  
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4  
VDS - Volts  
VSD - Volts  
Fig.10.  
TransientThermalImpedance  
1
0.1  
D=0.5  
D=0.2  
D=0.1  
D=0.05  
D=0.02  
D=0.01  
0.01  
0.001  
Single Pulse  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
Time - Seconds  
IXYS reserves the right to change limits, test conditions, and dimensions.  
IXYSMOSFETs andIGBTsarecovered byoneormore  
ofthefollowingU.S.patents:  
4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1  
4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343 6,583,505  
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