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9TMF222WR091FKPF5

型号：

9TMF222WR091FKPF5

品牌：

YAGEO[ YAGEO CORPORATION ]

页数：

9 页

PDF大小：

306 K

下载PDF手册
DATA SHEET  
CURRENT SENSOR - LOW TCR  
PR/PF-Power enhancement series (Pb Free)  
5%, 1%  
sizes 1206/2010/2512  
Product specification  
2
9
SERIES  
1206/2010/2512 (Pb Free)  
PR/PF-Power enhancement  
Chip Resistor Surface Mount  
SCOPE  
This specification describes PR/PF-Power enhancement series current sensor - low TCR with lead-free terminations.  
ORDERING INFORMATION  
Part number is identified by the series, size, tolerance, packing type, temperature coefficient, taping reel and  
resistance value.  
PHYCOMP ORDERING CODE  
12NC CODE  
2350 / 2322  
XXX XXXXX L  
( )  
4
(1)  
(2)  
(3)  
NOTE  
EMBOSSED (2) PAPER (units) (2)  
TAPE ON REEL TAPE ON REEL  
START TOL. RESISTANCE  
IN (1) (%) RANGE  
a. The “L” at the end of the code is only  
for ordering. On the reel label, the  
standard CTC will be mentioned an  
additional stamp “LFP”= lead free  
production.  
SIZE TYPE  
4,000  
4,000  
PR series  
2010 PR2010  
PR2010  
2322 ±5% 0.002 to 0.006 Ω 760 65xxx  
2322 ±1% 0.002 to 0.006 Ω 761 13xxx  
2322 ±5% 0.001 to 0.005 Ω 762 10xxx  
2322 ±1% 0.001 to 0.005 Ω 763 10xxx  
PF series  
-
-
-
-
b. Products with lead in terminations fulfil  
the same requirements as mentioned in  
this datasheet.  
2512 MPRC221  
MPRC221  
c. Products with lead in terminations will  
be phased out in the coming months  
(before July 1st, 2006).  
1206 PF1206  
PF1206  
2350 ±5% 0.006 to 1 Ω  
2350 ±1% 0.006 to 1 Ω  
2322 ±5% 0.007 to 1 Ω  
2322 ±1% 0.007 to 1 Ω  
2322 ±5% 0.006 to 1 Ω  
2322 ±1% 0.006 to 1 Ω  
-
510 27xxx  
-
510 28xxx  
2010 PF2010  
PF2010  
760 66xxx  
760 14xxx  
764 10xxx  
764 30xxx  
-
-
-
-
2512 PF2512  
PF2512  
Last digit of 12NC  
(1) The resistors have a 12-digit  
ordering code starting with  
2350/2322.  
Resistance decade (3)  
Last digit  
0.001 to 0.0976  
X
0
7
8
(2) The subsequent 5 digits  
indicate the resistor  
0.1 to 0.976  
X
1 to 9.76  
X
tolerance and packaging.  
Example: 0.02  
X
=
=
=
200  
307  
108  
(3) The remaining 3 digits  
represent the resistance  
value with the last digit  
indicating the multiplier as  
shown in the table of “Last  
digit of 12NC”.  
0.3  
X
1
X
ORDERING EXAMPLE  
The ordering code of a MPRC221  
resistor with 2W power rating,  
value 0.005 X with ±5%  
tolerance, supplied in tape of  
4,000 units per reel is:  
(4) “L” means lead-free  
(a)  
terminations  
.
232276210050L.  
www.yageo.com  
Oct 03, 2005 V.1  
Product specification  
3
9
SERIES  
1206/2010/2512 (Pb Free)  
PR/PF-Power enhancement  
Chip Resistor Surface Mount  
CTC CODE  
PR/PF XXXX X X X XX XXXX L  
ORDERING EXAMPLE  
( )  
1
( ) ( ) ( ) ( )( )  
5 6  
( )  
7
( )  
8
2
3
4
The ordering code of a PR2512 chip resistor with  
2W power rating, value 0.005 X with ±1% tolerance,  
supplied in 7-inch tape reel is:  
( )  
1 SIZE  
1206  
2010  
2512  
PR2512FKF7W0R005L.  
NOTE  
a. The “L” at the end of the code is only for ordering. On the reel  
label, the standard CTC will be mentioned an additional stamp  
“LFP”= lead free production.  
( )  
2 TOLERANCE  
F = ±1%  
J = ±5%  
b. Products with lead in terminations fulfil the same requirements  
as mentioned in this datasheet.  
( )  
3 PACKAGING TYPE  
c. Products with lead in terminations will be phased out in the  
coming months (before July 1st, 2006).  
R = Paper taping reel  
d. Standard power for size 1206 is 1/4 Watt, size 2010 is 1/2 Watt,  
and size 2512 is 1 Watt.  
K = Embossed taping reel  
( )  
4 TEMPERATURE COEFFICIENT OF RESISTANCE  
F = ±100 ppm/°C  
G = ±200 ppm/°C  
( )  
5 TAPING REEL  
7 = 7 inch dia. Reel  
( )  
6 POWER RATING  
W = 2 x standard power (d)  
( )  
7 RESISTANCE VALUE  
PR series: 0R001, 0R002, 0R003, 0R004, 0R005.  
(0R0015 also available on request)  
PF series: 0R006, 0R056, 0R56, 1R  
(8) RESISTOR TERMINATIONS  
L = Lead free terminations (matte tin) (a)  
www.yageo.com  
Oct 03, 2005 V.1  
Product specification  
4
9
SERIES  
1206/2010/2512 (Pb Free)  
PR/PF-Power enhancement  
Chip Resistor Surface Mount  
MARKING  
1 m ≤ R < 20 m  
Ω
Ω
4 digits: 10 mX ≤ R, E-24 series; and R = 1/2/3/4/5/6/7/8/9 mΩ  
ynsc016  
The “R” is used as a decimal point; the other 3 digits are significant.  
Fig. 1 Value = 5 mΩ  
20 m ≤ R ≤ 1,000 m  
Ω
Ω
E-24 series: 4 digits  
820  
YNSC051  
The “R” is used as a decimal point; the other 3 digits are significant.  
Fig. 2 R820 = 820 mΩ  
For marking codes, please see EIA-marking code rules in data sheet “Chip resistors marking”.  
CONSTRUCTION  
The resistors are constructed using outstanding TCR level material, which makes Yageo PR/PF resistors  
excellent for current sensing application in battery charger circuit & DC-DC converter.  
The composition of the resistive material is adjusted to give the approximate required resistance and is  
covered with a protective coating, which printed with the resistance value.  
Finally, the two external terminations (matte Tin) are added. See fig. 3.  
OUTLINES  
For dimension see Table 1 & 2  
overcoat  
metal substrate  
end termination  
resistive layer  
inner electrode  
H
H
protective coat  
I1  
termination  
ceramic substrate  
I
2
protective coat  
marking  
overcoat  
I2  
I
1
end termination  
W
W
R005  
SCR020  
YNSC056  
L
L
Note: construction will be  
adjusted to resistance value  
(only for PF series).  
PR series  
PF series  
Fig. 3 Chip resistor outlines  
www.yageo.com  
Oct 03, 2005 V.1  
Product specification  
5
9
SERIES  
1206/2010/2512 (Pb Free)  
PR/PF-Power enhancement  
Chip Resistor Surface Mount  
DIMENSION  
Table 1 Chip resistor type and relevant physical dimensions for “PR-Power enhancement series”; see fig. 3  
TYPE  
RESISTANCE RANGE  
0.001 to 0.006 Ω  
0.001 to 0.002 Ω  
0.003 to 0.005 Ω  
L (mm)  
W (mm)  
H (mm)  
I1 (mm)  
I2 (mm)  
0.50 ±0.25  
1.20 ±0.20  
0.60 ±0.20  
PR2010  
5.10 ±0.25  
6.40 ±0.20  
6.40 ±0.20  
2.54 ±0.25  
3.20 ±0.20  
3.20 ±0.20  
0.60 ±0.25  
0.75 ±0.15  
0.55 ±0.15  
0.50 ±0.25  
1.20 ±0.20  
0.60 ±0.20  
PR2512  
Table 2 Chip resistor type and relevant physical dimensions for “PF-Power enhancement series” see fig. 3  
TYPE  
RESISTANCE RANGE  
0.006 to 0.014 Ω  
0.015 to 1 Ω  
L (mm)  
W (mm)  
H (mm)  
I1 (mm)  
I2 (mm)  
0.35 ±0.25  
0.75 ±0.25  
0.45 ±0.25  
1.55 ±0.25  
1.75 ±0.25  
0.60 ±0.25  
3.20 ±0.25  
3.20 ±0.25  
5.10 ±0.25  
5.10 ±0.25  
6.50 ±0.25  
6.50 ±0.25  
1.60 ±0.25  
1.60 ±0.25  
2.54 ±0.25  
2.54 ±0.25  
3.15 ±0.25  
3.15 ±0.25  
0.60 ±0.25  
0.60 ±0.25  
0.60 ±0.25  
0.60 ±0.25  
0.60 ±0.25  
0.60 ±0.25  
0.55 ±0.25  
0.55 ±0.25  
1.00 ±0.25  
1.00 ±0.25  
1.00 ±0.25  
1.00 ±0.25  
PF1206  
0.007 to 0.014 Ω  
0.015 to 1 Ω  
PF2010  
PF2512  
0.006 to 0.014 Ω  
0.015 to 1 Ω  
ELECTRICAL CHARACTERISTICS  
Table 3  
TYPE / RESISTANCE RANGE  
TEMPERATURE COEFFICIENT OF RESISTANCE  
2 m 2 m 7 m  
<
R <  
X
X
X
PR2010  
PR2512  
2 mΩ ≤ R < 7 mΩ  
1 mΩ ≤ R < 6 mΩ  
±200 ppm/°C  
1 m 2 m  
±100 ppm/°C  
2 m 6 m  
±100 ppm/°C  
PR series  
PF series  
≤
R
≤
< R <  
X
X
X
X
±200 ppm/°C  
PF1206  
PF2010  
PF2512  
6 mΩ ≤ R ≤ 1,000 mΩ  
7 mΩ ≤ R ≤ 1,000 mΩ  
6 mΩ ≤ R ≤ 1,000 mΩ  
±100 ppm/°C  
±100 ppm/°C  
±100 ppm/°C  
www.yageo.com  
Oct 03, 2005 V.1  
Product specification  
6
9
SERIES  
1206/2010/2512 (Pb Free)  
PR/PF-Power enhancement  
Chip Resistor Surface Mount  
FOOTPRINT AND SOLDERING PROFILES  
ENVIRONMENTAL DATA  
For material declaration information (IMDS-data) of  
the products, please see the separated info  
“Environmental data” conformed to EU RoHS.  
For recommended footprint and soldering profiles,  
please see the special data sheet “Chip resistors  
mounting”.  
PACKING STYLE AND PACKAGING QUANTITY  
Table 4 Packing style and packaging quantity  
PACKING STYLE  
REEL DIMENSION  
7" (178 mm)  
PF 1206  
4,000  
---  
PR/PF 2010  
---  
PR/PF 2512  
---  
Paper taping reel (R)  
Embossed taping reel (K)  
7" (178 mm)  
4,000  
4,000  
NOTE  
1. For Paper/PE/Embossed tape and reel specification/dimensions, please see the special data sheet “Packing” document.  
FUNCTIONAL DESCRIPTION  
OPERATINGTEMPERATURE RANGE  
MRA632  
P
max  
Range: –55°C to +155°C  
(%P  
)
rated  
POWER RATING  
100  
50  
0
Each type rated power at 70°C:  
PF1206=1/2 W; PR/PF2010=1 W;  
PR/PF2512=2 W.  
RATED VOLTAGE  
−55  
0
50 70 100  
T
155  
(°C)  
The DC or AC (rms) continuous working voltage  
corresponding to the rated power is determined by  
the following formula:  
amb  
Fig. 4 Maximum dissipation (P ) in percentage of rated power  
max  
as a function of the operating ambient temperature (T  
)
amb  
(
)
V = √ P X R  
Where  
(
)
( )  
V = Continuous rated DC or AC rms working voltage V  
(
)
P = Rated power W  
( )  
R = Resistance value X  
www.yageo.com  
Oct 03, 2005 V.1  
Product specification  
7
9
SERIES  
1206/2010/2512 (Pb Free)  
PR/PF-Power enhancement  
Chip Resistor Surface Mount  
TESTS AND REQUIREMENTS  
Table 5 Test condition, procedure and requirements  
TEST  
TEST METHOD  
PROCEDURE  
REQUIREMENTS  
MIL-STD-202F-method 304;  
JIS C 5202-4.8  
Temperature  
Coefficient of  
Resistance  
(T.C.R.)  
At +25/–55 °C and +25/+125 °C  
Refer to table 3  
Formula:  
R2–R1  
T.C.R= ------------------------- ×106 (ppm/°C)  
R1(t2–t1)  
Where  
t1=+25 °C or specified room temperature  
t2=–55 °C or +125 °C test temperature  
R1=resistance at reference temperature in ohms  
R2=resistance at test temperature in ohms  
MIL-STD-202F-method 107G;  
IEC 60115-1 4.19  
Thermal Shock  
At –65 (+0/–10) °C for 2 minutes and at +125  
(+10/–0) °C for 2 minutes; 25 cycles  
±(0.5%+0.0005 Ω)  
MIL-R-55342D-Para 4.7.4  
Low  
Temperature  
Operation  
At –65 (+0/–5) °C for 1 hour; RCWV applied  
for 45 (+5/–0) minutes  
±(0.5%+0.0005 Ω)  
No visible damage  
MIL-R-55342D-Para 4.7.5;  
IEC 60115-1 4.13  
Short Time  
Overload  
2.5 × RCWV applied for 5 seconds at room  
temperature  
±(0.5%+0.0005 Ω)  
No visible damage  
MIL-STD-202F-method 210C;  
IEC 60115-1 4.18  
Resistance to  
Soldering  
Heat  
Unmounted chips; 260 ±5 °C for 10 ±1  
seconds  
±(0.5%+0.0005 Ω)  
No visible damage  
MIL-STD-202F-method 108A;  
IEC 60115-1 4.25.1  
Life  
At 70±2 °C for 1,000 hours; RCWV applied for  
1.5 hours on and 0.5 hour off  
±(1.0%+0.0005 Ω)  
MIL-STD-202F-method 208A;  
IEC 60115-1 4.17  
Solderability  
Solder bath at 245±3 °C  
Well tinned (≥95% covered)  
Dipping time: 2±0.5 seconds  
No visible damage  
JIS C 5202 7.5;  
Humidity  
1,000 hours; 40±2 °C; 93(+2/–3)% RH  
±(0.5%+0.0005 Ω)  
(steady state)  
IEC 60115-8 4.24.8  
RCWV applied for 1.5 hours on and 0.5 hour off  
www.yageo.com  
Oct 03, 2005 V.1  
Product specification  
8
9
SERIES  
1206/2010/2512 (Pb Free)  
PR/PF-Power enhancement  
Chip Resistor Surface Mount  
Table 5 Test condition, procedure and requirements (continued)  
TEST  
TEST METHOD  
EIA/IS 4.13B;  
PROCEDURE  
REQUIREMENTS  
Leaching  
Solder bath at 260±5 °C  
Dipping time: 30±1 seconds  
No visible damage  
IEC 60115-8 4.18  
MIL-STD-202F-method 106F;  
IEC 60115-1 4.24.2  
42 cycles; total 1,000 hours  
Shown as fig. 5  
±(0.5%+0.0005 Ω)  
Moisture  
Resistance  
Heat  
No visible damage  
MIL-STD-202 Method 108  
Unpowered chips at =150 °C for 1,000 hours  
±(1%+0.0005 Ω)  
High  
Temperature  
Exposure  
80 − 98%  
RH  
80 − 98%  
RH  
75  
90 − 98% RH  
90 − 98% RH  
90 − 98% RH  
temperature  
initial drying  
24 hours  
[°C]  
rate of change of temperature is unspecified,  
however, specimens shall not be subjected to  
50  
radiant heating from chamber conditioning processes  
end of final cycle;  
measurements  
as specified in 2ꢀ7  
+10 °C (+18 °F)  
−2 °C (−3ꢀ6 °F)  
25  
0
initial measurements  
as specified in 2ꢀ2  
circulation of conditioning air shall be at a  
minimum cubic rate per minute equivalent to  
10 times the volume of the chamber  
optional sub-cycle if specified  
(2ꢀ3); sub-cycle performed during  
any 5 of the first 9 cycles; humidity  
uncontrolled during sub-cycle  
temperature  
tolerance  
2 °C ( 3ꢀ6 °F)  
unless otherwise  
specified  
voltage applied as specified in 2ꢀ4  
STEP1  
STEP2 STEP3  
one cycle 24 hours; repeat as specified in 2ꢀ5  
10 15  
STEP4  
STEP5 STEP6  
STEP7  
prior to first  
cycle only  
0
5
20  
25  
HBK073  
time [h]  
Fig. 5 Moisture resistance test requirements  
www.yageo.com  
Oct 03, 2005 V.1  
Product specification  
9
9
SERIES  
1206/2010/2512 (Pb Free)  
PR/PF-Power enhancement  
Chip Resistor Surface Mount  
REVISION HISTORY  
REVISION DATE  
CHANGE NOTIFICATION DESCRIPTION  
Oct 03, 2005 -  
Aug 11, 2005 -  
Version 1  
- Ordering example revised  
Version 0  
- New datasheet for current sensor - low TCR PR/PF-Power enhancement  
series, sizes of 1206/2010/2512, 1% and 5% with lead-free terminations  
www.yageo.com  
Oct 03, 2005 V.1  
厂商 型号 描述 页数 下载

YAGEO

 		9TMF222WR010FKPF5 [ Fixed Resistor, Thin Film, 2W, 0.01ohm, 1% +/-Tol, -100,100ppm/Cel, 2612, ] 9 页

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